公开(公告)号：US20140264659A1

公开(公告)日：2014-09-18

申请号：US14207443

申请日：2014-03-12

Applicant: BISHNU PRASANNA GOGOI

Inventor： BISHNU PRASANNA GOGOI

IPC: B81B7/02

CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

Abstract: A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

Abstract translation: 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。

公开(公告)号：US20140264656A1

公开(公告)日：2014-09-18

申请号：US14174639

申请日：2014-02-06

Applicant: InvenSense, Inc.

Inventor： Erhan Polatkan ATA ,  Martin LIM ,  Xiang LI ,  Stephen LLOYD ,  Michael Julian DANEMAN

IPC: B81B7/00

CPC classification number: B81B7/0061 ,  B81B3/001 ,  B81B2201/0257 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2207/012 ,  H04R19/005

Abstract: A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.

Abstract translation: 公开了MEMS器件。 MEMS器件包括具有第一表面和第二表面的第一板; 以及附接到第一基板的锚。 MEMS器件还包括具有附接到第一板的第三表面和第四表面的第二板。 连杆将锚固件连接到第一板，其中第一板和第二板在第一板的第一和第二表面之间存在声压差的情况下移位。 第一板，第二板，连杆和锚固件都包含在由第一基板和第二基板形成的外壳中，其中第一和第二基板中的一个包含通孔，以将第一板的第一表面暴露于 环境。

公开(公告)号：US08837754B2

公开(公告)日：2014-09-16

申请号：US13402761

申请日：2012-02-22

Applicant: Kevin Formosa ,  Mark Anthony Azzopardi ,  Mario Francesco Cortese ,  Mark Shaw ,  Alex Gritti ,  Luca Maggi ,  Filippo David

Inventor： Kevin Formosa ,  Mark Anthony Azzopardi ,  Mario Francesco Cortese ,  Mark Shaw ,  Alex Gritti ,  Luca Maggi ,  Filippo David

IPC: H04R25/00 ,  H04R19/00 ,  B81C1/00 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R19/04 ,  H04R21/02

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/093 ,  B81C1/0023 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/3025 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.

Abstract translation: MEMS传感器具有微机械感测结构和封装。 该封装设置有承载第一电连接元件的基板，并具有耦合到该基板的盖，以限定其中容纳有微机械感测结构的内部空腔。 盖子由以下部分形成：盖层，具有彼此相对设置的第一表面和第二表面，第一表面限定包装的外表面，第二表面面向包装内的基材; 以及壁结构，其设置在所述盖层和所述基板之间，并且具有联接到所述基板的耦合面。 至少第一电气部件耦合到盖层的第二表面，在封装内部，并且壁结构的耦合面承载第二电连接元件，电连接到第一电气部件和第一电连接 元素。

公开(公告)号：US20140246739A1

公开(公告)日：2014-09-04

申请号：US14142744

申请日：2013-12-27

Applicant: Unisem (M) Berhad

Inventor： Rob Protheroe ,  Alan Evans ,  Timothy Leung ,  Tang Ming Xiang ,  Guan JunHua

IPC: B81C1/00 ,  B81B7/00

CPC classification number: H01L29/84 ,  B81B7/0041 ,  B81B7/0058 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00269 ,  B81C1/00309 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/052 ,  G01L9/0042 ,  H01L23/053 ,  H01L2224/16225 ,  H04R1/021 ,  H04R1/04 ,  H04R2201/003

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

Abstract translation: 一种用于制造封装微电子机械系统（MEMS）装置的封装件的方法提供了具有盖和侧壁的盖，端盖延伸穿过盖。 第一基部部件结合到限定内部空腔的侧壁。 该第一基座部件还包括延伸穿过其中的孔。 MEMS器件通过孔插入并且与MEMS器件结合到盖上，至少部分地与端口重叠。 通过将第二基部部件接合到第一基部部件以密封孔来完成组装。 如此形成的包装具有盖，盖，侧壁和延伸穿过盖的端口。 MEMS器件被接合到盖并且电连接到设置在第一基底部件上的导电特征。 第二基部部件结合到跨越孔的第一基部部件。

公开(公告)号：US20140230557A1

公开(公告)日：2014-08-21

申请号：US13772183

申请日：2013-02-20

Applicant: Agency for Science Technology and Research (A"STAR) ,  PGS GEOPHYSICAL AS

Inventor： Jinghui Xu ,  Julius Ming-Lin Ming-Lin Tsai ,  Winston Sun ,  Chengliang Sun

IPC: B81B3/00 ,  G01H3/00

CPC classification number: B81C1/00182 ,  B81B2201/0257 ,  G01H11/08 ,  G01V1/186

Abstract: A method and apparatus for detecting underwater sounds is disclosed. An embodiment of the apparatus includes a substrate with a vacuum-sealed cavity. A support structure and an acoustic pressure sensor are situated on the substrate. The support structure of the apparatus may include a first oxide layer situated on the substrate, a silicon layer situated on the first oxide layer, and a second oxide layer situated on the silicon layer. The acoustic pressure sensor of the apparatus includes a first electrode layer situated on the substrate, a piezoelectric layer situated on the first electrode layer, and a second electrode layer situated on the piezoelectric layer. In one embodiment, the surface area of the second electrode layer is between about 70 to 90 percent of the surface area of the piezoelectric layer. In various embodiments, the support structure is thicker than the piezoelectric layer.

