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公开(公告)号：US09608378B2
公开(公告)日：2017-03-28
申请号：US15016916
申请日：2016-02-05
Applicant: CommScope Technologies LLC
Inventor： David Patrick Murray , Bernard Harold Hammond, Jr.
IPC: H01R24/00 , H01R13/6466 , H05K1/02 , H01R13/6464 , H01R13/6461 , H01R13/66 , H05K1/16 , H01R24/64
CPC classification number: H01R13/6466 , H01R13/6461 , H01R13/6464 , H01R13/6658 , H01R13/6691 , H01R24/64 , H05K1/0228 , H05K1/162 , H05K2201/09236 , H05K2201/09672 , H05K2201/10189 , Y10S439/941 , Y10T29/49204 , Y10T29/49208 , Y10T29/53209
Abstract: Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.
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公开(公告)号：US20160262260A1
公开(公告)日：2016-09-08
申请号：US15030479
申请日：2014-10-17
Applicant: NODA SCREEN CO., LTD.
Inventor： Seisei OYAMADA , Masamitsu YOSHIZAWA , Hirotaka OGAWA
CPC classification number: H05K1/0231 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2924/15311 , H01L2924/15747 , H01L2924/19011 , H01L2924/19041 , H05K1/0298 , H05K1/11 , H05K1/113 , H05K1/162 , H05K1/181 , H05K1/185 , H05K2201/09672 , H01L2924/014
Abstract: A multi-layered circuit board includes a first insulating layer, a second insulating layer, and a sheet capacitor that is located between the first insulating layer and the second insulating layer. The sheet capacitor includes a pair of electrodes that sandwich a dielectric. Lead wirings continue to the electrodes, respectively. The lead wirings are disposed on an opposite side of the first or the second insulating layer with respect to the sheet capacitor to overlap the electrodes when viewed from a stacking direction of the multi-layered circuit board. Because the lead wirings are arranged to overlap the electrodes in the stacking direction of the multi-layered circuit board, an ESL of the sheet capacitor is maintained low.
Abstract translation: 多层电路板包括位于第一绝缘层和第二绝缘层之间的第一绝缘层，第二绝缘层和片状电容器。 片状电容器包括夹着电介质的一对电极。 导线分别分别连接到电极。 当从多层电路板的堆叠方向观察时，引线布置在相对于片状电容器的第一或第二绝缘层的相对侧上，以与电极重叠。 由于引线配线被布置为在多层电路板的堆叠方向上与电极重叠，所以片状电容器的ESL保持较低。
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公开(公告)号：US20160233017A1
公开(公告)日：2016-08-11
申请号：US15132888
申请日：2016-04-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motonori Murase
IPC: H01F27/28 , G05F3/08 , H01F27/245
CPC classification number: H01F27/2804 , G05F3/08 , H01F17/0013 , H01F27/245 , H01F2017/0066 , H01F2027/2809 , H01L23/49822 , H01L23/64 , H01L2924/0002 , H01L2924/19041 , H01L2924/19105 , H02M3/1584 , H05K1/115 , H05K1/165 , H05K3/4629 , H05K2201/086 , H05K2201/09672 , H01L2924/00
Abstract: Coil conductor patterns CP31 to CP34 and CP41 to CP44 are formed to be close to an outermost layer of a multilayer body. The coil conductor patterns CP31 and CP41 are connected by via hole conductors VH111b and VH111c, the coil conductor patterns CP32 and CP42 are connected by via hole conductors VH112b and VH112c, the coil conductor patterns CP33 and CP43 are connected by via hole conductors VH113b and VH113c, and the coil conductor patterns CP34 and CP44 are connected by via hole conductors VH114b and VH114c. Coil conductor patterns CP101 to CP104 and CP111 to CP114 formed to be close to the other outermost layer of the multilayer body are also connected in the same manner.
