公开(公告)号：US20120131794A1

公开(公告)日：2012-05-31

申请号：US13351899

申请日：2012-01-17

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: H05K3/10

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20110058343A1

公开(公告)日：2011-03-10

申请号：US12868798

申请日：2010-08-26

Applicant: Ryo MOCHIZUKI

Inventor： Ryo MOCHIZUKI

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/3405 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10446

Abstract: According to one embodiment, a module connection structure designed to connect a module to other modules. The module includes a dielectric layer, a micro-strip path, a projection, and a plurality of gain adjusting lands. The dielectric layer is formed on a substrate. The micro-strip path is provided on the dielectric layer and configured to transmit a transmission signal input to one end portion, to the other end portion. The projection is formed at edges of the substrate, which are adjacent to the other modules, and protruding from the micro-strip path and the dielectric layer toward the other modules. The plurality of gain adjusting lands is formed adjacent to the micro-strip path, for use in adjusting an input/output gain of the module. The gain adjusting lands uncouple from the micro-strip path or other gain adjusting lands couple to the micro-strip path, thereby to adjust the input/output gain of the module.

Abstract translation: 根据一个实施例，设计用于将模块连接到其他模块的模块连接结构。 该模块包括电介质层，微带路径，投影和多个增益调整区域。 介电层形成在基板上。 微带路径设置在电介质层上，并被配置为将输入到一个端部的传输信号传输到另一端部。 突起形成在与其他模块相邻的基板的边缘处，并且从微带路径和介电层向另一个模块突出。 多个增益调整区域形成为与微带路径相邻，用于调整模块的输入/输出增益。 增益调整平台从微带路径分离或其他增益调整平台耦合到微带路径，从而调整模块的输入/输出增益。

公开(公告)号：US07854368B2

公开(公告)日：2010-12-21

申请号：US11923413

申请日：2007-10-24

Applicant: Young Hoon Kwark ,  Christian Schuster

Inventor： Young Hoon Kwark ,  Christian Schuster

IPC: B23K31/02

CPC classification number: H01L24/46 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/43 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49174 ,  H01L2224/8502 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1903 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0219 ,  H05K1/0243 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/1028 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract translation: 制造电子互连的方法（和结构）包括用于要互连的信号线，使用被配置为提供受控阻抗效应的多个接合线。

公开(公告)号：US07832840B2

公开(公告)日：2010-11-16

申请号：US11951095

申请日：2007-12-05

Applicant: Kia Silverbrook ,  Norman Micheal Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

Inventor： Kia Silverbrook ,  Norman Micheal Berry ,  Garry Raymond Jackson ,  Akira Nakazawa

IPC: B41J2/14

CPC classification number: B41J2/14427 ,  B41J2/155 ,  B41J2002/14435 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H01R12/721 ,  H01R12/79 ,  H01R13/2414 ,  H01R13/6315 ,  H05K1/142 ,  H05K3/0058 ,  H05K2201/1028 ,  H05K2201/10424

Abstract: A printed circuit board (PCB) assembly has a number of modular printhead controller printed circuit board (PCB), Electrical connector assemblies operatively connect respective PCBs to each other. Each connector assembly has a connecting member with a series of parallel spaced conducting strips. Each member is shaped and configured for fitment into a cavity defined by the raised and recessed portions of two abutting supports to connect the connecting strips of two PCBs via said conducting strips. Each PCB is mounted to a respective modular support that defines a raised portion and a recessed portion at an end thereof. The PCBs each have electrical connecting strips which overlie the respective recessed portions.

Abstract translation: 印刷电路板（PCB）组件具有多个模块化的打印头控制器印刷电路板（PCB），电连接器组件可操作地将相应的PCB彼此连接。 每个连接器组件具有连接构件，其具有一系列平行隔开的导电条。 每个构件被成形和构造成用于装配到由两个邻接支撑件的凸起和凹陷部分限定的空腔中，以经由所述导电条连接两个PCB的连接条。 每个PCB被安装到相应的模块化支撑件，该支撑件在其一端限定凸起部分和凹陷部分。 PCB各自具有覆盖相应凹部的电连接条。

公开(公告)号：US20100206863A1

公开(公告)日：2010-08-19

申请号：US12719079

申请日：2010-03-08

Applicant: Wolfgang Ritter

Inventor： Wolfgang Ritter

IPC: B60L1/02 ,  H05K1/00 ,  H05B3/10 ,  H05B3/00 ,  H05B1/00

CPC classification number: H05K1/118 ,  A41D13/0051 ,  B60N2/5685 ,  D06M11/74 ,  D06M11/83 ,  D06M23/08 ,  D06N3/0056 ,  H05B3/342 ,  H05B2203/011 ,  H05B2203/016 ,  H05B2203/017 ,  H05B2203/029 ,  H05K1/0263 ,  H05K3/244 ,  H05K2201/056 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/10598

