公开(公告)号：US20100193232A1

公开(公告)日：2010-08-05

申请号：US12424511

申请日：2009-04-15

Applicant: Myung Sam Kang ,  Ok Tae Kim ,  Gil Yong Shin ,  Kil Yong Yun

Inventor： Myung Sam Kang ,  Ok Tae Kim ,  Gil Yong Shin ,  Kil Yong Yun

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/4084 ,  H05K3/205 ,  H05K3/328 ,  H05K2201/091 ,  H05K2203/063 ,  H05K2203/1115 ,  H05K2203/1572 ,  Y10T29/49155

Abstract: Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.

Abstract translation: 这里公开了印刷电路板和制造印刷电路板的工艺。 印刷电路板包括绝缘层和设置在绝缘层两侧的电路层，每个电路层包括焊盘部分和图案部分。 形成在绝缘层两侧的接地部分使用电阻焊接彼此连接。 不需要诸如通孔或凸块的单独的层间连接结构和形成层间连接结构的过程，因此简化了印刷电路板和工艺。

公开(公告)号：US07687312B2

公开(公告)日：2010-03-30

申请号：US11856867

申请日：2007-09-18

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L21/00

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/142 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  Y10T428/31678 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.

Abstract translation: 公开了一种制造多层基板的混合结构的方法。 该方法包括以下步骤：将与相应电介质层的边界区连接的至少一个金属层的边界区域与相邻的金属层和相邻的电介质层分别用于每个多层基板并连接金属层的金属层的分离边界 一个多层基板，具有另一多层基板的金属层的分离边界区域，以形成连接部分。 所述混合结构至少包括第一多层基板和第二多层基板。 至少一个第一金属层与至少一个第二金属层连接以形成连接部分。

公开(公告)号：US20100032198A1

公开(公告)日：2010-02-11

申请号：US12528401

申请日：2008-02-20

Applicant: Hirobumi Inoue

Inventor： Hirobumi Inoue

IPC: H05K1/02

CPC classification number: H05K1/025 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/183 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/091 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/10446 ,  H05K2201/10484

Abstract: An inclined peripheral portion 103 having a tapered shape in a cross-sectional view, in which the thickness thereof is reduced toward the edge of an interconnection substrate 102, is provided at the edge of the interconnection substrate 102. In addition, inner layers 112 are provided such that the distance therebetween is reduced toward the edge of the interconnection substrate in the inclined peripheral portion 103. A first interconnection conductor 104 and a second interconnection conductor 105 are provided on both inclined planes of the inclined peripheral portion 103 so as to be electrically connected to each other at the leading end of the inclined peripheral portion 103.

Abstract translation: 在互连基板102的边缘处设置有在横截面视图中具有锥形形状的倾斜周边部分103，其中其厚度朝向互连基板102的边缘减小。另外，内层112 被设置为使得它们之间的距离朝向倾斜周边部分103中的互连基板的边缘减小。第一互连导体104和第二互连导体105设置在倾斜周边部分103的两个倾斜平面上，以便电 在倾斜周边部103的前端彼此连接。

公开(公告)号：US07655103B2

公开(公告)日：2010-02-02

申请号：US11738658

申请日：2007-04-23

Applicant: Osamu Chikagawa

Inventor： Osamu Chikagawa

IPC: C03B29/00 ,  C03B29/06 ,  C03B29/02 ,  C03B29/16

CPC classification number: H05K1/186 ,  B32B18/00 ,  C04B35/632 ,  C04B35/634 ,  C04B35/63404 ,  C04B35/653 ,  C04B37/008 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/656 ,  C04B2235/6583 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/091 ,  H05K2201/10636 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T428/24926

Abstract: In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.

Abstract translation: 在制造陶瓷多层基板的方法中，当通过堆叠多个陶瓷生片制备的生坯陶瓷堆叠与设置在生陶瓷堆叠内的陶瓷芯片电子部件同时烧制并且包括外部端子电极以制造陶瓷多层基板 内部具有陶瓷芯片电子部件的基板，预先在陶瓷芯片电子部件和绿色陶瓷叠层之间设置糊状层，将其烧成。

公开(公告)号：US20100014016A1

公开(公告)日：2010-01-21

申请号：US12504730

申请日：2009-07-17

Applicant: Ming-Da Chen ,  Ping-Yu Liang ,  Chin-Liang Chen

Inventor： Ming-Da Chen ,  Ping-Yu Liang ,  Chin-Liang Chen

IPC: G02F1/1333 ,  G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2202/22 ,  H05K1/0215 ,  H05K1/0393 ,  H05K2201/09063 ,  H05K2201/091

Abstract: A flexible printed circuit used for being disposed between a frame and a conductive casing of a liquid crystal module is provided. The frame includes a main plate and a side plate which is connected to a side of the main plate. The flexible printed circuit includes a body and a grounding portion. The body is used for being disposed on the main plate of the frame. The grounding portion extends from the body. The grounding portion is bent to a predetermined angle with respect to the body, so that the grounding portion is disposed on the side plate of the frame. The grounding portion has a metal layer contacting an inner wall of a side plate of the conductive casing. The flexible printed circuit has a hole located at the position where the grounding portion is connected the body.

