公开(公告)号：US20100259337A1

公开(公告)日：2010-10-14

申请号：US12384943

申请日：2009-04-10

Applicant: Mohammad Tabatabai

Inventor： Mohammad Tabatabai

IPC: H01P3/08

CPC classification number: H01P3/026 ,  H05K1/024 ,  H05K1/0245 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09318

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract translation: 根据一个示例性实施例，用于降低介质损耗，导体损耗和插入损耗的电路板包括一对传输线。 这对传输线具有足够的厚度，以在一对传输线之间产生实质的宽边电磁耦合，其中一对传输线与电路板的接地平面充分分离，从而使接地平面的电磁耦合可以忽略不计 到实质的宽边电磁耦合。 这对传输线因此减少了穿过传输线对的信号的介质损耗，导体损耗和插入损耗。 这对传输线可以通过例如至少50.0密耳从地平面分离。

公开(公告)号：US07781680B2

公开(公告)日：2010-08-24

申请号：US11951290

申请日：2007-12-05

Applicant: Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

Inventor： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

IPC: H05K1/00

CPC classification number: H05K1/0245 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09336 ,  H05K2201/09672

Abstract: An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals.

Abstract translation: 示例性FPCB包括由第一传输线和第二传输线组成的差分对，其中布置有第一传输线的信号层，具有包括第一传输线下面的区域的空隙的接地层，以及介电层 位于信号层和接地层之间。 第二传输线布置在沿水平方向偏离第一传输线的接地层中。 FPCB可以传输高速信号。

公开(公告)号：US20100079989A1

公开(公告)日：2010-04-01

申请号：US12239759

申请日：2008-09-27

Applicant: Kuang-Chao YEH

Inventor： Kuang-Chao YEH

IPC: F21V21/00 ,  F21V7/00

CPC classification number: G02B6/0031 ,  F21K9/00 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L33/647 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/09318 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/302

Abstract: A flexible thin-type light-emitting-diode circuit substrate includes a bottom copper layer, a top copper layer, and an insulation layer which is interlined between the bottom copper layer and the top copper layer such that the bottom copper layer cannot be electrically connected with the top copper layer. The top copper layer is defined with a wiring zone, and the wiring zone is formed with a circuit pattern for electrically connecting at least one light emitting diode.

Abstract translation: 柔性薄型发光二极管电路基板包括底部铜层，顶部铜层以及在底部铜层与顶部铜层之间嵌合的绝缘层，使得底部铜层不能电连接 与顶层铜层。 顶部铜层由布线区域限定，并且布线区域形成有用于电连接至少一个发光二极管的电路图案。

公开(公告)号：US07649745B2

公开(公告)日：2010-01-19

申请号：US11557709

申请日：2006-11-08

Applicant: Pascal Meier ,  Sanjay Dabral

Inventor： Pascal Meier ,  Sanjay Dabral

IPC: H05K7/00

CPC classification number: H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

Abstract: A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract translation: 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US07598823B2

公开(公告)日：2009-10-06

申请号：US11715504

申请日：2007-03-08

Applicant: Shih-Kun Yeh

Inventor： Shih-Kun Yeh

IPC: H01P3/08

CPC classification number: H05K1/0237 ,  H01P3/081 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/0191 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/098

Abstract: A high-speed digital transmission signal line providing better dynamic resistance to be applied in an LVDS transmission system to function as an electronic line, an optical line, and a serial advanced technology attachment (SATA), comprises a conductive layer in thickness of 0.018˜0.1 mm and in width of 0.2˜0.8 mm; a first and a second insulation layers each in thickness of 0.04˜0.3 mm being respectively disposed on both sides of the conductive layer; and a ground plate.

Abstract translation: 在LVDS传输系统中提供更好的动态电阻的高速数字传输信号线作为电子线路，光线路和串行先进技术附件（SATA）起作用，其厚度为0.018〜 0.1 mm，宽度0.2〜0.8 mm; 分别设置在导电层两侧的厚度为0.04〜0.3mm的第一和第二绝缘层; 和接地板。

公开(公告)号：US20090184778A1

公开(公告)日：2009-07-23

申请号：US12354488

申请日：2009-01-15

Applicant: Kwang-Soo Park ,  Byoung-Ha Oh ,  Yong-Ho Ko

Inventor： Kwang-Soo Park ,  Byoung-Ha Oh ,  Yong-Ho Ko

IPC: H04B15/00

CPC classification number: H05K1/0216 ,  H05K1/0234 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/167 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/09318 ,  H05K2201/09327

Abstract: A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.

Abstract translation: 基板包括放置在彼此之间并且基本上彼此平行的电源平面和接地平面以及放置在电源平面和接地平面之间的至少一条信号线。 接地平面包括具有第一导电性的第一导电层。 功率平面包括具有第一导电性的第二导电层，并且功率平面或接地平面包括具有比第一导电率低的第二导电性的第三导电层。 第三导电层面对穿过电介质物质的至少一条信号线。

公开(公告)号：US20090107705A1

公开(公告)日：2009-04-30

申请号：US11924416

申请日：2007-10-25

Applicant: Moises Cases ,  Bradley D. Herrman ,  Kent B. Howieson ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham ,  Caleb J. Wesley

Inventor： Moises Cases ,  Bradley D. Herrman ,  Kent B. Howieson ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham ,  Caleb J. Wesley

IPC: H05K3/00 ,  H05K1/03

CPC classification number: H05K1/024 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T156/1013

Abstract: Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer.

