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    Apparatus and method for vacuum injection molding
    12.
    发明授权
    Apparatus and method for vacuum injection molding 失效
    真空注塑成型设备及方法

    公开(公告)号：US06231333B1

    公开(公告)日：2001-05-15

    申请号：US08518874

    申请日：1995-08-24

    Applicant: Peter Alfred Gruber ,  Egon Max Kummer ,  Bernie Hernandez ,  Thomas George Ference ,  Arthur Richard Zingher

    Inventor： Peter Alfred Gruber ,  Egon Max Kummer ,  Bernie Hernandez ,  Thomas George Ference ,  Arthur Richard Zingher

    IPC: B29C3500

    CPC classification number: B23K3/0607 ,  B29C31/041 ,  B29C33/0022 ,  B29C39/24 ,  B29C39/42 ,  B29C2791/006 ,  H05K3/3457 ,  Y10S425/812

    Abstract: An apparatus and method utilize vacuum injected molding of a liquid in a plurality of mold cells for solidification therein. An injection head includes spaced apart vacuum and injection slots positionable atop a mold plate in flow communication with the mold cells therein. Relative axial sliding is effected between the injection head and the mold plate for sequentially evacuating gas from the mold cells using a continuous vacuum followed in turn by sequentially injecting into the evacuated mold cells the liquid from a continuous source thereof. Sliding of the injection head over the mold plate automatically provides self valving for sequentially evacuating and filling the mold cells from the same side of the mold plate. In a preferred embodiment, the vacuum and injection slots are linked together at the mold plate so that surface tension of the liquid restrains flow of the liquid from the injection slot to the vacuum slot while allowing gas flow therebetween for effecting the vacuum in the mold cells.

    Abstract translation: 一种设备和方法利用在多个模具室中的液体的真空注射成型用于固化。 注射头包括间隔开的真空和注射槽，其定位在模具板的顶部，与其中的模具池流动连通。 在注射头和模板之间进行相对的轴向滑动，用于使用连续真空从模具室中依次排出气体，然后依次将来自连续的源的液体注入到抽空的模具中。 注射头在模具板上滑动自动提供自动阀，用于从模具板的同一侧依次抽空和填充模具单元。 在优选实施例中，真空和注入槽在模板处连接在一起，使得液体的表面张力限制液体从注入槽流到真空槽，同时允许气体在其间流动以实现模具室中的真空 。

    Forming metal preforms and metal balls
    13.
    发明授权
    Forming metal preforms and metal balls 有权
    成型金属预制件和金属球

    公开(公告)号：US08561880B2

    公开(公告)日：2013-10-22

    申请号：US13371430

    申请日：2012-02-11

    Applicant: Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

    Inventor： Peter Alfred Gruber ,  Paul Alfred Lauro ,  Jae-Woong Nah

    IPC: B23K31/02

    CPC classification number: B22D29/02 ,  B22C9/061 ,  B22D21/027 ,  B22D23/00 ,  B22D25/02

    Abstract: A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls.

    Abstract translation: 描述了用于形成和/或释放金属预成型件，金属形状和焊球的工艺和工具，其包括柔性模具或片材，注射成型金属如焊料，以及在焊球的情况下，液体或气体环境以减少或去除金属 金属（焊料）回流之前或期间的氧化物，以增加表面张力以形成球形或基本上球形的焊球。

    Hybrid molds for molten solder screening process
    16.
    发明授权
    Hybrid molds for molten solder screening process 失效
    熔融焊料筛选工艺的混合模具

    公开(公告)号：US06832747B2

    公开(公告)日：2004-12-21

    申请号：US10128210

    申请日：2002-04-23

    Applicant: Steven A. Cordes ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  James Louis Speidell ,  Joseph Peter Zinter

    Inventor： Steven A. Cordes ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  James Louis Speidell ,  Joseph Peter Zinter

    IPC: B29C3300

    CPC classification number: B23K3/0623 ,  B23K3/0638 ,  B23K2101/40 ,  H05K3/3457 ,  Y10T156/10

    Abstract: Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer. The encasing is performed on a leveling fixture such that the top surface of the silicon face plate and the top surface of the extender material after solidification are perfectly leveled.

