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公开(公告)号：US20060286365A1
公开(公告)日：2006-12-21
申请号：US11153206
申请日：2005-06-15
Applicant: Yueh-Ling Lee , Meredith Dunbar , Harry Swicker , Carl Wang , Brian Auman
Inventor： Yueh-Ling Lee , Meredith Dunbar , Harry Swicker , Carl Wang , Brian Auman
CPC classification number: H05K3/185 , C23C18/02 , C23C18/1216 , C23C18/1233 , C23C18/1295 , C23C18/204 , Y10T428/24917 , Y10T428/25 , Y10T428/31511 , Y10T428/3154 , Y10T428/31725 , Y10T428/31786
Abstract: A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.
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公开(公告)号：US20100009173A1
公开(公告)日：2010-01-14
申请号：US12169212
申请日：2008-07-08
Applicant: YUEH-LING LEE , Shane Fang
Inventor： YUEH-LING LEE , Shane Fang
CPC classification number: B32B27/08 , B32B5/147 , B32B27/18 , B32B27/20 , B32B27/281 , B32B27/302 , B32B27/308 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2270/00 , B32B2307/206 , B32B2307/714 , B32B2457/00 , H05K1/0373 , H05K3/0032 , H05K3/184 , H05K3/185 , H05K2201/0112 , H05K2201/0236 , H05K2203/107 , Y10T29/49156 , Y10T428/26 , Y10T428/31504 , Y10T428/31511 , Y10T428/3154 , Y10T428/31721 , Y10T428/31725 , Y10T428/31786 , Y10T428/31855 , Y10T428/31942
Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.
Abstract translation: 本发明涉及通过激光（或类似能量束）消融的非平版印刷图案，其中消融系统最终导致电路特征相对没有碎片诱导的过度电镀缺陷（与消融过程有关的碎片） 并且完全添加电镀引起的过度镀覆缺陷。 本发明的组合物包括具有绝缘基板和覆盖层的电路板前体。 绝缘基板由介电材料制成，也可由金属氧化物可活化填料制成。 覆盖层可以是牺牲的或非牺牲的，并且用于修复由消融过程产生的不想要的碎屑。
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13.发明申请LIGHT ACTIVATABLE POLYIMIDE COMPOSITIONS FOR RECEIVING SELECTIVE METALIZATION, AND METHODS AND COMPOSITIONS RELATED THERETO 失效用于接收选择性金属化的光活化聚酰亚胺组合物及其相关方法和组合物公开(公告)号：US20090263639A1
公开(公告)日：2009-10-22
申请号：US12491692
申请日：2009-06-25
Applicant: MEREDITH L. DUNBAR , Yueh-Ling Lee , Carl B. Wang
Inventor： MEREDITH L. DUNBAR , Yueh-Ling Lee , Carl B. Wang
CPC classification number: C08L79/08 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K3/013 , C08K3/22 , H05K1/0346 , H05K1/036 , H05K1/0373 , H05K3/185 , H05K2201/0154 , H05K2201/0209 , H05K2203/107 , Y10T428/31721 , Y10T428/31725
Abstract: The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns−1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.
Abstract translation: 本发明一般涉及分散在聚酰亚胺基体中的聚酰亚胺复合材料，它是有用的尖晶石晶体填料，其中复合材料具有介于0.05和0.60微米-1之间的可见光到红外光消光系数。 由此形成的复合聚酰亚胺通常用于制造具有与聚酰亚胺基底相邻的精细导电路径的电路。 通常使用无电极金属电镀步骤在基板上形成这些精细的导电通路。 首先，聚酰亚胺复合材料的表面通常通过使用激光束进行光激活，然后将光活化部分电镀以在膜的表面上形成细线或路径。
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公开(公告)号：US07531204B2
公开(公告)日：2009-05-12
申请号：US11891129
申请日：2007-08-09
Applicant: Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Carl B. Wang , Brian C. Auman , Shane Fang
Inventor： Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Carl B. Wang , Brian C. Auman , Shane Fang
IPC: B05D3/00
CPC classification number: H05K3/185 , C23C18/02 , C23C18/1216 , C23C18/1233 , C23C18/1295 , C23C18/204 , Y10T428/24917 , Y10T428/25 , Y10T428/31511 , Y10T428/3154 , Y10T428/31725 , Y10T428/31786
Abstract: A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.
