公开(公告)号：US4835598A

公开(公告)日：1989-05-30

申请号：US52182

申请日：1987-05-14

Applicant: Tooru Higuchi ,  Tosiyuki Yamaguchi ,  Takeshi Kanou

Inventor： Tooru Higuchi ,  Tosiyuki Yamaguchi ,  Takeshi Kanou

IPC: H01L23/14 ,  H01L23/36 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/38 ,  H05K3/40 ,  H05K3/44

CPC classification number: H01L23/142 ,  H01L23/36 ,  H01L23/49827 ,  H05K1/0204 ,  H05K1/021 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/3025 ,  H05K1/182 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2201/10416 ,  H05K2201/10477 ,  H05K2203/049 ,  H05K2203/063 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/445

Abstract: A printed wiring board for carrying a semiconductor chip including a resin base substrate having at least one opening therethrough, a thermo-conductive plate for mounting the semiconductor chip thereon, the plate being inserted into the opening, an insulating adhesive layer covering at least one side of the substrate and an electric circuit formed on the layer. The wiring board of this invention eliminates those disadvantages of the existing resin substrate type and metal core type. In essence, the wiring board of this invention displays excellent heat releasing capability and magnetic shield effect as well as reliable electric insulation.

Abstract translation: 一种印刷电路板，用于承载包括具有至少一个开口的树脂基底的半导体芯片，用于将半导体芯片安装在其上的热导板，该板插入该开口中，绝缘粘合剂层覆盖至少一个侧面 和形成在该层上的电路。 本发明的布线板消除了现有的树脂基板型和金属芯型的缺点。 实质上，本发明的接线板显示出优异的散热能力和磁屏蔽效果以及可靠的电绝缘。

公开(公告)号：US4796349A

公开(公告)日：1989-01-10

申请号：US53099

申请日：1987-05-22

Applicant: Douglas J. Miller

Inventor： Douglas J. Miller

IPC: H02G3/16 ,  H05K3/22 ,  B23P6/00

CPC classification number: H05K3/222 ,  H02G3/16 ,  H05K2201/10287 ,  H05K2201/10409 ,  Y10T24/44017 ,  Y10T24/44974 ,  Y10T29/4973 ,  Y10T29/49815 ,  Y10T29/49863 ,  Y10T29/49948 ,  Y10T403/16

Abstract: A damaged binding post on a telephone wire connecting panel is replaced by a binding post having a threaded stem and a polygonal head adapted to seat freely in a hole in the panel. A retaining nut is screwed on the stem and spaced from the surface of said panel. A bridge is placed over the binding post and each of the next adjacent binding posts and a locking nut threaded over each of the stems of said adjacent binding posts, to cause said bridge to bow and provide a bias urging the retaining nut downwardly forcing the replacement post to seat in the hole.

Abstract translation: 在电话线连接面板上的损坏的装订柱由具有螺纹杆和多个头部的装订杆代替，该装订杆适于自由地安置在面板的孔中。 固定螺母拧在杆上并与所述面板的表面间隔开。 桥接器放置在装订杆上，并且每个下一个相邻的装订杆和锁定螺母，螺纹连接在所述相邻装订杆的每个杆上，以使所述桥架弯曲并提供向下推动保持螺母的偏压，迫使替换 张贴到座位上。

公开(公告)号：US4791722A

公开(公告)日：1988-12-20

申请号：US945222

申请日：1986-12-23

Applicant: Grady A. Miller, Jr.

Inventor： Grady A. Miller, Jr.

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/22 ,  H01K3/10

CPC classification number: H05K3/222 ,  H05K1/029 ,  H05K1/0231 ,  H05K1/0287 ,  H05K1/0298 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10689 ,  Y10T29/49162

Abstract: A printed circuit for mounting and connecting a plurality of semiconductor devices is disclosed and includes a planar insulating substrate having multiple conductive layers disposed in overlying relationship within the planar substrate. A plurality of parallel rows of apertures for wire wrap, quick connect or stitch wire contacts are provided for mounting integrated circuit. One side of the printed circuit board includes a plurality of power and ground connections disposed between each pair of parallel rows of apertures so that filter capacitors may be mounted under each integrated circuit, thereby conserving printed circuit board space. In a preferred mode of the present invention, alternate ones of the conductive layers are coupled to a source of electrical power while all remaining conductive layers are gounded. At least two adjacent conductive layers are then utilized to minimize parasitic capacitance by completely surrounding each aperture with a portion of conductive material.

