公开(公告)号：US20120038046A1

公开(公告)日：2012-02-16

申请号：US12836612

申请日：2010-08-13

Applicant: How Lin ,  Frank Egitto ,  Voya Markovich

Inventor： How Lin ,  Frank Egitto ,  Voya Markovich

IPC: H01L23/48 ,  H01L21/447

CPC classification number: H01L23/3157 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L2224/0226 ,  H01L2224/02335 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73251 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81901 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.

Abstract translation: 一种在半导体芯片上形成可压缩接触结构的方法，包括将可压缩的聚合物层粘合到芯片的表面，在该层内形成多个开口，在开口内沉积导电材料以形成与芯片的触点的电连接 在聚合物层上形成多个导电线元件，所述多个导电线元件从相应的开口延伸并且各自包括端部，并且在所述线段端部中的相应一个上形成多个接触元件。 当可接触构件通过外力或力接合时，可压缩聚合物层允许接触构件偏转（压缩）芯片。 还提供了包括这种可压缩接触结构的半导体芯片。

公开(公告)号：US07552091B2

公开(公告)日：2009-06-23

申请号：US10860067

申请日：2004-06-04

Applicant: Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  How Lin ,  William Maines ,  Voya Markovich

IPC: G06Q99/00

CPC classification number: G06K17/00 ,  G06Q10/08 ,  G06Q10/087

Abstract: A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.

Abstract translation: 一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问 通过和包括装运，例如，给客户。 主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。 该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

公开(公告)号：US20070150724A1

公开(公告)日：2007-06-28

申请号：US11318651

申请日：2005-12-27

Applicant: Tzu-How Lin

Inventor： Tzu-How Lin

IPC: H04L9/00

CPC classification number: G06F21/6218

Abstract: A data archiving and accessing system. The system comprises a client and a server. The client uploads transaction data and a public key. The server further comprises a database storing the transaction data and a transaction system. The transaction system implements authentication and authorization processes on the client, receives the transaction data with a public key via a transmission medium, encrypts the transaction data using the public key, associates and collocates the encrypted transaction data according to predefined tags, and stores the encrypted transaction data in the database

Abstract translation: 数据归档和访问系统。 该系统包括客户端和服务器。 客户端上传交易数据和公钥。 服务器还包括存储交易数据的数据库和交易系统。 交易系统在客户端上实现认证授权过程，通过传输介质用公共密钥接收交易数据，使用公开密钥加密交易数据，根据预定义的标签关联并搭配加密的交易数据，并存储加密 数据库中的事务数据

公开(公告)号：US20060238207A1

公开(公告)日：2006-10-26

申请号：US11110901

申请日：2005-04-21

Applicant: Frank Egitto ,  How Lin

Inventor： Frank Egitto ,  How Lin

IPC: G01R31/02

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: An interposer comprising at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers. The interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board. The interposer is also capable of being used for other purposes, including as an interconnecting circuitized substrate between a semiconductor chip and a chip carrier substrate or between a chip carrier and a printed circuit board. Various methods of making such an interposer are also provided.

Abstract translation: 一种插入器，包括至少两个彼此结合的介电层，在其间夹有多个导体。 这些导体各自电连接形成在电介质层的开口内并在其中突出的相应的一对相对的电触点。 内插器非常适合用作测试设备的一部分，以将半导体芯片的高度致密图案的焊球接触件与设备的印刷电路板上较小致密的触点阵列相互连接。 该插入器还能够用于其它目的，包括作为半导体芯片和芯片载体衬底之间的互连电路化衬底，或者在芯片载体和印刷电路板之间。 还提供了制造这种插入件的各种方法。

公开(公告)号：US20060182397A1

公开(公告)日：2006-08-17

申请号：US11279276

申请日：2006-04-11

Applicant: Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

Inventor： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC: G02B6/36

CPC classification number: G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Abstract translation: 用于电子系统的光电组件包括具有第一表面和相对的第二表面的导热金属化透明基板。 支撑芯片组结合到透明基板的第二表面。 第一衬底经由金属化的第二表面和其间的支撑芯片与透明衬底连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持芯片组进行信号通信，并且具有与换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面。 支撑芯片组和传感器共享一个共同的冷却路径。

公开(公告)号：US20050270160A1

公开(公告)日：2005-12-08

申请号：US10860071

申请日：2004-06-04

Applicant: Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

IPC: G06K17/00 ,  G06K19/077 ,  G06Q10/00 ,  G08B1/08

CPC classification number: G06K19/07749 ,  G06K2017/0045 ,  G06Q10/087

Abstract: A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).

