-
公开(公告)号：US20170257944A1
公开(公告)日：2017-09-07
申请号：US15505220
申请日：2015-08-28
Applicant: Nokia Technologies Oy
Inventor： Adam ROBINSON , Darryl COTTON , Piers ANDREW
IPC: H05K1/02 , H05K1/18 , H01L23/498 , H05K3/10
CPC classification number: H05K1/0283 , H01L23/4985 , H05K1/189 , H05K3/103 , H05K2201/0314 , H05K2201/0394 , H05K2201/09263
Abstract: An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.
-
公开(公告)号：US20170253019A1
公开(公告)日：2017-09-07
申请号：US15231949
申请日：2016-08-09
Applicant: FUJI XEROX CO., LTD.
Inventor： Kazuhiro HAYASHI , Koichi HAGA , Shuichi YAMADA , Mutsuya TAKAHASHI , Michiaki MURATA
IPC: B41F15/34
CPC classification number: B41F15/34 , B41F15/0813 , B41F15/0827 , B41F15/0845 , B41F15/0854 , B41F15/0872 , B41F15/0895 , B41M1/12 , B41M1/40 , G03G15/1655 , G03G15/20 , G03G15/2053 , G03G2215/2035 , H05K1/0212 , H05K1/053 , H05K1/167 , H05K3/1216 , H05K3/1233 , H05K3/284 , H05K2201/017 , H05K2201/09263 , H05K2203/0323
Abstract: A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.
-
公开(公告)号：US20170213923A1
公开(公告)日：2017-07-27
申请号：US15325045
申请日：2015-07-06
Applicant: Sumitomo Electric Industries, Ltd.
Inventor： Kazumasa Toya , Takashi Iwasaki , Youichi Nagai , Koji Mori , Kenji Saito , Rui Mikami , Takeshi Yamana
CPC classification number: H01L31/03926 , H01L31/02013 , H01L31/0508 , H01L31/0543 , H02S20/32 , H02S30/10 , H02S40/22 , H02S40/42 , H05K1/028 , H05K1/189 , H05K2201/046 , H05K2201/09263 , H05K2201/10121 , Y02E10/52
Abstract: This power generation module includes: a power generating portion (30) including a power generating element (19); and a wiring substrate. The wiring substrate includes: a reinforcement plate; and a flexible printed circuit (79) provided above the reinforcement plate. The flexible printed circuit (79) has: an FPC land portion (70) configured to have the power generating portion (30) mounted thereto; and a FPC wire portion (73) connected to the FPC land portion (70). The width of the FPC wire portion (73) is smaller than the width of the FPC land portion (70).
-
公开(公告)号：US20170213648A1
公开(公告)日：2017-07-27
申请号：US15329151
申请日：2015-07-31
Inventor： Margaret K. JOYCE , Michael James JOYCE , Ali ESHKEITI , Massood Zandi ATASHBAR , Paul D. FLEMING, III
IPC: H01G4/30 , H01G11/86 , H01G11/22 , H01L21/683 , B41M5/00 , B41M1/22 , H01Q1/38 , H01Q1/22 , H01F27/28 , H01G4/32
CPC classification number: H01G4/30 , B41M1/22 , B41M5/0023 , G01L1/142 , G01L1/2287 , H01F27/2804 , H01F41/042 , H01G4/32 , H01G4/33 , H01G11/22 , H01G11/86 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01Q1/2225 , H01Q1/273 , H01Q1/38 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/007 , H05K3/20 , H05K3/207 , H05K2201/09263 , H05K2203/0769 , H05K2203/0783 , H05K2203/1461 , H05K2203/308
Abstract: A method of forming a self-supported electronic device, including depositing a sacrificial layer on a first surface substrate, wherein the sacrificial layer is substantially soluble in a first solvent. At least one device layer is deposited in a desired pattern on top of the sacrificial layer. The at least one device layer is substantially insoluble in the at least one device layer. The sacrificial layer is at least partially dissolved in the first solvent to release at least a portion of the first device layer from the substrate. The at least one device layer removed from the substrate forms a self-supported electronic device, which is a thin film electronic device having at least a portion thereof that is not supported by a material carrier.
-
公开(公告)号：US20170142839A1
公开(公告)日：2017-05-18
申请号：US14943234
申请日：2015-11-17
Applicant: Intel Corporation
Inventor： Aleksandar Aleksov , Srinivas Pietambaram , Rahul N. Manepalli
CPC classification number: H05K1/184 , H01L2224/04105 , H01L2924/18162 , H05K1/0283 , H05K1/0298 , H05K1/113 , H05K1/185 , H05K3/007 , H05K3/4697 , H05K2201/0133 , H05K2201/09263 , H05K2203/0191 , H05K2203/1469
Abstract: An embedded electronic package includes a stretchable body that includes at least one electronic component, wherein each electronic component includes a back side that is exposed from the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components. In some forms, the embedded electronic package includes a stretchable body that includes an upper surface and a lower surface, wherein the stretchable body includes at least one electronic component, wherein each electronic component is fully embedded in the stretchable body and the same distance from the upper surface of the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components.
-
Patent Agency Ranking
公开(公告)号：US09631799B2
公开(公告)日：2017-04-25
申请号：US14943358
申请日：2015-11-17
Applicant: LongWide Technology Inc.