Abstract translation: 公开了一种用于检测水下声音的方法和装置。 该装置的实施例包括具有真空密封空腔的基板。 支撑结构和声压传感器位于基板上。 该装置的支撑结构可以包括位于基底上的第一氧化物层，位于第一氧化物层上的硅层和位于硅层上的第二氧化物层。 设备的声压传感器包括位于基板上的第一电极层，位于第一电极层上的压电层和位于压电层上的第二电极层。 在一个实施例中，第二电极层的表面积在压电层的表面积的约70％至90％之间。 在各种实施例中，支撑结构比压电层厚。

公开(公告)号：US08809973B2

公开(公告)日：2014-08-19

申请号：US13747499

申请日：2013-01-23

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: H01L29/84

CPC classification number: B81C1/00333 ,  B81B3/0018 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/09 ,  B81C1/0023 ,  B81C1/00261 ,  B81C2203/0109 ,  B81C2203/0154 ,  H01L29/84 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/1815 ,  H04R1/08 ,  H01L2924/00014

Abstract: In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.

Abstract translation: 在各种实施例中，提供了一种用于制造芯片封装的方法。 该方法包括在衬底上布置芯片，芯片包括麦克风结构和麦克风结构的开口; 并且用封装材料封装芯片，使得开口保持至少部分地不包封封装材料。

公开(公告)号：US08796790B2

公开(公告)日：2014-08-05

申请号：US12490292

申请日：2009-06-23

Applicant: Xiao (Charles) Yang

Inventor： Xiao (Charles) Yang

IPC: H01L29/84

CPC classification number: B81C1/00246 ,  B81B2201/0257 ,  H04R19/005 ,  H04R2201/003

Abstract: A monolithically integrated MEMS and CMOS substrates provided by an IC-foundry compatible process. The CMOS substrate is completed first using standard IC processes. A diaphragm with stress relief corrugated structure is then fabricated on top of the CMOS. Air vent holes are then etched in the CMOS substrate. Finally, the microphone device is encapsulated by a thick insulating layer at the wafer level. The monolithically integrated microphone that adopts IC foundry-compatible processes yields the highest performance, smallest form factor, and lowest cost. Using this architecture and fabrication flow, it is feasible and cost-effective to make an array of Silicon microphones for noise cancellation, beam forming, better directionality and fidelity.

Abstract translation: 由IC-Foundry兼容工艺提供的单片集成MEMS和CMOS衬底。 CMOS基板首先使用标准IC工艺完成。 然后在CMOS的顶部制造具有应力消除波纹结构的隔膜。 然后在CMOS衬底中蚀刻通气孔。 最后，麦克风设备被晶片级的厚绝缘层封装。 采用IC代工兼容工艺的单片式麦克风产生最高的性能，最小的外形尺寸和最低的成本。 使用这种架构和制造流程，制造用于噪声消除，波束形成，更好的方向性和保真度的硅麦克风阵列是可行和成本有效的。

公开(公告)号：US08776059B2

公开(公告)日：2014-07-08

申请号：US13591901

申请日：2012-08-22

Applicant: John Reumann ,  Debanjan Saha ,  Sambit Sahu ,  Dinesh Chandra Verma

Inventor： John Reumann ,  Debanjan Saha ,  Sambit Sahu ,  Dinesh Chandra Verma

IPC: G06F9/455

CPC classification number: G06F9/455 ,  B81B7/0061 ,  B81B2201/0257 ,  G06F9/45533 ,  G06F9/5077 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H04L63/0227 ,  H04L63/0263 ,  H04L63/0272 ,  H04L63/101 ,  H04L63/20 ,  H04R1/04 ,  H04R1/2869 ,  H04R19/005 ,  H04R31/006 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A computer implemented method of virtual machine migration with filtered network connectivity includes enforcing network security and routing at a hypervisor layer which is independent of guest operating systems via dynamic updating of routing controls initiated by a migration of said virtual machine from a first device to a second device.

Abstract translation: 具有过滤的网络连接的计算机实现的虚拟机迁移的方法包括通过动态更新由所述虚拟机从第一设备迁移到第二设备的路由控制来执行独立于客户操作系统的管理程序层的网络安全性和路由 设备。

公开(公告)号：US08765530B1

公开(公告)日：2014-07-01

申请号：US13838319

申请日：2013-03-15

Applicant: Knowles Electronics, LLC

Inventor： Anthony D. Minervini

IPC: H01L21/00 ,  H04R31/00 ,  H01L23/12 ,  H04R11/04

CPC classification number: H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

公开(公告)号：US08715514B2

公开(公告)日：2014-05-06

申请号：US13434622

申请日：2012-03-29

Applicant: Jae Woo Lee ,  Kang Ho Park ,  Jong Dae Kim

Inventor： Jae Woo Lee ,  Kang Ho Park ,  Jong Dae Kim

IPC: B44C1/22 ,  C23F1/00 ,  B81C1/00 ,  H04R3/00

CPC classification number: B81C1/00182 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0285 ,  H04R3/00 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

Abstract: Provided are a micro-electromechanical systems (MEMS) microphone and a method of manufacturing the same. A manufacturing process is simplified compared to a conventional art using both upper and lower substrate processes. Since defects which may occur during manufacturing are reduced due to the simplified manufacturing process, the manufacturing throughput is improved, and since durability of the MEMS microphone is improved, system stability against the external environment is improved.

Abstract translation: 提供了一种微机电系统（MEMS）麦克风及其制造方法。 与使用上基板工艺和下基板工艺的常规技术相比，制造工艺简化。 由于制造过程中可能发生的缺陷由于简化的制造过程而降低，所以提高了制造生产能力，并且由于提高了MEMS麦克风的耐久性，提高了对外部环境的系统稳定性。