公开(公告)号：US20140239505A1

公开(公告)日：2014-08-28

申请号：US13781215

申请日：2013-02-28

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jiun Yi Wu

IPC: H01L23/00 ,  H01L23/538

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5386 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/206 ,  H05K1/0306 ,  H05K1/115 ,  H05K2201/10234 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A method and structure for bump-on-trace bonding is provided. In an embodiment traces to be used for bump-on-trace (BOT) bonding are protected during a pre-solder treatment. The pre-solder treatment improves the adhesion between the exposed traces (e.g., the non-BOT traces) and a solder resist layer.

Abstract translation: 提供了一种用于凸起跟踪接合的方法和结构。 在实施例中，在预焊接处理期间保护用于跟踪（BOT）接合的迹线。 预焊接处理改善了暴露的迹线（例如，非BOT迹线）和阻焊层之间的粘附性。

公开(公告)号：US20140076611A1

公开(公告)日：2014-03-20

申请号：US14022821

申请日：2013-09-10

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won CHOI ,  Yon Ho YOU

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K3/00 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2201/10234

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备基底; 在基底基板的一个表面上设置具有形成在其中的通孔的掩模; 将金属芯球插入到掩模的通孔中，对金属芯球进行回流处理，并除去掩模; 并且在基底基板的一个表面上层叠绝缘层。

公开(公告)号：US08674232B2

公开(公告)日：2014-03-18

申请号：US13116224

申请日：2011-05-26

Applicant: Yang-sik Cho ,  Sung-taik Hong ,  Gun-ho Wang

Inventor： Yang-sik Cho ,  Sung-taik Hong ,  Gun-ho Wang

IPC: H05K1/09

CPC classification number: H05K1/188 ,  H01L23/4985 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/189 ,  H05K3/06 ,  H05K2201/10234 ,  H05K2201/10674 ,  Y10T29/49121 ,  Y10T29/49155 ,  H01L2224/0401

Abstract: A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a first plating layer which is formed in the at least one groove of the first insulating layer; and a device which includes at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer.

Abstract translation: 提供了一种嵌入式装置的柔性印刷电路板（FPCB）及其制造装置的FPCB的方法。 装置嵌入的FPCB包括：第一导电层; 第一绝缘层，其设置在所述第一导电层上并且包括至少一个凸起孔和至少一个凹槽; 第一镀层，形成在所述第一绝缘层的所述至少一个槽中; 以及包括至少一个凸块的装置，所述至少一个凸块插入到要连接到所述第一导电层的所述至少一个凸起孔中。

公开(公告)号：US08541685B2

公开(公告)日：2013-09-24

申请号：US12869184

申请日：2010-08-26

Applicant: Takahiro Sugiyama ,  Hideki Nounen

Inventor： Takahiro Sugiyama ,  Hideki Nounen

IPC: H05K1/00 ,  H05K7/12

CPC classification number: H01R12/62 ,  H01R13/035 ,  H01R13/2414 ,  H01R13/2478 ,  H05K3/0061 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/0715 ,  H05K2201/10234 ,  H05K2201/10409 ,  H05K2201/2009

Abstract: There is provided a flexible harness adapted to be detachably connected to electrode pads of an electric/electronic component. The flexible harness according to the present invention comprises: a flexible insulator film; a conductor pattern formed on the flexible insulator film; a terminal plane which is an end region of the conductor pattern; and ball-like contact bumps formed on the terminal plane. Each contact bump includes a core made of an elastically deformable resin and an electrical conductor layer surrounding the core.

Abstract translation: 提供了适于可拆卸地连接到电气/电子部件的电极焊盘的柔性线束。 根据本发明的柔性线束包括：柔性绝缘膜; 形成在柔性绝缘膜上的导体图案; 作为导体图案的端部区域的端子平面; 以及形成在端子平面上的球状接触凸点。 每个接触凸块包括由可弹性变形的树脂制成的芯和围绕芯的电导体层。

公开(公告)号：US08164192B2

公开(公告)日：2012-04-24

申请号：US12984707

申请日：2011-01-05

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L25/488

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10734 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.

Abstract translation: 一种电气结构和形成方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。

公开(公告)号：US08043893B2

公开(公告)日：2011-10-25

申请号：US11855236

申请日：2007-09-14

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L21/00 ,  H01L21/44 ,  H01L29/40

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

Abstract translation: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底，使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。

公开(公告)号：US08039107B2

公开(公告)日：2011-10-18

申请号：US11915659

申请日：2006-05-23

Applicant: Ken Asada ,  Fumiaki Kikui

Inventor： Ken Asada ,  Fumiaki Kikui

IPC: B32B15/02 ,  B22B1/02

CPC classification number: B22F1/02 ,  B23K35/02 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15182 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/10234 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A silver-coated ball 10 according to the present invention includes: a spherical core 1; and a coating layer 2 including silver superfine particles, which is arranged so as to surround the core 1. The silver superfine particles included in the coating layer 2 have a mean particle size of 1 nm to 50 nm.

Abstract translation: 根据本发明的镀银球10包括：球形芯1; 以及包含银超细颗粒的涂层2，其被布置为围绕芯体1。包覆在涂层2中的银超微粒的平均粒径为1nm〜50nm。

公开(公告)号：US20110239458A1

公开(公告)日：2011-10-06

申请号：US13159773

申请日：2011-06-14

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H05K3/10

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

Abstract translation: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底，使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。

公开(公告)号：US07926175B2

公开(公告)日：2011-04-19

申请号：US11862574

申请日：2007-09-27

Applicant: Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

Inventor： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

IPC: H05K3/10

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49155

Abstract: A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

Abstract translation: 一种用于制造包括绝缘构件的布线板的方法，包括：在所述绝缘构件中形成贯通孔的贯通孔形成工序; 将导电性连接粒子插入贯通孔的配置工序; 将导电层配置在绝缘部件的两面上的连接粒子挤压工序，将导电层朝向穿透孔内的连接粒子按压，使连接粒子沿按压方向变形，得到连接部件; 以及图案化导电层的图案化工艺，其中在连接粒子压制过程中，进行按压使得沿着连接构件的至少一部分的绝缘构件表面的方向上的横截面积大于 连接构件与导电层的接触面积。

公开(公告)号：US07868457B2

公开(公告)日：2011-01-11

申请号：US11855290

申请日：2007-09-14

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L23/488

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10734 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.

Abstract translation: 一种电气结构和形成方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。