Inventor： Huan-Jan Chien , Tsung-Hong Tsai
IPC: F21V21/00 , F21V15/01 , H05K3/20 , F21V29/77 , F21V23/00 , F21K9/232 , H05K1/18 , F21Y101/00 , F21Y115/10 , F21Y107/20 , F21Y113/13 , F21Y113/17
CPC classification number: F21V21/00 , F21K9/232 , F21V15/01 , F21V23/001 , F21V29/773 , F21Y2101/00 , F21Y2107/20 , F21Y2113/13 , F21Y2113/17 , F21Y2115/10 , H05K1/181 , H05K1/189 , H05K3/202 , H05K2201/0397 , H05K2201/09263 , H05K2201/10106
Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.
-
公开(公告)号：US09630701B2
公开(公告)日：2017-04-25
申请号：US14191873
申请日：2014-02-27
Applicant: Goodrich Corporation
Inventor： Jin Hu
IPC: H05B1/00 , B64C1/18 , B64D13/00 , F24D13/02 , H05B3/16 , H05K3/38 , H05B3/26 , H05K3/12 , H05K1/16
CPC classification number: B64C1/18 , B64D13/00 , F24D13/024 , F24D2200/08 , F24D2220/2081 , H05B3/16 , H05B3/26 , H05B2203/003 , H05B2203/013 , H05B2203/017 , H05K1/167 , H05K3/1216 , H05K3/1283 , H05K3/38 , H05K2201/09263 , Y02B30/26 , Y10T29/49155 , Y10T29/49162
Abstract: A method for providing an electrical connection for conductive ink includes direct writing a bus bar onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit. An aircraft heated floor panel includes at least one floor panel of an aircraft. The one floor panel includes a conductive circuit having a conductive ink including a bus bar directly written onto areas of a desired electrical connection of the conductive ink. The conductive ink is screen printed onto a dielectric film to create a conductive circuit.
-
公开(公告)号：US09623951B2
公开(公告)日：2017-04-18
申请号：US14179281
申请日：2014-02-12
Applicant: Goodrich Corporation
Inventor： Jin Hu , Richard R. Hamm , Kevin E. Roach
IPC: B60L1/02 , B64C1/18 , B64D13/00 , F24D13/02 , H05B3/16 , H05K3/38 , H05B3/26 , H05K3/12 , H05K1/16
CPC classification number: B64C1/18 , B64D13/00 , F24D13/024 , F24D2200/08 , F24D2220/2081 , H05B3/16 , H05B3/26 , H05B2203/003 , H05B2203/013 , H05B2203/017 , H05K1/167 , H05K3/1216 , H05K3/1283 , H05K3/38 , H05K2201/09263 , Y02B30/26 , Y10T29/49155 , Y10T29/49162
Abstract: A method of forming a heating element includes depositing a conductive ink of silver particles in an epoxy resin on a dielectric film to create a conductive circuit, and heat curing the conductive circuit to achieve a resistivity of the heating element less than 1.68×10−6 ohm·meter. An aircraft heated floor panel includes at least one floor panel of an aircraft includes a conductive circuit positioned within the floor panel having a conductive ink of silver particles in an epoxy resin on a dielectric film.
-
公开(公告)号：US20170094808A1
公开(公告)日：2017-03-30
申请号：US14941908
申请日：2015-11-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , Silvio DRAGONE , Roger S. KRABBENHOFT , David C. LONG , Stefano S. OGGIONI , Michael T. PEETS , William SANTIAGO-FERNANDEZ
CPC classification number: G01D5/16 , H05K1/0275 , H05K1/0298 , H05K1/182 , H05K3/30 , H05K3/32 , H05K2201/09263 , H05K2201/096 , H05K2201/10151 , H05K2201/10371
Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
-
公开(公告)号：US09449204B1
公开(公告)日：2016-09-20
申请号：US14721301
申请日：2015-05-26
Applicant: UNIFORM INDUSTRIAL CORP.
Inventor： Yu-Tsung Chen , Jian-Jie Wang
CPC classification number: G06K7/084 , G07F7/0873 , G07F19/2055 , H05K1/0275 , H05K1/028 , H05K2201/09263 , H05K2203/175
Abstract: This anti-recording card reading device includes: a magnetic card reading head having a data reading terminal and a flexible circuit board, where the flexible circuit board has a plurality of ear-fold portions, a first line layer of the flexible circuit board is provided with a signal transmission line, a first protection line is disposed on two sides of the signal transmission line, a second line layer is provided with a second protection line, and the ear-fold portions can be fold and fitted in the magnetic card reading head; a mainboard, disposed neighboring to a card reading component; an anti-tamper framework, disposed on the mainboard; and a protection area bounded by the anti-tamper framework, where a terminal section of the flexible circuit board is connected to the data reading terminal, and the other side extends into the protection area and is connected to the mainboard.
Abstract translation: 该反录音卡读取装置包括：具有数据读取端子和柔性电路板的磁卡读取头，其中柔性电路板具有多个耳朵部分，提供柔性电路板的第一线路层 利用信号传输线，第一保护线设置在信号传输线的两侧，第二线层设置有第二保护线，并且耳部可折叠并安装在磁卡读卡头 ; 与读卡部件相邻设置的主板; 设置在主板上的防篡改框架; 以及由抗篡改框架限定的保护区域，其中柔性电路板的端子部分连接到数据读取端子，另一侧延伸到保护区域中并连接到主板。
-
-
-
-
-
-
-
-
-
Search Results
852
records
(took 0.022 seconds)