Abstract translation: 线圈导体图案CP31〜CP34和CP41〜CP44形成为接近多层体的最外层。 线圈导体图案CP31和CP41通过通孔导体VH111b和VH111c连接，线圈导体图案CP32和CP42通过通孔导体VH112b和VH112c连接，线圈导体图案CP33和CP43通过通孔导体VH113b和VH113c连接 并且线圈导体图案CP34和CP44通过通孔导体VH114b和VH114c连接。 形成为接近多层体的另一最外层的线圈导体图案CP101〜CP104和CP111〜CP114也以相同的方式连接。
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公开(公告)号：US09408302B2
公开(公告)日：2016-08-02
申请号：US14643230
申请日：2015-03-10
Applicant: Texas Instruments Incorporated
Inventor： Thomas Dyer Bonifield , Byron Williams , Shrinivasan Jaganathan , David Larkin , Dhaval Atul Saraiya
CPC classification number: H01L23/5223 , H01L23/49811 , H01L23/5227 , H01L23/528 , H01L23/53228 , H01L23/5329 , H01L23/538 , H01L23/62 , H01L24/05 , H01L24/48 , H01L24/49 , H01L2224/02166 , H01L2224/05553 , H01L2224/05554 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/48137 , H01L2224/48227 , H01L2224/48233 , H01L2224/48463 , H01L2224/49171 , H01L2224/49175 , H01L2224/49177 , H01L2924/00014 , H01L2924/10253 , H01L2924/1205 , H01L2924/1206 , H01L2924/14335 , H05K1/0256 , H05K1/0257 , H05K1/0262 , H05K1/0306 , H05K1/0346 , H05K1/09 , H05K1/112 , H05K1/162 , H05K1/165 , H05K3/0088 , H05K3/4688 , H05K2201/0154 , H05K2201/0175 , H05K2201/0191 , H05K2201/0195 , H05K2201/0746 , H05K2201/09409 , H05K2201/0949 , H05K2201/09672 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.
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公开(公告)号：US20160217905A1
公开(公告)日：2016-07-28
申请号：US14927237
申请日：2015-10-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hwan YANG , Jin Hyuck YANG , Jong Yun LEE , Won Chul SIM
CPC classification number: H05K1/113 , H01F17/0013 , H01F41/041 , H01F2017/002 , H05K1/165 , H05K3/4644 , H05K2201/086 , H05K2201/09672
Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.
Abstract translation: 线圈部件包括具有包括通孔焊盘的多层结构的线圈导体和连接在相应层上的通孔焊盘之间的通孔。 彼此相邻的两层上的通孔焊盘的部分或整个区域彼此重叠，并且通过其间形成的通孔焊盘彼此连接的两层通孔设置在交替位置。
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Patent Agency Ranking
186.发明申请公开(公告)号：US20160211566A1
公开(公告)日：2016-07-21
申请号：US15083986
申请日：2016-03-29
Applicant: Sony Corporation
Inventor： Hidekazu KIKUCHI , Takayuki Mogi , Yoshiyuki Akiyama , Hirofumi Kawamura
CPC classification number: H01P5/02 , H01P1/208 , H01P3/12 , H01P3/121 , H01P3/165 , H01P5/024 , H01P5/082 , H01P5/087 , H01P5/1022 , H01P5/107 , H01P5/18 , H01P5/182 , H01P5/188 , H01R13/6461 , H01R13/665 , H01R24/28 , H01R24/76 , H01R2103/00 , H04B3/56 , H04B7/24 , H05K1/0225 , H05K1/0239 , H05K2201/093 , H05K2201/09672 , H05K2201/0969 , H05K2201/09754
Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.
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公开(公告)号：US20160156132A1
公开(公告)日：2016-06-02
申请号：US15016916
申请日：2016-02-05
Applicant: CommScope Technologies LLC
Inventor： David Patrick Murray , Bernard Harold Hammond, JR.