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15.发明授权Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related thereto 失效能够被光活化并接受直接金属化的聚合物基电容器复合材料，以及与其相关的方法和组合物公开(公告)号：US07504150B2
公开(公告)日：2009-03-17
申请号：US11153176
申请日：2005-06-15
Applicant: Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Brian C. Auman
Inventor： Yueh-Ling Lee , Meredith L. Dunbar , Harry Richard Zwicker , Brian C. Auman
CPC classification number: H01G4/20 , H01G4/14 , H05K1/0346 , H05K1/0373 , H05K1/162 , H05K3/185 , H05K2201/0154 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/107 , Y10T428/25 , Y10T428/256 , Y10T428/26 , Y10T428/31529 , Y10T428/3154 , Y10T428/31681 , Y10T428/31721
Abstract: The present invention relates generally to polymer composites having dispersed therein both useful spinel crystal fillers and ferroelectric (and/or paraelectric) fillers wherein the composite is both light activatable and can be used as a planar capacitor material. The light activation is typically employed via a laser beam (or other light emitting device) where the material has a pattern formed thereon. Electrodes are typically formed on the material's surface after patterning is complete via electroless metal plating. These composite polymers can be used as planar capacitors embedded in printed wiring boards or in integrated circuit packages.
Abstract translation: 本发明一般涉及其中分散有有用的尖晶石晶体填料和铁电（和/或顺电）填料的聚合物复合材料，其中复合材料既可光活化又可用作平面电容器材料。 通常通过激光束（或其他发光器件）使用光激活，其中材料具有形成在其上的图案。 通过无电金属电镀完成图案化之后，电极通常形成在材料的表面上。 这些复合聚合物可以用作嵌入印刷线路板或集成电路封装中的平面电容器。
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Patent Agency Ranking
公开(公告)号：US20060286364A1
公开(公告)日：2006-12-21
申请号：US11153176
申请日：2005-06-15
Applicant: Yueh-Ling Lee , Meredith Dunbar , Harry Zwicker , Brian Auman
Inventor： Yueh-Ling Lee , Meredith Dunbar , Harry Zwicker , Brian Auman
CPC classification number: H01G4/20 , H01G4/14 , H05K1/0346 , H05K1/0373 , H05K1/162 , H05K3/185 , H05K2201/0154 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K2203/107 , Y10T428/25 , Y10T428/256 , Y10T428/26 , Y10T428/31529 , Y10T428/3154 , Y10T428/31681 , Y10T428/31721
Abstract: The present invention relates generally to polymer composites having dispersed therein both useful spinel crystal fillers and ferroelectric (and/or paraelectric) fillers wherein the composite is both light activatable and can be used as a planar capacitor material. The light activation is typically employed via a laser beam (or other light emitting device) where the material has a pattern formed thereon. Electrodes are typically formed on the material's surface after patterning is complete via electroless metal plating. These composite polymers can be used as planar capacitors embedded in printed wiring boards or in integrated circuit packages.
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17.发明授权
公开(公告)号：US6159611A
公开(公告)日：2000-12-12
申请号：US222103
申请日：1998-12-29
Applicant: Yueh-Ling Lee , Gary Min
Inventor： Yueh-Ling Lee , Gary Min
IPC: C08J5/18 , B32B27/18 , B32B27/34 , C08K3/22 , C08K9/00 , C08L79/08 , H05K1/03 , H05K1/16 , H05K3/38 , H05K3/46 , B32B27/06
CPC classification number: B32B27/08 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B27/34 , B32B2255/20 , B32B2307/204 , B32B2379/08 , B32B2457/08 , B32B2457/16 , C08K3/24 , H05K1/0346 , H05K1/0373 , H05K1/162 , H05K3/386 , H05K3/4611 , H05K2201/0154 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , Y10T428/252 , Y10T428/2852 , Y10T428/2896 , Y10T428/31721 , C08L79/08
Abstract: A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titanate or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.