Abstract translation: 公开了一种用于安装和连接多个半导体器件的印刷电路，并且包括在平面基板内以覆盖关系设置的多个导电层的平面绝缘基板。 为了安装集成电路，提供多个平行的用于线缠绕，快速连接或针迹线接触的孔。 印刷电路板的一侧包括设置在每对平行排孔之间的多个电源和接地连接，使得滤波电容器可以安装在每个集成电路下，从而节省印刷电路板空间。 在本发明的优选模式中，替代的导电层被耦合到电源上，同时所有剩余的导电层都被压扁。 然后通过用导电材料的一部分完全围绕每个孔，至少使用两个相邻的导电层来最小化寄生电容。

公开(公告)号：US4654102A

公开(公告)日：1987-03-31

申请号：US867908

申请日：1986-05-20

Applicant: Jean C. Wery ,  Michel Jehay ,  Andre Job

Inventor： Jean C. Wery ,  Michel Jehay ,  Andre Job

IPC: B23K11/34 ,  B23K20/00 ,  B23K20/24 ,  H05K1/11 ,  H05K1/14 ,  H05K3/22 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B31/16

CPC classification number: H01L24/85 ,  B23K11/34 ,  B23K20/005 ,  B23K20/24 ,  H01L24/48 ,  H01L24/78 ,  H05K3/225 ,  H01L2224/45014 ,  H01L2224/4809 ,  H01L2224/48096 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K1/116 ,  H05K1/141 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2203/1115 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/42 ,  Y10T156/1052 ,  Y10T156/1092 ,  Y10T156/1339 ,  Y10T29/49124 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49204 ,  Y10T29/49732

Abstract: A method and apparatus are shown for use in adding electrical connections to existing printed circuit boards. To this end, apparatus in the form of a multilayered pad is provided which has an adhesive layer over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet of pads into individual pads, placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads to bond them to the board, and stitching (welding) wire to a succession of pads to complete a series of new connections. Some pads include plated-through-holes enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.

Abstract translation: 示出了用于向现有印刷电路板添加电连接的方法和装置。 为此，提供了一种多层焊盘形式的设备，其在一个面的至少一部分上具有粘合剂层，该粘合层响应于热量，使得焊盘可以通过加热粘结到印刷电路板的表面上。 垫的另一面包括不锈钢层，可以将镍线缝合或焊接到该层上。 根据本发明的方法包括将一块垫片切割成单个垫片，将多个垫片，粘合剂侧面向下放置在印刷电路板的表面上，加热垫片以将其粘合到板上，并缝合（焊接） 连接到一连串的焊盘，以完成一系列新的连接。 一些焊盘包括电镀通孔，使得能够从焊盘到板上的现有电路以及通过使用流焊技术安装在孔中的部件完成连接。

公开(公告)号：US4646436A

公开(公告)日：1987-03-03

申请号：US788961

申请日：1985-10-18

Applicant: Jonathan C. Crowell ,  John T. Swailes

Inventor： Jonathan C. Crowell ,  John T. Swailes

IPC: H01P11/00 ,  H05K1/02 ,  H05K3/10 ,  H05K3/42 ,  H01K3/10

CPC classification number: H05K1/0219 ,  H01P11/003 ,  H01P11/005 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/429 ,  Y10T29/49162

Abstract: Discloses a method for making a coaxial conductor interconnection circuit board, as well as the board per se, by providing a first conductive coating on a substrate, scribing an insulated wire signal conductor pattern on the first coating and a second conductive coating over the wire to provide a conductive shield surrounding the wire, eliminating conductive material from the coatings in clearance areas at terminal points and drilling at the terminal points by laser beam or mechanical drilling to expose the signal conductor.

