公开(公告)号：US20070139859A1

公开(公告)日：2007-06-21

申请号：US11647344

申请日：2006-12-29

Applicant: Tetsuya Osaka ,  Ichiro Koiwa ,  Akira Hashimoto ,  Yoshimi Sato

Inventor： Tetsuya Osaka ,  Ichiro Koiwa ,  Akira Hashimoto ,  Yoshimi Sato

IPC: H04R17/00 ,  H01G4/00

CPC classification number: H01G4/33 ,  H01G4/008 ,  H01G4/1227 ,  H01G13/006 ,  H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.

Abstract translation: 能够并入包装衬底的电容器，该电容器包括高介电常数层，以及从上侧和下侧夹着高介电常数层的上电极层和下电极层。 还提供了包含该电容器的封装基板及其制造方法。

公开(公告)号：US20070065973A1

公开(公告)日：2007-03-22

申请号：US11601101

申请日：2006-11-17

Applicant: Yongki Min

Inventor： Yongki Min

IPC: H01L21/00

CPC classification number: H01L23/49822 ,  H01G4/228 ,  H01G4/33 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/162 ,  H05K3/048 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09763 ,  Y10T29/417 ,  H01L2924/00

Abstract: An embedded passive structure, its method of formation, and its integration onto a substrate during fabrication are disclosed. In one embodiment, the embedded passive structure is a thin film capacitor (TFC) formed using a thin film laminate that has been mounted onto a substrate. The TFC's capacitor dielectric and/or lower electrode layers are patterned in such a way as to reduce damage and improve cycle time. In one embodiment, the capacitor dielectric has a high dielectric constant and the substrate is an organic packaging substrate.

Abstract translation: 公开了嵌入式被动结构，其形成方法及其在制造过程中与衬底的集成。 在一个实施例中，嵌入式无源结构是使用已经安装在基板上的薄膜层叠体形成的薄膜电容器（TFC）。 TFC的电容器电介质和/或下电极层被图案化以减少损坏并改善循环时间。 在一个实施例中，电容器电介质具有高介电常数，并且衬底是有机封装衬底。

公开(公告)号：US20070025059A1

公开(公告)日：2007-02-01

申请号：US11492943

申请日：2006-07-26

Applicant: Kiyoshi Uchida ,  Kenji Horino ,  Hitoshi Saita

Inventor： Kiyoshi Uchida ,  Kenji Horino ,  Hitoshi Saita

IPC: H01G4/06

CPC classification number: H01L21/02197 ,  H01G4/1227 ,  H01L21/02356 ,  H01L21/31691 ,  H01L27/016 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0355

Abstract: A capacitor provided with a dielectric film, and a first electrode and second electrode formed sandwiching it and facing each other, wherein the dielectric film has a density exceeding 72% of the theoretical density calculated based on the lattice constant, and either or both of said first electrode and said second electrode contain at least one metal selected from the group consisting of Cu, Ni, Al, stainless steel and inconel.

Abstract translation: 一种设置有电介质膜的电容器，以及彼此相对地形成的第一电极和第二电极，其中所述电介质膜的密度超过基于晶格常数计算出的理论密度的72％，并且所述 第一电极和第二电极含有选自Cu，Ni，Al，不锈钢和铬镍铁合金中的至少一种金属。

公开(公告)号：US20060287188A1

公开(公告)日：2006-12-21

申请号：US11157621

申请日：2005-06-21

Applicant: William Borland ,  Ian Burn ,  Jon Ihlefeld ,  Jon-Paul Maria ,  Seigi Suh

Inventor： William Borland ,  Ian Burn ,  Jon Ihlefeld ,  Jon-Paul Maria ,  Seigi Suh

IPC: C04B35/00

CPC classification number: H01L21/02197 ,  C01G23/006 ,  C01P2004/82 ,  C01P2006/40 ,  H01G4/1227 ,  H01G4/33 ,  H01L21/02337 ,  H01L21/31691 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T428/31678

Abstract: The present invention is directed to a dielectric thin film composition comprising: (1) one or more barium/titanium-containing selected from (a) barium titanate, (b) any composition that can form barium titanate during firing, and (c) mixtures thereof; dissolved in (2) organic medium; and wherein said thin film composition is doped with 0.002 to 0.05 atom percent of a manganese-containing additive.

Abstract translation: 本发明涉及一种电介质薄膜组合物，其包含：（1）选自（a）钛酸钡的一种或多种钡/钛，（b）在焙烧期间可形成钛酸钡的任何组合物，和（c） 的; 溶于（2）有机介质; 并且其中所述薄膜组合物掺杂0.002至0.05原子％的含锰添加剂。

公开(公告)号：US20060196691A1

公开(公告)日：2006-09-07

申请号：US11365219

申请日：2006-02-28

Applicant: Jin Ahn ,  Cheol Hwang ,  Sung Kim ,  Chang Ryu ,  Suk Cho ,  Ho Jeon

Inventor： Jin Ahn ,  Cheol Hwang ,  Sung Kim ,  Chang Ryu ,  Suk Cho ,  Ho Jeon

IPC: H05K1/03 ,  H05K1/16 ,  H05K3/06

CPC classification number: H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

公开(公告)号：US20060146476A1

公开(公告)日：2006-07-06

申请号：US11218357

申请日：2005-09-02

Applicant: Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

Inventor： Sriram Srinivasan ,  John Guzek ,  Cengiz Palanduz ,  Victor Prokofiev ,  Joel Auernheimer

IPC: H01G4/228

CPC classification number: H05K1/162 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09309 ,  Y10T29/43 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。

公开(公告)号：US20060044734A1

公开(公告)日：2006-03-02

申请号：US10999442

申请日：2004-11-29

Applicant: Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

Inventor： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

IPC: H01G4/20

CPC classification number: H05K1/162 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/248 ,  H01G4/33 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1366 ,  Y10T29/42