Abstract translation: 降低高速数字系统噪声耦合的方法和系统。 示例性实施例包括一种方法，包括将多个高速信号迹线蚀刻到芯绝缘层上，在多个高速信号迹线的相应侧上形成沟槽，从而去除与多个高速信号迹线相邻的绝缘材料，并形成 具有剩余绝缘材料的基座，多个高速信号迹线设置在剩余绝缘材料上并耦合到剩余的绝缘材料上，将高速信号迹线上的预预处理材料耦合，去除与沟槽相邻的预浸料， 将材料与高速信号迹线对准，并且将芯层加热并压制到预浸层，以及将预浸层加热和压制到芯绝缘层。

公开(公告)号：US20090106976A1

公开(公告)日：2009-04-30

申请号：US12174810

申请日：2008-07-17

Applicant: Moises Cases ,  Bradley D. Herrman ,  Kent B. Howieson ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham ,  Caleb J. Wesley

Inventor： Moises Cases ,  Bradley D. Herrman ,  Kent B. Howieson ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham ,  Caleb J. Wesley

IPC: H05K3/02 ,  B29C53/00

CPC classification number: H05K1/024 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T156/1013

Abstract: Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer.

Abstract translation: 降低高速数字系统噪声耦合的方法和系统。 示例性实施例包括一种方法，包括将多个高速信号迹线蚀刻到芯绝缘层上，在多个高速信号迹线的相应侧上形成沟槽，从而去除与多个高速信号迹线相邻的绝缘材料，并形成 具有剩余绝缘材料的基座，多个高速信号迹线设置在剩余绝缘材料上并耦合到剩余的绝缘材料上，将高速信号迹线上的预预处理材料耦合，去除与沟槽相邻的预浸料， 将材料与高速信号迹线对准，并且将芯层加热并压制到预浸层，以及将预浸层加热和压制到芯绝缘层。

公开(公告)号：US20090032829A1

公开(公告)日：2009-02-05

申请号：US11830535

申请日：2007-07-30

Applicant: Tong Fatt Chew ,  Siew It Pang ,  Seong Choon Lim

Inventor： Tong Fatt Chew ,  Siew It Pang ,  Seong Choon Lim

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/09318 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, a plurality of dies and a transparent layer of encapsulant. The substrate includes an insulating layer having top and bottom surfaces, the top surface having a first metal patterned layer thereon, and the bottom surface having a second metal patterned layer thereon. The first metal patterned layer has a plurality of die mounting areas thereon, and the second metal patterned layer includes a first contact layer that underlies the die mounting area, the die mounting area and the first contact layer being connected by metal lined vias at each of the die mounting areas. The transparent encapsulant covers the plurality of dies and is bonded to the first metal patterned layer and the top surface of the insulating layer.

Abstract translation: 公开了一种光源及其制造方法。 光源包括基板，多个管芯和透明的密封剂层。 衬底包括具有顶表面和底表面的绝缘层，顶表面上具有第一金属图案化层，底表面上具有第二金属图案层。 第一金属图案层在其上具有多个管芯安装区域，并且第二金属图案化层包括位于管芯安装区域下方的第一接触层，管芯安装区域和第一接触层通过金属衬里的通孔连接 模具安装区域。 透明密封剂覆盖多个管芯并且结合到第一金属图案层和绝缘层的顶表面。

公开(公告)号：US07388756B1

公开(公告)日：2008-06-17

申请号：US11609806

申请日：2006-12-12

Applicant: Robert T. Worl ,  Bruce L. Blaser ,  Peter T. Heisen ,  Julio A. Navarro ,  Douglas A. Pietila ,  Scott A. Raby ,  Jimmy S. Takeuchi

Inventor： Robert T. Worl ,  Bruce L. Blaser ,  Peter T. Heisen ,  Julio A. Navarro ,  Douglas A. Pietila ,  Scott A. Raby ,  Jimmy S. Takeuchi

IPC: H05K7/00

CPC classification number: H05K1/118 ,  H01L2924/19107 ,  H01R12/52 ,  H01R12/62 ,  H05K1/0237 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2203/049

Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.

Abstract translation: 提供了一种使用柔性基板在第一元件和第二元件之间产生成角度的RF连接的方法和结构。 该方法包括将柔性基板层压到第一元件上; 弯曲柔性基板，使得柔性基板上的接合焊盘处于与第二元件上的接合焊盘相似的平面中; 以及通过将所述接合焊盘引导到所述柔性基板上的所述接合焊盘和所述第二元件上的所述接合焊盘来产生所述成角度的RF连接 该结构包括层压到作为外层的第一元件上的柔性基板，具有至少一个接合焊盘的柔性基板，以及能够以与焊盘相同的平面将接合焊盘放置在一起的角度弯曲的柔性基板 在第二个元素上。