公开(公告)号：US07999194B2

公开(公告)日：2011-08-16

申请号：US12179201

申请日：2008-07-24

Applicant: Yogo Kawasaki ,  Hiroaki Satake ,  Yutaka Iwata ,  Tetsuya Tanabe

Inventor： Yogo Kawasaki ,  Hiroaki Satake ,  Yutaka Iwata ,  Tetsuya Tanabe

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/3457 ,  H05K3/381 ,  H05K3/382 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0796 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the via holes 66 are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes 36 and the via holes 66 to be connected to solder bumps 76 (conductive connection pins 78), respectively, are directly connected to one another, excellent reliability in connection is ensured.

Abstract translation: 通孔36形成为穿透芯基板30和下层层间树脂绝缘层50，并且通孔66分别形成在通孔36上。 由此，通孔36和通路孔66线性配置，能够缩短布线长度，加速信号传输速度。 此外，由于分别连接到焊料凸块76（导电连接销78）的通孔36和通孔66彼此直接连接，所以确保了良好的连接可靠性。

公开(公告)号：US07981504B2

公开(公告)日：2011-07-19

申请号：US12354482

申请日：2009-01-15

Applicant: Kevin G. Nelson

Inventor： Kevin G. Nelson

IPC: B32B5/18 ,  B32B15/08 ,  B32B15/20

CPC classification number: H01B3/445 ,  C08K7/14 ,  C08L27/18 ,  C08L2205/025 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/1131 ,  Y10T428/24322 ,  Y10T428/249953 ,  Y10T428/249991 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/31544 ,  Y10T428/31678

Abstract: The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.

Abstract translation: 本发明包括介电材料的方法和组合物。 本发明的电介质材料包括介电常数大于1.0且小于1.9的材料和/或损耗系数小于0.0009的材料。 其他特征包括能够承受大范围的温度，从大约+ 260℃的高温到约-200℃的低温，在大气条件和压力的大范围（例如高气氛 ，诸如在外层空间中发现的低真空条件以及类似于海平面或海平面以下的条件的条件）。 本发明的电介质材料可以用于复合结构的制造，其可以单独使用或与其它材料组合使用，并且可以用于电子部件或诸如RF互连的装置中。

公开(公告)号：US20110147053A1

公开(公告)日：2011-06-23

申请号：US13059497

申请日：2009-08-18

Applicant: Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga

Inventor： Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga

IPC: H05K1/00

CPC classification number: H05K1/0234 ,  H05K1/0218 ,  H05K1/167 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/2036 ,  Y10T428/24331 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.

Abstract translation: 通过粘合层将具有形成在覆盖膜体的表面上的电阻层的覆盖层膜粘附到具有形成在基板表面上的导电层的印刷线路板主体而形成印刷布线板。 电阻层通过粘合剂层与导电层分离并与之相对。

公开(公告)号：US20110122600A1

公开(公告)日：2011-05-26

申请号：US13019523

申请日：2011-02-02

Applicant: Chul Hee YOO ,  Ho Sik Ahn

Inventor： Chul Hee YOO ,  Ho Sik Ahn

IPC: F21V29/00 ,  G09F13/04

CPC classification number: F21V29/70 ,  G02F1/133603 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4069 ,  H05K2201/0209 ,  H05K2201/09072 ,  H05K2201/10106

Abstract: A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly.

Abstract translation: 本发明的背光单元的厚度，重量和制造成本降低，但散热效率提高。 在背光单元中，柔性印刷电路板具有穿孔的至少一个通孔。 LED封装设置在与通孔对应的柔性印刷电路板的顶部上。 本发明的背光单元采用柔性印刷电路板代替金属印刷电路板作为将电流传导到LED封装的手段。 这产生了更薄和更轻的背光单元，并且还节省制造成本。 此外，LED封装通过导热粘合剂直接接合到底板上，从而确保从LED封装产生的热量更快地释放。

公开(公告)号：US07949220B2

公开(公告)日：2011-05-24

申请号：US12374121

申请日：2007-07-19

Applicant: Tomoaki Shibata ,  Masato Miyatake ,  Atsushi Takahashi ,  Masatoshi Yamaguchi

Inventor： Tomoaki Shibata ,  Masato Miyatake ,  Atsushi Takahashi ,  Masatoshi Yamaguchi

IPC: G02B6/12 ,  G02B6/13

CPC classification number: H05K1/0274 ,  H05K3/0023 ,  H05K2201/0112 ,  H05K2201/0209

Abstract: The present invention provides a hybrid optical/electrical circuit board in which an optical waveguide prepared by an exposing and developing step is combined with an electric circuit, wherein a printed wiring board containing an inorganic filler and a light absorber is used, and it has an optical waveguide core pattern having a high resolution and makes it possible to raise a density of optical wiring.