Abstract translation: 公开了一种用于制造同轴导体互连电路板以及板本身的方法，其通过在基板上设置第一导电涂层，在第一涂层上划线绝缘线信号导体图案和在导线上划分第二导电涂层， 提供围绕导线的导电屏蔽，消除端子处的间隙区域中的涂层的导电材料，并通过激光束或机械钻孔在端点处钻孔以暴露信号导体。

公开(公告)号：US4620889A

公开(公告)日：1986-11-04

申请号：US708684

申请日：1985-03-06

Applicant: Rudolf Winter ,  Albert Horner ,  Adalbert Lindner

Inventor： Rudolf Winter ,  Albert Horner ,  Adalbert Lindner

IPC: H05K3/10 ,  H05K3/38 ,  H05K7/06 ,  B32B31/12

CPC classification number: H05K3/103 ,  H05K7/06 ,  H05K2201/10287 ,  H05K2203/1105 ,  H05K3/386 ,  Y10S269/903 ,  Y10T156/1712 ,  Y10T156/18 ,  Y10T29/49124 ,  Y10T29/532

Abstract: Previously, hook-up wires were glued to a mounting board by means of spot gluing. As disclosed herein, the insulated hook-up wire is first continuously coated with a coating of hot-melt adhesive and is then placed on the mounting board and simultaneously bonded by means of a heated laying tip of an application tool, similar to a soldering bit. When passing through the laying tip, the hook-up wire is briefly heated, whereby the coating of hot-melt adhesive is melted. The insulating layer of the hook-up wire has a higher temperature stability and is thereby not altered. In the immediately following application of the hook-up wire to the mounting board, the hot-melt adhesive cools and connects the hook-up wire to the mounting board.

Abstract translation: 以前，通过点胶将连接线胶合到安装板上。 如本文所公开的，绝缘连接线首先连续地涂覆有热熔性粘合剂涂层，然后将其放置在安装板上，同时通过施加工具的加热铺设尖端进行粘合，类似于焊接头 。 当穿过铺设尖端时，短路加热连接线，由此熔化粘合剂的涂层。 连接线的绝缘层具有较高的温度稳定性，从而不改变。 在将连接线立即连接到安装板上时，热熔粘合剂冷却并将连接线连接到安装板。

公开(公告)号：US4544801A

公开(公告)日：1985-10-01

申请号：US639152

申请日：1984-08-09

Applicant: William J. Rudik ,  George P. Schmitt ,  John F. Shipley

Inventor： William J. Rudik ,  George P. Schmitt ,  John F. Shipley

IPC: C09J163/10 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H05K7/06 ,  H05K1/03

CPC classification number: H05K7/06 ,  C09J163/10 ,  H05K3/386 ,  H05K2201/0195 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/4626

Abstract: A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.

Abstract translation: 描述了高密度尺寸稳定的封装线电路板和制造这种板的方法。 使用具有流变特性的独特组合的光固化粘合剂将绝缘导线粘合到基底上。 在本发明的封装线路板中使用的粘合剂的流变特性的独特组合包括存储剪切模量的特定值范围和损失角比的值的特定范围。

公开(公告)号：US4533787A

公开(公告)日：1985-08-06

申请号：US440999

申请日：1982-11-12

Applicant: Fredy Anderegg ,  Josef Furrer ,  Heinz Dappen

Inventor： Fredy Anderegg ,  Josef Furrer ,  Heinz Dappen

IPC: H05K3/00 ,  H05K7/06 ,  H05K1/03

CPC classification number: H05K3/4691 ,  H05K7/06 ,  H05K1/142 ,  H05K2201/0187 ,  H05K2201/0909 ,  H05K2201/10287 ,  H05K2201/10977

Abstract: Certain regions of a printed circuit assembly having mechanically laid wires are formed of two parallel sheets of polyimide film, the circuit assembly being flexible in those regions. The edges of these sheets of film are secured in the region of the edges of the rigid parts of the assembly by means of thermally activated adhesives. In the flexible regions, the wires are embedded in a thermally activated adhesive layer held between the two sheets of polyimide film. This adhesive layer, unlike adhesive layers on the rigid parts, contains no fabric.

