Abstract:
A printed circuit board includes a plurality of differential pairs arranged thereon side-by-side. Each differential pair includes two transmission lines. Each transmission line includes a plurality of sections of equal length. Every two adjacent sections in each transmission line meet at an angle, and all angles are equal. The length of each section is determined by dividing the distance between two corresponding angles of the two transmission lines of each differential pair by the cosine of half of the angle.
Abstract:
This invention discloses a display device mother substrate, a display device substrate and a manufacture method of display device substrate thereof. The display device mother substrate includes a first substrate, a second substrate, a first active area circuit and a first transmission line, wherein a first cutting line is defined between the first substrate and the second substrate. The first active area circuit is disposed on the first substrate and is electrically connected to the first transmission line. The first transmission line includes a display line portion, an end line portion and a middle line portion, wherein the display line portion is electrically connected to the first active area circuit. The middle line portion is disposed on the second substrate, wherein two ends of the middle line portion are electrically connected to the display line portion and the end line portion respectively at the first cutting line. The display device mother substrate is cut along the first cutting line to be separated into the first substrate and the second substrate, wherein the middle line portion is also separated from the display line portion and the end line portion.
Abstract:
An apparatus including a liquid crystal polymer substrate having a top surface and a bottom surface, a coplanar waveguide formed on the top surface of the liquid crystal polymer substrate, the coplanar waveguide having a 90 degree bend with a mitered edge, an inner via positioned adjacent to an inner corner of the 90 degree bend, and an outer via positioned adjacent to the mitered edge of the 90 degree bend, the inner and outer vias positioned along a first plane that is perpendicular to a second plane defined by the mitered edge.
Abstract:
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
Abstract:
A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first linear portion in a direction different from a direction of the first linear portion; and a bent portion that is a part where the first linear portion and the second linear portion are connected.
Abstract:
A wiring pattern forming method comprises: relatively moving a droplet discharging head and a substrate, each in a predetermined direction; discharging a liquid material in a form of droplet onto the substrate from a plurality of discharging nozzles formed on the droplet discharging head; forming a predetermined wiring pattern on the substrate; and forming an end portion of a wiring pattern in a tapered shape, or a bent portion of a wiring pattern in a curved shape.
Abstract:
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
Abstract:
A differential transmission line includes: a substrate; a ground conductor layer; and a first and a second signal conductor disposed in parallel to each other on the substrate. The first signal conductor and the ground conductor layer compose a first transmission line, whereas the second signal conductor and the ground conductor layer compose a second transmission line. The first transmission line and the second transmission line compose a differential transmission line. The differential transmission line includes a curved region, with a straight region being connected to each end of the curved region. In the ground conductor layer in the curved region, a plurality of slots orthogonal to a local transmission direction of signals in the curved region are formed, and the slots are connected to one another on the inner side of the curvature.
Abstract:
A capacitance-compensated differential circuit line layout structure is proposed, which is designed for use on a circuit board, such as a high-speed digital circuit board, for the layout of a pair of differential circuit lines on the high-speed digital circuit board, and which is characterized by the provision of a branched electrically-conductive pad at the bent portion of the radially-side one of the two differential circuit lines (i.e., the shorter one of the two circuit lines), for the purpose of providing the shorter one of the circuit lines with a capacitive effect that can cause a time delay to the ultra-high frequency digital signal passing therethrough, thereby eliminating the undesired effects of phase skew and signal reflection. In addition, this feature also allows the layout work of the differential pair of circuit lines to be more simplified and thus easier to implement than the prior art.
Abstract:
An arc routing system and method are disclosed, which are integrated to a PCB (printed circuit board) routing system for assisting the PCB routing system to route wires in an area of a printed circuit board with high component density. First, three neighboring points in a routing direction in the area of the printed circuit board are selected by a selecting module, wherein one of the three points is located on one side of a line extending in the routing direction and the two others are located on the other side of the line. Then, information related to the three selected points and routing information are read by a reading module. Subsequently, the center point, radius, start point and end point for an arc-shaped wire to be routed are set by a setting module. Finally, the arc-shaped wire is drawn by a drawing module. Thereby, routing efficiency is increased and electrical connection performance of printed circuit boards is improved.