公开(公告)号：US20090133253A1

公开(公告)日：2009-05-28

申请号：US12213365

申请日：2008-06-18

Applicant: Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

Inventor： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

IPC: H05K3/12 ,  H01B13/00

CPC classification number: H05K3/107 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/045 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1152 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

Abstract translation: 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层，对于包含层叠在绝缘层一侧的铜箔的覆铜层压板， 通过去除第二覆盖层，第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。

公开(公告)号：US07517730B2

公开(公告)日：2009-04-14

申请号：US11542175

申请日：2006-10-04

Applicant: Soon-Jin Cho

Inventor： Soon-Jin Cho

IPC: H01L21/00

CPC classification number: H05K3/4007 ,  H01L2224/16225 ,  H05K1/0206 ,  H05K3/06 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and (c) forming a plurality of protruded function pads by etching the metal sheet. The coreless substrate and manufacturing method thereof in accordance with the present invention have the signal delivery characteristic that is improved by eliminating the inner via hole.

Abstract translation: 本发明公开了一种无芯基板的制造方法。 该方法包括以下步骤：（a）在金属片的一侧上形成绝缘层; （b）在绝缘层上形成用于金属片和另一侧之间的电连接的通孔; 和（c）通过蚀刻金属板形成多个突出的功能垫。 根据本发明的无芯基板及其制造方法具有通过消除内通孔而提高的信号传递特性。

公开(公告)号：US20090027864A1

公开(公告)日：2009-01-29

申请号：US12007687

申请日：2008-01-14

Applicant: Chung-Woo Cho ,  Jong-Jin Lee ,  Soon-Jin Cho ,  Yong-Duk Lee ,  Ki-Young Yoo ,  Woo-Young Lee ,  Chin-Kwan Kim ,  Jong-Yong Kim ,  Dong-Ju Jeon

Inventor： Chung-Woo Cho ,  Jong-Jin Lee ,  Soon-Jin Cho ,  Yong-Duk Lee ,  Ki-Young Yoo ,  Woo-Young Lee ,  Chin-Kwan Kim ,  Jong-Yong Kim ,  Dong-Ju Jeon

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/3452 ,  H05K3/0032 ,  H05K2201/09845 ,  H05K2203/0594 ,  Y10T29/49165

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved.

Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 一种印刷电路板，其包括绝缘层，形成在绝缘层的包括至少一个焊盘的表面上的电路图案和覆盖电路图案的阻焊剂，并且其中形成有露出部分的开口 的焊盘的侧面和表面，可以确保焊盘和阻焊剂的足够的附着面积，以增强焊盘的附着力。 此外，可以在电子部件和印刷电路板之间增加粘附性，并且可以提高散热特性。

公开(公告)号：US20080225501A1

公开(公告)日：2008-09-18

申请号：US12076274

申请日：2008-03-14

Applicant: Chung-Woo Cho ,  Chang-Sup Ryu ,  Soon-Jin Cho ,  Seung-Chul Kim

Inventor： Chung-Woo Cho ,  Chang-Sup Ryu ,  Soon-Jin Cho ,  Seung-Chul Kim

IPC: H05K7/10 ,  H01K3/10

CPC classification number: H05K3/421 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49165

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability.

Abstract translation: 公开了印刷电路板及其制造方法。 印刷电路板包括第一绝缘层，穿过第一绝缘层的第一通孔和形成在第一绝缘层的一个表面上的第一焊盘，其中第一焊盘的整体或一部分被埋在 第一通孔具有埋在通孔中的焊盘的一部分或全部，从而可以增加焊盘和通孔之间的接触面积，并且可以赋予印刷电路板更高的可靠性。

公开(公告)号：US08558360B2

公开(公告)日：2013-10-15

申请号：US12926137

申请日：2010-10-27

Applicant: Ey Yong Kim ,  Young Hwan Shin ,  Soon Jin Cho ,  Jong Yong Kim ,  Jin Seok Lee

Inventor： Ey Yong Kim ,  Young Hwan Shin ,  Soon Jin Cho ,  Jong Yong Kim ,  Jin Seok Lee

IPC: H01L21/02

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2924/00

Abstract: There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.

