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11.发明申请公开(公告)号：US20210243898A1
公开(公告)日：2021-08-05
申请号：US17215001
申请日：2021-03-29
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.
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12.发明授权公开(公告)号：US10986735B2
公开(公告)日：2021-04-20
申请号：US16168927
申请日：2018-10-24
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.
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13.发明授权公开(公告)号：US10986734B2
公开(公告)日：2021-04-20
申请号：US16140633
申请日：2018-09-25
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.
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公开(公告)号：US20190389106A1
公开(公告)日：2019-12-26
申请号：US16561213
申请日：2019-09-05
Applicant: TactoTek Oy
Inventor： Anne Isohätälä , Hasse Sinivaara , Mikko Heikkinen
Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
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公开(公告)号：US10408391B2
公开(公告)日：2019-09-10
申请号：US15824152
申请日：2017-11-28
Applicant: TactoTek Oy
Inventor： Sami Torvinen
IPC: F21S4/00 , F21K9/61 , F21V8/00 , H05K1/02 , H05K1/18 , H01L25/075 , F21Y103/37 , F21Y103/10 , F21Y115/10 , H05K3/00 , H05K3/12 , H01L33/60 , H01L33/62
Abstract: Embodiments of light-emitting multilayer structures incorporating substrate films 3D-formed with recesses for light sources and plastics material molded thereupon are presented. Related methods of manufacture are set forth as well.
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Patent Agency Ranking
公开(公告)号：US20190069409A1
公开(公告)日：2019-02-28
申请号：US16038864
申请日：2018-07-18
Applicant: TactoTek Oy
Inventor： Antti Keranen , Ronald Haag , Mikko Heikkinen
Abstract: A method for manufacturing a multilayer structure, includes obtaining a first substrate film for accommodating electronics, said first substrate film having a first side and an opposite second side, said first substrate film including electrically substantially insulating material, said first substrate film preferably being formable and/or thermoplastic, providing, optionally by mounting and/or by printed electronics technology, circuitry on at least said second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film, and molding, optionally by injection molding or reactive molding, plastic material on the first side of the first substrate film so as to at least partially cover it.
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公开(公告)号：US20180359860A1
公开(公告)日：2018-12-13
申请号：US16045009
申请日：2018-07-25
Applicant: TactoTek Oy
Inventor： Mikko HEIKKINEN , Antti KERÄNEN , Jarmo SÄÄSKI , Ronald H. HAAG
Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.
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公开(公告)号：US20180302989A1
公开(公告)日：2018-10-18
申请号：US16018127
申请日：2018-06-26
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
CPC classification number: H05K3/0014 , B29C45/1418 , B29C45/14639 , B29C45/14811 , B29C45/14819 , B29C2045/14237 , B29L2031/3425 , B29L2031/3481 , H05K1/0284 , H05K1/0393 , H05K2201/0129 , H05K2201/09118 , H05K2203/1105
Abstract: An apparatus for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.
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公开(公告)号：US20180220534A1
公开(公告)日：2018-08-02
申请号：US15937172
申请日：2018-03-27
Applicant: TactoTek Oy
Inventor： Mikko HEIKKINEN , Jarmo SÄÄSKI , Jarkko Torvinen
IPC: H05K1/18 , H01L33/52 , H01L23/498 , H05K1/02 , H01L51/00 , H01L23/538
CPC classification number: H05K1/186 , H01L23/4985 , H01L23/5387 , H01L33/52 , H01L51/0097 , H01L2224/1319 , H01L2933/005 , H05K1/0274 , H05K1/0298 , H05K1/189 , H05K3/284 , H05K2201/0129 , H05K2201/05 , H05K2201/09872 , H05K2201/10106 , H05K2201/10151 , H05K2203/1316 , H05K2203/1322
Abstract: A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.
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公开(公告)号：US09869810B2
公开(公告)日：2018-01-16
申请号：US14264273
申请日：2014-04-29
Applicant: TactoTek Oy
Inventor： Antti Keranen , Jarmo Saaski , Tuomas Heikkila , Paavo Niskala , Kari Severinkangas , Sami Torvinen
CPC classification number: G02B6/0065 , G02B6/0036 , G02B6/0051 , G02B6/006 , G02B6/0091
Abstract: A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.
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