Abstract translation: 本发明提供了一种混合光电路板，其中通过曝光和显影步骤制备的光波导与电路组合，其中使用包含无机填料和光吸收剂的印刷线路板，并且其具有 光波导芯图案具有高分辨率并且可以提高光布线的密度。

公开(公告)号：US07943291B2

公开(公告)日：2011-05-17

申请号：US12490815

申请日：2009-06-24

Applicant: Tsukasa Tokunaga ,  Akira Ichiki ,  Yuichi Shirasaki

Inventor： Tsukasa Tokunaga ,  Akira Ichiki ,  Yuichi Shirasaki

IPC: G03C1/005 ,  G03C1/494 ,  G03C5/00 ,  G03C1/06 ,  G03C1/76

CPC classification number: H05K3/106 ,  G03C1/853 ,  H05K2201/0209 ,  H05K2201/0326 ,  Y10T428/24802

Abstract: A photosensitive material for forming a conductive film having a support, a silver salt-containing emulsion layer over the support, and one or more optional layers formed over the support or the silver salt-containing emulsion layer side of the support, wherein any one of the silver salt-containing emulsion layer or the optional layer(s) contains conductive fine particles and a binder, and the ratio by mass of the conductive fine particles to the binder (the conductive fine particles/the binder) is from 1/33 to 1.5/1.

Abstract translation: 一种用于形成具有载体的导电膜的感光材料，在载体上的含银盐的乳液层，以及形成在载体上的一个或多个任选的层或载体的含银盐乳剂层侧，其中任何一个 含银盐乳剂层或任选的层含有导电性微粒和粘合剂，导电性微粒与粘合剂的比例（导电性微粒/粘合剂）的比例为1/33〜 1.5 / 1。

公开(公告)号：US20110108309A1

公开(公告)日：2011-05-12

申请号：US12909462

申请日：2010-10-21

Applicant: Joel S. Peiffer

Inventor： Joel S. Peiffer

IPC: H05K1/09 ,  C08L63/00 ,  C08K3/22 ,  C08K3/36 ,  H05K1/03

CPC classification number: H05K1/162 ,  C08K3/10 ,  C08K3/22 ,  C08K3/36 ,  C08K2003/2206 ,  C08K2003/2237 ,  C08L63/00 ,  H05K2201/0209

Abstract: Provided is a dielectric material having a non-halogenated diaminodiphenylsulfone curing agent.

Abstract translation: 提供具有非卤化二氨基二苯砜固化剂的介电材料。

公开(公告)号：US20110097587A1

公开(公告)日：2011-04-28

申请号：US12605368

申请日：2009-10-25

Applicant: Li-Chun Chen

Inventor： Li-Chun Chen

IPC: B32B17/10 ,  C08L63/00

CPC classification number: H05K1/0353 ,  C08G59/3272 ,  C08G59/4014 ,  C08G59/621 ,  C08L63/04 ,  C08L2205/02 ,  C09D163/04 ,  H05K1/0326 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  C08L2666/22

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract translation: 无卤清漆包括（A）树脂，（B）固化剂，（C）阻燃剂（阻燃剂），（D）促进剂和（E）添加剂。 （A）的树脂具有酚醛环氧树脂，DOPO-CNE和DOPO-HQ-CNE。 （B）的固化剂包括苯并恶嗪树脂和酚醛清漆树脂。 将玻璃织物布浸入无卤清漆中，形成具有更好的热稳定性，抗燃性，低吸水能力和较高固化速度的预浸料。 此外，预浸料具有更多的韧性。

公开(公告)号：US07931518B2

公开(公告)日：2011-04-26

申请号：US12376033

申请日：2007-08-03

Applicant: Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

Inventor： Hidefumi Kotsubo ,  Tatsuya Funaki ,  Kiyomi Sasaki

IPC: H01J9/12

CPC classification number: H05K9/0096 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/30 ,  C23C18/31 ,  H05K3/182 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2203/0709 ,  H05K2203/124 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2826

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method.A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.

Abstract translation: 本发明提供一种通过简单的方法制备透光性好，电磁波屏蔽性优异，外观性优异，易读性好的透光性电磁波屏蔽材料的制造方法。 一种制备透光电磁波屏蔽材料的方法，包括： （A1）在透明基板11上印刷包含贵金属化合物和硅烷偶联剂和唑化合物的混合物或其反应产物的化学镀的预处理剂，以形成网状图案化预处理层12，以及 （A2）对预处理层12进行化学镀以在预处理层12上形成网格图案化的金属导电层13。

公开(公告)号：US07911050B2

公开(公告)日：2011-03-22

申请号：US12078937

申请日：2008-04-08

Applicant: Keiichi Nakajima

Inventor： Keiichi Nakajima

IPC: H01L23/34

CPC classification number: H05K1/0209 ,  H01L21/563 ,  H01L23/373 ,  H01L23/4985 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H05K1/189 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0215 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A COF which can effectively dissipate the heat by using a simple structure and its manufacturing method. A semiconductor device of COF, which is formed over the main surface of a flexible substrate having no device hole and where a semiconductor chip is mounted over the inner lead interconnection, is characterized by forming a first resin layer over the second main surface of the flexible substrate opposite the side where the semiconductor chip is mounted and at the position corresponding to the semiconductor chip.

Abstract translation: COF可以通过简单的结构及其制造方法有效地散热。 COF的半导体器件，其形成在不具有器件孔的柔性衬底的主表面上，并且其中半导体芯片安装在内部引线互连件上方，其特征在于在柔性的第二主表面上形成第一树脂层 衬底与半导体芯片安装的一侧相对，并且位于对应于半导体芯片的位置。