Abstract translation: 提供了一种倒装芯片封装，包括电子器件，包括设置在其上安装有电子器件的板的安装区域内的导电焊盘的基板和设置在安装区域外部的连接焊盘，形成在其上的树脂层 并且包括通过去除树脂层的一部分而形成的沟槽，以及设置在沟槽上的防止构件，并防止在安装区域和连接衬垫之间的底部填充物的泄漏。 由于形成在加工树脂层上的阻挡部件能够防止底部填充物的泄漏，因此能够降低包装缺陷率，可以提高连接可靠性。

公开(公告)号：US08445790B2

公开(公告)日：2013-05-21

申请号：US12320284

申请日：2009-01-22

Applicant: Seok Kyu Lee ,  Soon Oh Jung ,  Jong Kuk Hong ,  Soon Jin Cho

Inventor： Seok Kyu Lee ,  Soon Oh Jung ,  Jong Kuk Hong ,  Soon Jin Cho

IPC: H05K1/11

CPC classification number: H05K3/00 ,  H05K1/113 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/4007 ,  H05K3/426 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/054 ,  H05K2203/1572

Abstract: Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy.

Abstract translation: 本文公开了具有填充通孔焊盘的无芯基板及其制造方法。 绝缘层形成在堆积层的两侧，并且通孔焊盘嵌入在绝缘层中，使得通孔焊盘与绝缘层齐平。 通孔焊盘不与衬底分离，因此焊盘的可靠性增加。 凸起的平坦度增加，因此倒装芯片的结合变得容易。

公开(公告)号：US20110115121A1

公开(公告)日：2011-05-19

申请号：US12926864

申请日：2010-12-14

Applicant: Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

Inventor： Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

IPC: B29C45/00 ,  B82Y30/00

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20481 ,  H05K2201/026 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

公开(公告)号：US20090136656A1

公开(公告)日：2009-05-28

申请号：US12213700

申请日：2008-06-23

Applicant: Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

Inventor： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

IPC: H05K3/02

CPC classification number: H05K3/427 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/421 ,  H05K2201/0175 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1152

Abstract: A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil.

Abstract translation: 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上堆叠防镀层，对于包括层叠在绝缘层的一侧上的铜箔的覆铜层压板; 通过去除所述防镀层的一部分和所述覆铜层压板的一部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽的表面上; 通过电镀凹版凹槽的内部形成镀层; 并且去除防镀层和铜箔。

公开(公告)号：US08834077B2

公开(公告)日：2014-09-16

申请号：US13003293

申请日：2009-06-23

Applicant: Tae Sik Yoon ,  Soon Jin Cho ,  Seung Hyun Cho ,  Jae Joon Lee

Inventor： Tae Sik Yoon ,  Soon Jin Cho ,  Seung Hyun Cho ,  Jae Joon Lee

IPC: B23B51/02 ,  B23P15/32 ,  C22C38/08 ,  B22F7/06 ,  B22F5/00

CPC classification number: B22F7/062 ,  B22F2005/001 ,  B22F2998/00 ,  B23B51/02 ,  B23B2251/426 ,  B23P15/32 ,  C22C38/08 ,  Y10T408/03 ,  Y10T408/78 ,  Y10T408/907 ,  Y10T408/9097 ,  B22F2207/20 ,  B22F5/06 ,  B22F5/10

Abstract: A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.

Abstract translation: 一种微钻的制造方法，其特征在于，包括用于加工孔的钻头部和固定于马达的柄部，所述钻头部和所述柄部由不同的材料构成。 该方法包括以下步骤：在其一端形成具有凹部的钻头成形粉末压块，并且形成具有突出部的柄部形成用粉末压块，所述突起旨在嵌入到钻头成形用凹部 粉末压块，形成钻头成形粉末压块和柄部分成型粉末压块的组件，突起嵌入凹槽中，同时烧结钻头成形粉末压块和柄部分成型的组件 粉末紧凑。

公开(公告)号：US20110138616A1

公开(公告)日：2011-06-16

申请号：US12929260

申请日：2011-01-11

Applicant: Chung-Woo Cho ,  Soon-Jin Cho ,  Byung-Bae Seo ,  Ki-Young Yoo ,  Seok-Hwan Ahn

Inventor： Chung-Woo Cho ,  Soon-Jin Cho ,  Byung-Bae Seo ,  Ki-Young Yoo ,  Seok-Hwan Ahn

IPC: H05K3/00

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K3/0035 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/0108 ,  H05K2201/09918

Abstract: A printed circuit board manufacturing system that uses a substrate that includes a pad and an insulation layer covering the pad. The system includes an image sensor part acquiring an image of the substrate, a control part generating a control signal to form a via hole, and a laser applying part applying a laser, considering the control signal, to the part of the insulation layer that corresponds to the location information of the pad.

Abstract translation: 一种印刷电路板制造系统，其使用包括衬垫和覆盖该衬垫的绝缘层的衬底。 该系统包括获取基板的图像的图像传感器部分，产生控制信号以形成通孔的控制部分和考虑到控制信号的施加激光的激光施加部分到对应于绝缘层的部分 到垫的位置信息。