Abstract: An electrically conductive, flexible web material assembly includes a polymer-bonded electrically conductive coating on a flexible, electrically non-conductive carrier, and at least two electrodes for feeding electric current. The electrodes are flexible bands made of an electrically conductive material, and each electrode is fixed on the flat carrier by way of one or more stitches. At least one surface of each electrode has a surface contact with the electrically conductive coating. There are also described a variety of implementations of the electrically conductive, flexible web material assembly in heating elements and in clothing.

Abstract translation: 导电柔性幅材材料组件包括在柔性非导电载体上的聚合物键合的导电涂层和用于馈送电流的至少两个电极。 电极是由导电材料制成的柔性带，并且每个电极通过一个或多个针脚固定在平坦的载体上。 每个电极的至少一个表面与导电涂层具有表面接触。 还描述了加热元件和衣服中的导电，柔性卷材材料组件的各种实施方式。

公开(公告)号：US20100014259A1

公开(公告)日：2010-01-21

申请号：US12173230

申请日：2008-07-15

Applicant: Cheng Po Huang

Inventor： Cheng Po Huang

IPC: H05K1/14

CPC classification number: H05K1/0263 ,  H05K3/244 ,  H05K3/341 ,  H05K3/3457 ,  H05K2201/1028

Abstract: A modular circuit board structure for a large current area includes a circuit board having an electric conducting circuit and at least one large current area, and a conducting plate device having conducting plates installed onto the circuit board according to the shape of the large current area. When electronic components are inserted onto the circuit board by a surface mount technology, the conducting plates are attached onto the large current area to form a solder area portion on the conducting plates for allowing a large current to pass through, so as to provide a flexible combination function for the large current area of the circuit board and simplify the stamping molds of different shapes. The invention can avoid a waste of copper plates, assure the reliability, quality and safety of the circuit board, and enhance the cost effectiveness of the manufacture and the competitiveness of the product.

Abstract translation: 用于大电流区域的模块化电路板结构包括具有导电电路和至少一个大电流区域的电路板，以及具有根据大电流区域的形状安装在电路板上的导电板的导电板装置。 当通过表面贴装技术将电子元件插入到电路板上时，导电板被附着在大电流区域上，以在导电板上形成焊料区域部分，以允许大电流通过，从而提供柔性 电路板大电流区域的组合功能，简化了不同形状的冲压模具。 本发明可以避免铜板的浪费，确保电路板的可靠性，质量和安全性，提高制造的成本效益和产品的竞争力。

公开(公告)号：US20090314522A1

公开(公告)日：2009-12-24

申请号：US12223476

申请日：2007-01-16

Applicant: Rudolf Janesch ,  Erich Strummer ,  Johann Hackl

Inventor： Rudolf Janesch ,  Erich Strummer ,  Johann Hackl

IPC: H05K1/02 ,  H05K1/09 ,  B23K20/10 ,  B23K20/12 ,  B29C65/08 ,  B29C65/06

CPC classification number: H05K3/328 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/4015 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/1028 ,  H05K2201/10416 ,  H05K2203/0285 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a multifunctional printed circuit board comprising at least one additional functional element in the form of a round or rectangular conductor which is at least partially fastened on an electrically conducting strip conductor structure by ultrasound or friction welding in a mechanical and electrical and thermally conducting and planar manner and in such a fashion that an intermetal compound is formed. The invention also relates to a method for producing said printed circuit board, to its use as a wiring element for complex structures that is suitable for high current conduction and to uses for a specific thermal management.

Abstract translation: 本发明涉及一种多功能印刷电路板，其包括圆形或矩形导体形式的至少一个附加功能元件，所述附加功能元件至少部分地通过超声或摩擦焊接机械和电气以及热 导电和平面的方式并且以使得形成金属间化合物的方式。 本发明还涉及一种用于制造所述印刷电路板的方法，其用作适用于高电流传导的复杂结构的布线元件以及用于特定的热管理。

公开(公告)号：US20090122509A1

公开(公告)日：2009-05-14

申请号：US12027751

申请日：2008-02-07

Applicant: Marta CASTILLO GARCIA ,  Miguel Angel HERRERO PEREZ

Inventor： Marta CASTILLO GARCIA ,  Miguel Angel HERRERO PEREZ

IPC: H02B1/20

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/058 ,  H05K2201/1028 ,  H05K2201/10356

Abstract: Wiring system which comprises: a flexible printed circuit board (1) with a surface (2) in turn comprising one or more electrical circuits formed by conductive strips (4) and a plurality of electronic components (5) connected to said conductive strips (4) and with at least one extension or branch (6) extending directly from said surface (2) and also comprising conductive strips (7); characterized in that it further comprised: at least one flexible flat cable (8) joined to said at least one extension or branch (6), such that an electrical connection is formed between said flexible flat cable (8) and said extension or branch (6). A vehicle door which internally comprises this wiring system.