Abstract translation: 提供了用于设置在液晶模块的框架和导电壳体之间的柔性印刷电路。 框架包括主板和连接到主板一侧的侧板。 柔性印刷电路包括主体和接地部分。 主体用于设置在框架的主板上。 接地部分从主体延伸。 接地部分相对于本体弯曲到预定角度，使得接地部分设置在框架的侧板上。 接地部分具有与导电壳体的侧板的内壁接触的金属层。 柔性印刷电路具有位于接地部与主体连接的位置的孔。

公开(公告)号：US07649745B2

公开(公告)日：2010-01-19

申请号：US11557709

申请日：2006-11-08

Applicant: Pascal Meier ,  Sanjay Dabral

Inventor： Pascal Meier ,  Sanjay Dabral

IPC: H05K7/00

CPC classification number: H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

Abstract: A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract translation: 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US20090277684A1

公开(公告)日：2009-11-12

申请号：US12158904

申请日：2006-12-19

Applicant: Shigemasa Takahashi ,  Takashi Yamada ,  Shinji Mizuno ,  Masahiro Kitahara ,  Daisuke Makino

Inventor： Shigemasa Takahashi ,  Takashi Yamada ,  Shinji Mizuno ,  Masahiro Kitahara ,  Daisuke Makino

IPC: H05K5/00 ,  B29C45/14

CPC classification number: B29C45/14655 ,  B29C2045/14983 ,  H01L21/565 ,  H01L23/3135 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/483 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/1815 ,  H05K1/189 ,  H05K3/284 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.

Abstract translation: 电子部件安装结构包括其上形成有端子连接图案的柔性电路板和设置有电极的发光部件。 将发光部件放置在柔性电路板上，将合成树脂壳体注射成型以覆盖发光部件和围绕放置在其上的发光部件的柔性电路基板的一部分，由此， 柔性电路板的发光部件和端子连接图案彼此抵靠接触地连接。

公开(公告)号：US20090185357A1

公开(公告)日：2009-07-23

申请号：US12016089

申请日：2008-01-17

Applicant: Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Paul Brian Jaynes ,  Philip Anthony Marvin

Inventor： Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Paul Brian Jaynes ,  Philip Anthony Marvin

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H01H13/704 ,  H01H11/00 ,  H05K1/0284 ,  H05K3/303 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4632 ,  H05K2201/0141 ,  H05K2201/091 ,  Y10T29/49107 ,  Y10T29/4913

Abstract: An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Abstract translation: 电子设备包括具有在其中限定薄膜开关凹部的非平面三维形状的多层电路板。 多层电路板可以包括至少一个液晶聚合物（LCP）层和至少一个导电图案层，其上限定了与薄膜开关凹部相邻的至少一个薄膜开关电极以限定薄膜开关。 电子器件还可以包括填充薄膜开关凹部的可压缩电介质材料。 电子设备还可以包括膜开关凹部内的至少一个弹簧构件。

公开(公告)号：US20090086009A1

公开(公告)日：2009-04-02

申请号：US12191901

申请日：2008-08-14

Applicant: Yoshitatsu Naito ,  Mitsuhiro Suzuki ,  Tomotsugu Katoh

Inventor： Yoshitatsu Naito ,  Mitsuhiro Suzuki ,  Tomotsugu Katoh

IPC: B41J2/47

CPC classification number: H05K3/0082 ,  G03F7/2053 ,  G03F9/00 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/091 ,  H05K2201/09918 ,  H05K2203/082 ,  H05K2203/107 ,  H05K2203/1563 ,  H05K2203/1572 ,  H05K2203/167

Abstract: A laser beam direct imaging apparatus and an imaging method which can precisely determine a back-surface-side position with respect to a front-surface-side position even if any kind of photosensitive material is used. In the laser direct imaging apparatus, a laser beam is deflected toward a main scanning direction (X-axis direction) while a workpiece mounted on a table is moved in a sub-scanning direction (Y-axis direction) so that a pattern is imaged on the surface of the workpiece. Hollow pins are disposed on the table so that the tips of the hollow pins 20 project over the surface of the table by a predetermined distance. The workpiece is sucked onto the table so that indentations (indentations by the tips of the hollow pins) are formed on the back surface of the workpiece. When a pattern is imaged on the back surface, imaging is performed with reference to the indentations.

Abstract translation: 即使使用任何种类的感光材料，也可以精确地确定相对于前表面侧位置的背面侧位置的激光束直接成像装置和成像方法。 在激光直接成像装置中，激光束朝向主扫描方向（X轴方向）偏转，同时安装在工作台上的工件沿副扫描方向（Y轴方向）移动，使得图案被成像 在工件表面。 空心销设置在桌子上，使得中空销20的尖端在桌子的表面上突出预定距离。 工件被吸入工作台上，使得在工件的后表面上形成有凹陷（由中空销的顶端压入）。 当在背面上成像图案时，参考凹痕进行成像。

公开(公告)号：US20090020326A1

公开(公告)日：2009-01-22

申请号：US12146032

申请日：2008-06-25

Applicant: Michimasa TAKAHASHI ,  Masakazu AOYAMA

Inventor： Michimasa TAKAHASHI ,  Masakazu AOYAMA

IPC: H01R12/04 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。