    Abstract translation: 公开了用于模制用于熔融焊料筛选过程的多个焊球的混合模具和用于制备这种模具的方法。 利用用于通过沿着特定结晶平面各向异性蚀刻晶体硅衬底而形成金字塔形状的多个空腔的方法来形成本发明混合模具中使用的结晶硅面板。 在一个优选的实施例中，硅面板通过粘合方法以一种确保在硅面板和玻璃背板的顶表面之间实现共面性的方法结合到硼硅酸盐玻璃背板上。 在替代实施例中，另外的玻璃框架用于将硅面板粘合到玻璃背板，再次确保硅面板的顶表面和玻璃框架之间的共面性。 在第二替代实施例中，硅面板封装在可以是硼硅酸盐玻璃或聚合物的增量材料中。 在平整装置上进行包装，使得硅面板的顶表面和固化后的增量材料的顶表面完美平整。

    Method and apparatus for forming solder bumps
    19.
    发明授权
    Method and apparatus for forming solder bumps 有权
    用于形成焊料凸点的方法和装置

    公开(公告)号：US06394334B1

    公开(公告)日：2002-05-28

    申请号：US09536810

    申请日：2000-03-28

    Applicant: Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

    Inventor： Guy Paul Brouillette ,  Peter Alfred Gruber ,  Frederic Maurer

    IPC: B23K100

    CPC classification number: B23K3/00 ,  B23K1/00 ,  B23K3/0623 ,  B33Y30/00 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3457 ,  H05K2203/0113 ,  H01L2924/00014

    Abstract: The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface, The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 &mgr;m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities. The present invention further discloses a flexible die for dispensing molten solder consisting of a die body that is constructed of a metal sheet capable of flexing of not less than 1.5 &mgr;m per inch of die length, a gate opening for receiving a supply of molten solder, a slot opening for dispensing the molten solder onto a solder receiving surface, and a pressure means associated with the die body for providing adequate pressure such that the die body intimately contacting the solder receiving mold surface.

    Abstract translation: 本发明公开了一种通过熔融焊料筛选技术形成焊料凸块的方法和装置，其中使用由金属板构成的柔性模头来保持模头和焊料接收模具表面之间的紧密接触。柔性模具 当与压力装置组合使用时，头部能够符合任何弯曲的模具表面，只要曲率不超过2.5英寸/英寸的模头长度。 本发明还提供了一种用于通过提供熔融焊料流来填充模具表面中的多个空腔并随后使熔融焊料的表面与多个空腔紧密接触的方法和装置，使得熔融焊料容易地填充空腔 。 该装置还提供了用于从模具表面去除多余的熔融焊料而不干扰已经填充在空腔中的熔融焊料的装置。 本发明还公开了一种用于分配熔融焊料的柔性模具，其由由能够弯曲不小于1.5mum /英寸的模具长度的金属板构成的模具本体构成，用于接收熔融焊料的供给的闸门开口， 用于将熔融焊料分配到焊料接收表面上的槽口，以及与模具主体相关联的压力装置，用于提供足够的压力，使得模具体与焊料接收模具表面紧密接触。

    Plastic solder array using injection molded solder
    20.
    发明授权
    Plastic solder array using injection molded solder 失效

    公开(公告)号：US6153505A

    公开(公告)日：2000-11-28

    申请号：US388300

    申请日：1999-09-01

    Applicant: Lannie R. Bolde ,  Peter Alfred Gruber ,  Chon Cheong Lei

    Inventor： Lannie R. Bolde ,  Peter Alfred Gruber ,  Chon Cheong Lei

    IPC: B23K3/06 ,  H01L21/48 ,  H01L21/44

    CPC classification number: B23K3/0638 ,  H01L21/4853 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

    Abstract: Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.

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