公开(公告)号：US4323421A

公开(公告)日：1982-04-06

申请号：US121821

申请日：1980-02-15

Applicant: Theodore H. Klein

Inventor： Theodore H. Klein

IPC: B29C43/18 ,  B29C70/78 ,  H05K1/03 ,  H05K3/02 ,  B32B31/06 ,  B32B31/24 ,  H05K3/06

CPC classification number: H05K3/022 ,  B29C43/18 ,  B29C70/78 ,  H05K1/0373 ,  B29K2105/08 ,  B29K2105/16 ,  B29K2705/10 ,  H05K1/0326 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10S264/64 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.

Abstract translation: 导体包覆复合材料有利地使用模制化合物和相关的加工技术制造。 导电包层在成型过程中被施加并结合到复合材料上。 导体包覆复合材料可以用作印刷线路板，并且在该实施例中导致改进的物理，化学，机械和电气性能。

公开(公告)号：US4177553A

公开(公告)日：1979-12-11

申请号：US881706

申请日：1978-02-27

Applicant: Theodore H. Klein

Inventor： Theodore H. Klein

IPC: H05K1/03 ,  H05K3/10

CPC classification number: H05K1/0366 ,  H05K1/0353 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T29/49162

Abstract: An improved reinforced flexible printed wiring board is disclosed. The reinforcement in this printed wiring board is composed of a fabric woven from a yarn of plied continuous filaments of polyester and glass. The fabric is impregnated with an appropriate resin which is subsequently cured. This printed wiring board is found to have improved mechanical and thermal characteristics with little degradation in electrical properties.

Abstract translation: 公开了一种改进的增强柔性印刷线路板。 该印刷线路板中的加强件由由聚酯和玻璃的连续长丝的纱线编织的织物组成。 织物用合适的树脂浸渍，随后固化。 发现该印刷线路板具有改善的机械和热特性，电性能几乎没有劣化。

公开(公告)号：US3934067A

公开(公告)日：1976-01-20

申请号：US489282

申请日：1974-07-17

Applicant: Ira Bernard Goldman ,  John Francis Henrickson

Inventor： Ira Bernard Goldman ,  John Francis Henrickson

IPC: C08L63/00 ,  D06M15/507 ,  D06M15/55 ,  H04R25/00 ,  H05K1/03 ,  B32B27/38 ,  B32B15/08

CPC classification number: H05K1/0366 ,  C08L63/00 ,  D06M15/507 ,  D06M15/55 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S273/03 ,  Y10S428/901 ,  Y10T428/31522 ,  Y10T428/31786 ,  Y10T442/2861

Abstract: A method of improving the dimensional and thermal stability of a fibrous web containing substrate is disclosed. A uniformly or randomly spun or bonded fabric or textile support is impregnated with a curable polymer resin, e.g., an epoxy-polyester resin. The impregnated resin is then fully cured whereupon a polymer resin coat is applied thereto. The coat is maintained in a partial cure state whereby a laminate comprising an internal woven or bonded fabric skeleton impregnated with a fully cured polymer resin and coated with a layer of a partially cured polymer resin is obtained.

Abstract translation: 公开了一种改善含纤维网的基材的尺寸和热稳定性的方法。 用可固化聚合物树脂例如环氧 - 聚酯树脂浸渍均匀或随机纺丝或粘合的织物或织物载体。 然后将浸渍的树脂完全固化，由此施加聚合物树脂涂层。 将该涂层保持在部分固化状态，由此获得包含浸渍有完全固化的聚合物树脂并涂覆有部分固化的聚合物树脂层的内部织造或粘合织物骨架的层压体。

公开(公告)号：US3526568A

公开(公告)日：1970-09-01

申请号：US3526568D

申请日：1969-06-11

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： KEPPLE CHARLES G ,  MARTELLO NORMAN E

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B7/00 ,  C09J5/04

CPC classification number: H05K3/386 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0355 ,  Y10T29/49124 ,  Y10T156/109 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31525

公开(公告)号：US3463698A

公开(公告)日：1969-08-26

申请号：US3463698D

申请日：1965-06-14

Applicant: FUJI TSUSHINKI SEIZO KK

Inventor： YANAGIHARA KOTARO ,  SUZUKI TAKENORI

IPC: C08J5/24 ,  H05K1/03 ,  B32B27/36

CPC classification number: H05K1/0366 ,  C08J5/24 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  Y10T428/31529

