Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same
    179.
    发明授权
    Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same 有权
    用于晶片的临时粘合剂材料,使用其的临时粘合的膜,晶片加工层压板以及使用其的薄晶片的制造方法

    公开(公告)号:US09550931B2

    公开(公告)日:2017-01-24

    申请号:US14270843

    申请日:2014-05-06

    Abstract: A temporary adhesive material for a wafer includes a first temporary adhesive layer of a silicone-containing polymer layer containing a photo base generator and a second temporary adhesive layer of a silicone-containing polymer layer which is laminated on the first temporary adhesive layer, does not contain the photo base generator, and is different from the polymer layer. Thereby, there can be formed a temporary adhesive layer having high thickness uniformity, even on a wafer having a step. Because of the thickness uniformity, a thin wafer having a uniform thickness of 50 μm or less can be easily obtained. When a thin wafer is produced and then delaminated from a support, the wafer can be delaminated from the support by exposure at a low exposure dose without stress. Therefore, a brittle thin wafer can be easily handled without causing damage, and a thin wafer can be easily produced.

    Abstract translation: 用于晶片的暂时粘合剂材料包括层叠在第一临时粘合剂层上的含有光聚合物层的含硅氧烷聚合物层的第一临时粘合剂层和层叠在第一临时粘合剂层上的含硅酮聚合物层的第二临时粘合剂层, 含有光源产生器,不同于聚合物层。 因此,即使在具有台阶的晶片上也可以形成厚度均匀性高的临时粘合剂层。 由于厚度均匀性,可以容易地获得具有50μm或更小的均匀厚度的薄晶片。 当制造薄晶片然后从载体分层时,通过以低曝光剂量暴露而不受压力,晶片可以从载体分层。 因此,可以容易地处理脆性薄晶片而不会造成损坏,并且可以容易地制造薄晶片。

    PRESSURE-SENSITIVE ADHESIVE STRIP FOR MOISTURE-INSENSITIVE PEELABLE ADHESIVE BONDS
    180.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE STRIP FOR MOISTURE-INSENSITIVE PEELABLE ADHESIVE BONDS 审中-公开
    用于防静电粘性胶粘剂的压敏胶粘带

    公开(公告)号:US20160145471A1

    公开(公告)日:2016-05-26

    申请号:US15009003

    申请日:2016-01-28

    Applicant: TESA SE

    Abstract: A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.

    Abstract translation: 一种分离两个基板的方法,该两个基板与可重新切割的至少单面压敏粘合剂条粘合,所述至少单面压敏粘合剂条至少包括a)断裂伸长率至少为300%的芯层,b)外部载体层,其具有 断裂伸长率不超过120%,并且至少部分地连接到芯层,使得当芯层被拉伸时,其与芯层分离,以及c)至少部分地施加到侧面的第一粘合剂层 所述外部载体层与连接到所述芯层的侧面相对,其中所述芯层沿着所述粘合平面的方向被拉伸,从已经被制成非粘合性的区域开始,直到所述芯层从至少一个 的外部载体层,使得两个基板彼此分离。

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