Abstract translation: 一种柔性的高介电常数的聚酰亚胺膜，由一层粘合的热塑性聚酰亚胺膜或多层聚酰亚胺膜组成，所述多层聚酰亚胺膜具有粘接在该膜的一面或两面上并具有分散在至少一个聚酰亚胺 4至85重量％的铁电陶瓷填料，例如钛酸钡或聚酰亚胺涂覆的钛酸钡，介电常数为4至60.介电常数聚酰亚胺膜可用于电子电路和电子部件，例如 作为多层印刷电路，柔性电路，半导体封装和埋膜电容器。
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18.发明授权
公开(公告)号：US6150456A
公开(公告)日：2000-11-21
申请号：US312185
申请日：1999-05-14
Applicant: Yueh-Ling Lee , Gary Min
Inventor： Yueh-Ling Lee , Gary Min
IPC: C08J5/18 , B32B27/18 , B32B27/34 , C08K3/22 , C08K9/00 , C08L79/08 , H05K1/03 , H05K1/16 , H05K3/38 , H05K3/46
CPC classification number: H05K1/162 , B32B27/34 , C08K3/24 , H05K1/0373 , H05K1/0346 , H05K2201/0154 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , H05K3/386 , H05K3/4611 , Y10T428/252 , Y10T428/2852 , Y10T428/2896 , Y10T428/31721
Abstract: A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titante or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.
Abstract translation: 一种柔性的高介电常数的聚酰亚胺膜，由一层粘合的热塑性聚酰亚胺膜或多层聚酰亚胺膜组成，所述多层聚酰亚胺膜具有粘接在该膜的一面或两面上并具有分散在至少一个聚酰亚胺 4至85重量％的铁电陶瓷填料，例如钡钛酸盐或聚酰亚胺涂覆的钛酸钡，介电常数为4至60.介电常数聚酰亚胺膜可用于电子电路和电子元件 作为多层印刷电路，柔性电路，半导体封装和埋膜电容器。
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19.发明授权Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto 失效用于接受选择性金属化的可光活化的聚酰亚胺组合物，以及与其相关的方法和组合物公开(公告)号：US08323802B2
公开(公告)日：2012-12-04
申请号：US12491692
申请日：2009-06-25
Applicant: Meredith L. Dunbar , Yueh-Ling Lee , Carl B. Wang
Inventor： Meredith L. Dunbar , Yueh-Ling Lee , Carl B. Wang
IPC: B32B27/06
CPC classification number: C08L79/08 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K3/013 , C08K3/22 , H05K1/0346 , H05K1/036 , H05K1/0373 , H05K3/185 , H05K2201/0154 , H05K2201/0209 , H05K2203/107 , Y10T428/31721 , Y10T428/31725
Abstract: The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns−1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.
Abstract translation: 本发明一般涉及分散在聚酰亚胺基体中的聚酰亚胺复合材料，它是有用的尖晶石晶体填料，其中复合材料具有介于0.05和0.60微米-1之间的可见光到红外光消光系数。 由此形成的复合聚酰亚胺通常用于制造具有与聚酰亚胺基底相邻的精细导电路径的电路。 通常使用无电极金属电镀步骤在基板上形成这些精细的导电通路。 首先，聚酰亚胺复合材料的表面通常通过使用激光束进行光激活，然后将光活化部分电镀以在膜的表面上形成细线或路径。
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公开(公告)号：US20100263919A1
公开(公告)日：2010-10-21
申请号：US12086296
申请日：2006-12-28
Applicant: Yueh-Ling Lee , Meredith L. Dunbar , Xin Shane Fang , Carl Wang
Inventor： Yueh-Ling Lee , Meredith L. Dunbar , Xin Shane Fang , Carl Wang
CPC classification number: H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/165 , C25D5/02 , C25D5/54 , H05K1/0373 , H05K3/0032 , H05K2201/0236
Abstract: An electronic type substrate having 40 to 97 weight-percent polymer and 3 to 60 weight-percent auto-catalytic crystalline filler. An interconnect or a conductor trace is created in the substrate by: i. drilling or ablating with a high energy electromagnetic source, such as a laser, thereby selectively activating the multi cation crystal filler along the surface created by the drilling or ablating step; and ii. metalizing by electroless and/or electrolytic plating into the drilled or ablated portion of the substrate, where the metal layer is formed in a contacting relationship with the activated multi cation crystal filler at the interconnect boundary without a need for a separate metallization seed layer or pre-dip.
Abstract translation: 具有40至97重量％聚合物和3至60重量％自催化结晶填料的电子型基材。 通过以下方式在衬底中形成互连或导体迹线：i。 用诸如激光器的高能电磁源进行钻孔或烧蚀，从而沿着由钻孔或烧蚀步骤产生的表面选择性地激活多阳离子晶体填料; 和ii。 通过无电镀和/或电解电镀金属化到衬底的钻孔或烧蚀部分中，其中金属层在互连边界处与活化的多阳离子晶体填料形成接触关系，而不需要单独的金属化种子层或预先 -蘸。
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