Abstract: Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

Abstract translation: 公开了一种包括嵌入式电容器的PCB及其制造方法。 使用具有高电容的陶瓷材料形成电介质层，从而确保电容器各自具有对应于去耦芯片电容器的电容的高介电常数。

公开(公告)号：US06841080B2

公开(公告)日：2005-01-11

申请号：US10352483

申请日：2003-01-28

Applicant: Angus Kingon ,  Gregory J. Dunn ,  Stephen Streiffer ,  Kevin Cheek ,  Min-Xian Zhang ,  Jon-Paul Maria ,  Jovica Savic

Inventor： Angus Kingon ,  Gregory J. Dunn ,  Stephen Streiffer ,  Kevin Cheek ,  Min-Xian Zhang ,  Jon-Paul Maria ,  Jovica Savic

IPC: C23C28/00 ,  H01G4/12 ,  H05K1/16 ,  H01G13/00 ,  H01G4/00 ,  H01G5/00 ,  H01G7/00 ,  H01G9/00

CPC classification number: H05K1/162 ,  H01G4/1218 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2203/121 ,  Y10T29/417

Abstract: A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples of barrier layers include Ni—P or Ni—Cr alloys. After a second layer of conductive metal is deposited on a dielectric oxide surface opposing the first conductive metal layer, the resulting capacitor foil is processed into a capacitor. The resulting capacitor is a surface mounted capacitor or is formed as a integrated or embedded capacitor within a circuit board.

Abstract translation: 在独立的导电金属层上形成电介质膜以形成包含导电金属层，阻挡层和电介质氧化物层的多层箔。 这种多层箔是机械灵活的，并且可用于制造电容器。 阻挡层的实例包括Ni-P或Ni-Cr合金。 在与第一导电金属层相对的电介质氧化物表面上沉积第二层导电金属之后，将所得电容器箔加工成电容器。 所得到的电容器是表面安装的电容器，或者形成为电路板内的集成或嵌入式电容器。

公开(公告)号：US06809046B2

公开(公告)日：2004-10-26

申请号：US09795622

申请日：2001-02-28

Applicant: Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice ,  Walter J. Robertson ,  Kami Lammon-Hilinski ,  Bruce E. Novich ,  Xiang Wu

Inventor： Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice ,  Walter J. Robertson ,  Kami Lammon-Hilinski ,  Bruce E. Novich ,  Xiang Wu

IPC: D03D1500

CPC classification number: D03D15/00 ,  C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T442/2992 ,  Y10T442/3049 ,  Y10T442/3179 ,  Y10T442/3301 ,  Y10T442/3309 ,  Y10T442/699

Abstract: The present invention provides non-heat cleaned glass fiber fabrics comprising resin compatible coatings that offer higher tensile strengths than corresponding fabrics that have been heat cleaned and silane finished. These fabrics can be used in a wide variety of applications, such as reinforcements for composites such as printed circuit boards. In one nonlimiting embodiment, the invention provides a non-heat cleaned fabric comprising a plurality of fiber strands in a warp direction and a fill direction, each fiber strand comprising a plurality of E-glass fiber, and having a resin compatible coating composition on at least a portion of a surface of at least one fiber strand, wherein the fabric has a tensile strength of at least 267 Newtons when measured in the warp direction or fill direction. Although not required, the fabric also has a tensile strength of at least 1.5 times that of a corresponding fabric that is heat cleaned by heating the corresponding fabric to a temperature of at least 380° C. for at least 60 hours and silane finished when measured in the warp direction or fill direction.

Abstract translation: 本发明提供了包含树脂相容性涂层的非热清洁玻璃纤维织物，其具有比已被热清洁和硅烷完成的相应织物更高的拉伸强度。 这些织物可以用于各种各样的应用中，例如用于诸如印刷电路板的复合材料的增强材料。在一个非限制性实施方案中，本发明提供了一种非经热洗涤的织物，其包括经纱方向上的多条纤维束和填充物 方向，每个纤维束包含多个E玻璃纤维，并且在至少一根纤维股的表面的至少一部分上具有树脂相容的涂料组合物，其中所述织物在测量时具有至少267牛顿的拉伸强度 在经向或填充方向。 虽然不是必需的，但是织物的拉伸强度至少是相应织物的1.5倍，通过将相应的织物加热到至少380℃的温度至少60小时而被热清洗，并且当测量时硅烷完成 在经向或填充方向。

公开(公告)号：US20040196620A1

公开(公告)日：2004-10-07

申请号：US10830596

申请日：2004-04-24

Applicant: Shipley Company, L.L.C.

Inventor： Philip D. Knudsen ,  Craig S. Allen

IPC: H01G004/06

CPC classification number: H01G4/206 ,  H05K1/162 ,  H05K2201/0129 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09309 ,  Y10T428/24975 ,  Y10T428/30

Abstract: A dielectric composed of a core material between two polymer layers that have permittivity values less than the core material. The polymer layers provide structural integrity for the dielectric. The dielectric can be employed in a capacitor to fine tune the capacitance of the capacitor. The dielectric and the capacitor may have a thickness in the micron range. Accordingly, the dielectric and capacitor provide for the miniaturization of electronic devices. The dielectric may be employed in decoupling capacitors to reduce noise in electronic devices.

Abstract translation: 由两层聚合物层之间的芯材组成的电介质，其电容率值小于芯材。 聚合物层为电介质提供结构完整性。 可以在电容器中使用电介质来微调电容器的电容。 电介质和电容器可以具有微米范围内的厚度。 因此，电介质和电容器用于电子设备的小型化。 电介质可以用于去耦电容器以减少电子设备中的噪声。