Abstract translation: 一种布线系统，包括：具有表面（2）的柔性印刷电路板（1），其又包括由导电条（4）形成的一个或多个电路和连接到所述导电条（4）的多个电子元件（5） ）和至少一个从所述表面（2）直接延伸并且还包括导电条（7）的延伸部分（6）; 其特征在于，还包括：连接到所述至少一个延伸部或分支（6）的至少一个柔性扁平电缆（8），使得在所述柔性扁平电缆（8）和所述延伸部或分支（6）之间形成电连接 6）。 内部包括该接线系统的车门。

公开(公告)号：US07518882B2

公开(公告)日：2009-04-14

申请号：US10585573

申请日：2005-02-04

Applicant: Toshiki Shimizu ,  Kouichi Takagi ,  Fumiaki Mizuno

Inventor： Toshiki Shimizu ,  Kouichi Takagi ,  Fumiaki Mizuno

IPC: H01R9/00

CPC classification number: H05K3/202 ,  H05K1/0263 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/0394 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: In respect to an electrical connection between a control circuit board 20 and bus bars 14 interbonded together, it is an object to enhance stability in quality and reliability in connection. As a solution for achieving the object, the control circuit board 20 is provided with a conductor segment 26 to be electrically connected to a specific one of the bus bars 14 on the opposite side of a rear surface thereof bonded to the bus bars 14, and a through-hole 24 penetrating a main body thereof at a position adjacent to the conductor segment 26 so as to expose the specific bus bar 14 therethrough. Further, an electrically-connecting member 70 is disposed to bridge over the through-hole 24 and the conductor segment 26, and soldered onto the conductor segment 26 and the bus bar portion located in the through-hole 24.

Abstract translation: 关于控制电路板20和串联在一起的母线14之间的电连接，其目的是提高连接的质量和可靠性的稳定性。 作为实现该目的的解决方案，控制电路板20设置有导体段26，以与其连接到母线14的后表面的相对侧上的特定一个母线14电连接，并且 通孔24在与导体段26相邻的位置处贯通其主体，以便露出特定母线14。 此外，电连接构件70设置成跨过通孔24和导体段26，并焊接到位于通孔24中的导体段26和汇流条部分上。

公开(公告)号：US20080179085A1

公开(公告)日：2008-07-31

申请号：US12017179

申请日：2008-01-21

Applicant: Kil-Soo CHOI ,  Sun-Hyung CHOI ,  Ji-Young KIM

Inventor： Kil-Soo CHOI ,  Sun-Hyung CHOI ,  Ji-Young KIM

IPC: H05K1/02

CPC classification number: H05K1/141 ,  H05K1/0219 ,  H05K1/117 ,  H05K1/118 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10136 ,  H05K2201/1028 ,  H05K2201/10363

Abstract: A printed circuit board (“PCB”) includes a base substrate, circuit lines and an input pad portion. The input pad portion is formed on a surface of the base substrate on which the circuit lines are formed to receive an externally provided signal. The input pad portion includes a first input pad group, a second input pad group and a first connecting member. The first input pad group has a plurality of first input terminals. The second input pad group is spaced apart from the first input pad group. The second input pad group includes a plurality of second input terminals. At least one of the second input terminals is electrically connected to at least one of the first input terminals. The first connecting member electrically connects at least two of the second input terminals.

Abstract translation: 印刷电路板（“PCB”）包括基底，电路线和输入焊盘部分。 输入焊盘部分形成在其上形成电路线的基底基板的表面上以接收外部提供的信号。 输入焊盘部分包括第一输入焊盘组，第二输入焊盘组和第一连接部件。 第一输入焊盘组具有多个第一输入端子。 第二输入焊盘组与第一输入焊盘组间隔开。 第二输入焊盘组包括多个第二输入端子。 第二输入端子中的至少一个电连接到第一输入端子中的至少一个。 第一连接构件电连接至少两个第二输入端子。