公开(公告)号：US3057952A

公开(公告)日：1962-10-09

申请号：US6605760

申请日：1960-10-31

Applicant: SANDERS ASSOCIATES INC

Inventor： GORDON GEORGE F

IPC: H01B7/08 ,  H05K1/00 ,  H05K3/46

CPC classification number: H05K3/4635 ,  H01B7/0838 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0195 ,  Y10T29/49171 ,  Y10T428/24132 ,  Y10T428/3154

公开(公告)号：US20240355501A1

公开(公告)日：2024-10-24

申请号：US18756052

申请日：2024-06-27

Applicant: Chasm Advanced Materials, Inc.

Inventor： Robert F. Praino ,  Sean P. Arthur ,  David J. Arthur

IPC: H01B1/24 ,  B32B5/02 ,  B32B15/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B82Y10/00 ,  C08K3/04 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  C09D11/52 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09

CPC classification number: H01B1/24 ,  B32B5/02 ,  B32B15/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B82Y10/00 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  C09D11/52 ,  H01B1/026 ,  H01B1/22 ,  H05K1/095 ,  H05K1/097 ,  B32B2305/10 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2311/08 ,  B32B2311/12 ,  B32B2313/04 ,  B32B2457/00 ,  B32B2551/00 ,  C08K3/041 ,  C08K2003/0806 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T428/24917

Abstract: A transparent conductive film (10) that has a substrate (14) having a surface (14a, 14b), a nanowire layer (12, 12a) over one or more portions of the surface (14a, 14b) of the substrate (14), and a conductive layer (16, 16a) on the portions comprising the nanowire layer (12, 12a), the conductive layer (16, 16a) comprising carbon nanotubes (CNT) and a binder.

公开(公告)号：US20240314938A1

公开(公告)日：2024-09-19

申请号：US18185041

申请日：2023-03-16

Applicant: UNEO INC.

Inventor： Chih-Sheng HOU ,  Chia-Hung CHOU ,  Hsin-Lin YU ,  Si-Wei CHEN ,  Chueh CHIANG

IPC: H05K3/32 ,  H05K1/03

CPC classification number: H05K3/32 ,  H05K1/038 ,  H05K2201/0145 ,  H05K2201/029 ,  H05K2201/10287

Abstract: The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.

公开(公告)号：US12046392B2

公开(公告)日：2024-07-23

申请号：US17837429

申请日：2022-06-10

Applicant: Chasm Advanced Materials, Inc.

Inventor： Robert F. Praino, Jr. ,  David J. Arthur ,  Sean P. Arthur

IPC: H01B1/24 ,  B32B5/02 ,  B32B15/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B82Y10/00 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  C09D11/52 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  C08K3/04

CPC classification number: H01B1/24 ,  B32B5/02 ,  B32B15/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B82Y10/00 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  C09D11/52 ,  H01B1/026 ,  H01B1/22 ,  H05K1/095 ,  H05K1/097 ,  B32B2305/10 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2311/08 ,  B32B2311/12 ,  B32B2313/04 ,  B32B2457/00 ,  B32B2551/00 ,  C08K3/041 ,  C08K2003/0806 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T428/24917 ,  C08K3/08 ,  C08L39/06 ,  C08K3/041 ,  C08L27/18

Abstract: A transparent conductive film (10) that has a substrate (14) having a surface (14a, 14b), a nanowire layer (12, 12a) over one or more portions of the surface (14a, 14b) of the substrate (14), and a conductive layer (16, 16a) on the portions comprising the nanowire layer (12, 12a), the conductive layer (16, 16a) comprising carbon nanotubes (CNT) and a binder.

公开(公告)号：US11729908B2

公开(公告)日：2023-08-15

申请号：US17178312

申请日：2021-02-18

Applicant: Ticona LLC

Inventor： Young Shin Kim

IPC: H01Q1/38 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H01Q1/24 ,  H01Q21/06

CPC classification number: H05K1/0373 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q21/065 ,  H05K3/0032 ,  H05K3/182 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0263 ,  H05K2201/10098 ,  H05K2203/072

Abstract: A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.