Abstract translation: 用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。 该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个 的货物被运输和跟踪。 或者，该装置可以通过其他方式（例如，粘合剂）附接。 托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量 ，类型等）。

公开(公告)号：US20110144804A1

公开(公告)日：2011-06-16

申请号：US12779304

申请日：2010-05-13

Applicant: Kai-Tai SONG ,  Meng-Ju Han ,  Chia-How Lin

Inventor： Kai-Tai SONG ,  Meng-Ju Han ,  Chia-How Lin

IPC: B25J9/16 ,  G06N5/02 ,  G06F15/18 ,  G06N3/06 ,  G06N7/04

CPC classification number: G06N3/006 ,  B25J11/0015 ,  G06N3/008

Abstract: A device for expressing robot autonomous emotions comprises: a sensing unit; a user emotion recognition unit, recognizing current user emotional states after receiving sensed information from the sensing unit, and calculating user emotional strengths based on the current user emotional states; a robot emotion generation unit, generating robot emotional states based on the user emotional strengths; a behavior fusion unit, calculating a plurality of output behavior weights by a fuzzy-neuro network based on the user emotional strengths and a rule table; and a robot reaction unit, expressing a robot emotional behavior based on the output behavior weights and the robot emotional states.

Abstract translation: 用于表达机器人自主情绪的装置包括：感测单元; 用户情感识别单元，在从感测单元接收到感测信息之后识别当前用户情绪状态，并且基于当前用户情绪状态来计算用户情绪强度; 机器人情感生成单元，基于用户的情感优势产生机器人的情绪状态; 行为融合单元，基于用户情绪强度和规则表，通过模糊神经网络计算多个输出行为权重; 以及机器人反应单元，基于输出行为权重和机器人情绪状态来表达机器人的情绪行为。

公开(公告)号：US20070249089A1

公开(公告)日：2007-10-25

申请号：US11808596

申请日：2007-06-12

Applicant: Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

Inventor： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

IPC: H01L51/40

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.

Abstract translation: 一种制造电路化衬底的方法，所述电路化衬底由其上具有导电图案的至少一种电介质材料组成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。

公开(公告)号：US20070031084A1

公开(公告)日：2007-02-08

申请号：US11425392

申请日：2006-06-20

Applicant: David Wang ,  John Tsai ,  How Lin ,  Le-Heng Wang

Inventor： David Wang ,  John Tsai ,  How Lin ,  Le-Heng Wang

IPC: H04B10/08 ,  G02B6/34

CPC classification number: G01B11/18 ,  E01F11/00 ,  G01L1/246 ,  G02B6/022 ,  G08G1/02

Abstract: A system for monitoring traffic across a structure. A fiber Bragg grating (FBG) reflects a light wavelength. A mounting mechanism connects the FBG to the structure, such that physical change of the structure changes a stress to the FBG that changes the light wavelength. And optical fiber carries a first light beam to the FBG and carries a second light beam from the FGB. This permits first light beam including the light wavelength to be received from a light source, and permits the first light beam to be altered into the second light beam by passing the light wavelength through the FBG, and permits the second light beam to be provided to a detector to sense the light wavelength present in the second light beam. From this the stress in the structure and information about the traffic across a structure can be inferred.

Abstract translation: 用于监控跨结构的流量的系统。 光纤布拉格光栅（FBG）反射光波长。 安装机构将FBG连接到结构，使得结构的物理变化将改变光束波长的FBG的应力。 并且光纤将第一光束传送到FBG并携带来自FGB的第二光束。 这允许包括光波长的第一光束从光源接收，并且允许通过使光波长通过FBG将第一光束改变为第二光束，并且允许第二光束被提供到 用于感测存在于第二光束中的光波长的检测器。 从此可以推断结构中的压力和关于结构上的交通的信息。

公开(公告)号：US20070010064A1

公开(公告)日：2007-01-11

申请号：US11352276

申请日：2006-02-13

Applicant: Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

Inventor： Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

IPC: H01L21/20 ,  H01L21/44

CPC classification number: H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/0568

Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

Abstract translation: 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 可光成像材料用于促进正在印刷的电容电介质的定位。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。