Abstract translation: 具有机械敷设电线的印刷电路组件的某些区域由两片平行的聚酰亚胺薄膜形成，所述电路组件在那些区域中是柔性的。 这些膜片的边缘通过热活化粘合剂固定在组件的刚性部分的边缘的区域中。 在柔性区域中，将电线嵌入保持在两片聚酰亚胺膜之间的热活化粘合剂层中。 该粘合层与刚性部件上的粘合剂层不同，不含织物。

公开(公告)号：US4492460A

公开(公告)日：1985-01-08

申请号：US359659

申请日：1982-03-01

Applicant: William H. Considine

Inventor： William H. Considine

IPC: G03F1/90 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/22 ,  G03B27/02

CPC classification number: H05K3/0002 ,  G03F1/90 ,  H05K1/029 ,  H05K1/0269 ,  H05K1/142 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2201/10287 ,  H05K2203/173 ,  H05K3/222

Abstract: A modular printed circuit construction using visual or other representations (1 to 7) which can be arranged so as to produce a visual pattern in which continuous interconnections between the modules appear (automatically as a result of overlapping of individual representations). The composite visual pattern can be used to produce a unitary printed circuit board. Alternatively the individual printed circuit boards can be combined in a board assembly using a mounting frame or edge connectors. Two dimensional extension is possible. Particular applications include microprocessor systems (include parallel processors using a common memory). Bus lines can extend completely across individual representations or the unitary board. The positions of such lines can be determined in dependence on the number of individual representations to which they are common.

Abstract translation: PCT No.PCT / GB81 / 00134 Sec。 371日期1982年3月1日 102（e）1982年3月1日PCT PCT 1981年7月8日PCT公布。 公开号WO82 / 00398 日期：1982年2月4日。一种使用视觉或其他表示（1至7）的模块化印刷电路结构，其可以被布置成产生视觉图案，其中模块之间的连续互连出现（由于个体的重叠而自动地 表示）。 复合视觉图案可用于生产单一印刷电路板。 或者，各个印刷电路板可以使用安装框架或边缘连接器组合在电路板组件中。 二维扩展是可能的。 具体应用包括微处理器系统（包括使用公共存储器的并行处理器）。 公共汽车线路可以完全跨越单独的表示或整体板。 这些线的位置可以根据它们是共同的各个表示的数量来确定。

公开(公告)号：US4485382A

公开(公告)日：1984-11-27

申请号：US396163

申请日：1982-07-08

Applicant: Charles C. Moore

Inventor： Charles C. Moore

IPC: E05F15/20 ,  H03J3/20 ,  H05K1/02 ,  H05K1/16 ,  H04Q9/14

CPC classification number: H03J3/20 ,  E05F15/77 ,  H05K1/165 ,  E05Y2900/106 ,  H05K1/0231 ,  H05K2201/10196 ,  H05K2201/10265 ,  H05K2201/10287

Abstract: Tuning elements are provided for use in varying the inductance of the oscillatory circuits of the transmitter and receiver units of garage door actuators operating at ultra-high frequencies. Each oscillatory circuit is a closed loop circuit fabricated on a printed circuit board. The closed loop circuit comprises a pair of printed circuit conductive paths having a fixed capacitor connected across one of the ends thereof and a discrete generally U-shaped wire connected across the other of the ends thereof. The conductive paths and the U-shaped wire comprise the inductor of the oscillatory circuit. By bending the discrete U-shaped wire at its connections with respect to the plane of the printed circuit board, the inductance of the oscillatory circuit in each unit can be adjusted as needed so that they both operate at the same resonant frequency.

Abstract translation: 提供调谐元件用于改变以超高频操作的车库门致动器的发射器和接收器单元的振荡电路的电感。 每个振荡电路是在印刷电路板上制造的闭环电路。 闭环电路包括一对印刷电路导电路径，其具有连接在其一端的固定电容器和跨越其另一端连接的离散的大致U形的电线。 导电路径和U形线包括振荡电路的电感器。 通过在其与印刷电路板的平面的连接处弯曲离散的U形线，可以根据需要调整每个单元中的振荡电路的电感，使得它们都以相同的谐振频率工作。