IPC: H01R13/6466
CPC classification number: H01R13/6466 , H01R13/6461 , H01R13/6464 , H01R13/6658 , H01R13/6691 , H01R24/64 , H05K1/0228 , H05K1/162 , H05K2201/09236 , H05K2201/09672 , H05K2201/10189 , Y10S439/941 , Y10T29/49204 , Y10T29/49208 , Y10T29/53209
Abstract: Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.
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公开(公告)号：US20160141739A1
公开(公告)日：2016-05-19
申请号：US15006377
申请日：2016-01-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
CPC classification number: H01P3/02 , H01F2017/065 , H01P11/003 , H05K1/024 , H05K2201/0129 , H05K2201/0209 , H05K2201/086 , H05K2201/09672
Abstract: A high-frequency signal transmission line includes a body including a plurality of first base layers and a second base layer stacked on one another in a stacking direction. The first base layers have a first relative permeability, and the second base layer has a relative permeability lower than the first relative permeability. A first signal line and a second signal line extending along the first signal line are provided in the body. In a cross section perpendicular or substantially perpendicular to a first direction in which the first signal line extends, the second base layer occupies at least a portion of an area between the first signal line and the second signal line. In the cross section perpendicular or substantially perpendicular to the first direction, the plurality of first base layers define a loop enclosing the first signal line, the second signal line and the second base layer.
Abstract translation: 高频信号传输线包括在堆叠方向上彼此堆叠的多个第一基底层和第二基底层的主体。 第一基层具有第一相对磁导率，第二基层具有比第一相对磁导率低的相对磁导率。 沿着第一信号线延伸的第一信号线和第二信号线设置在主体中。 在垂直于或基本上垂直于第一信号线延伸的第一方向的横截面中，第二基层占据第一信号线和第二信号线之间的区域的至少一部分。 在垂直于或基本上垂直于第一方向的横截面中，多个第一基层限定了包围第一信号线，第二信号线和第二基层的环。
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公开(公告)号：US09337521B2
公开(公告)日：2016-05-10
申请号：US14080013
申请日：2013-11-14
Applicant: INTEL CORPORATION
Inventor： Raul Enriquez Shibayama , Maria Garcia Garcia de Leon , Kai Xiao , Beom-Taek Lee , Carlos Lizalde Moreno
CPC classification number: H01P3/026 , H01P5/028 , H04B3/32 , H05K1/0225 , H05K1/0228 , H05K1/0239 , H05K1/0245 , H05K1/117 , H05K2201/09672 , Y10T29/49117
Abstract: A circuit component is described herein. The circuit component includes a first signal line to propagate in a first direction and a second signal line to propagate a second direction. The circuit component includes a region to introduce crosstalk within the region that reduces another crosstalk generated at a location remote from the region based on a change in propagation direction of the first signal line and second signal line.
Abstract translation: 这里描述了电路部件。 电路部件包括在第一方向上传播的第一信号线和第二信号线以传播第二方向。 电路部件包括在该区域内引入串扰的区域，其基于第一信号线和第二信号线的传播方向的变化，减少远离该区域的位置产生的另一个串扰。
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公开(公告)号：US20160079023A1
公开(公告)日：2016-03-17
申请号：US14947250
申请日：2015-11-20
Applicant: T+Ink, Inc.
Inventor： Daniel Boss , Scott Qualls , David Mcdonald , Terrance Z. Kaiserman , Keith J. Margolin , Michael Wassief , Liang Chai
CPC classification number: H01H59/00 , H01B5/02 , H01B13/165 , H01H49/00 , H01R4/2404 , H01R25/147 , H05K3/103 , H05K2201/09672 , H05K2201/09963 , Y10T29/49117 , Y10T29/49155 , Y10T307/74
Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.
Abstract translation: 提供了包括绝缘体和第一导体的导电元件，其可以固定到由导电结构元件组成的第二导体，其中绝缘体位于第一和第二导体之间以将它们电隔离。 电源可以连接在第一和第二导体之间以向其提供电力，并且电气设备可以跨越第一和第二导体连接。
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