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    Adhesive composition with functional filler
    2.
    发明授权
    Adhesive composition with functional filler 失效
    具有功能填料的粘合剂组合物

    公开(公告)号：US5331040A

    公开(公告)日：1994-07-19

    申请号：US966256

    申请日：1992-10-26

    Applicant: Yueh-Ling Lee

    Inventor： Yueh-Ling Lee

    IPC: C09J133/06 ,  B32B7/12 ,  B32B27/00 ,  C08L33/08 ,  C08L33/18 ,  C09J133/04 ,  C09J133/08 ,  C09J133/18 ,  C09J133/20 ,  H05K1/00 ,  H05K3/38 ,  C08L33/00

    CPC classification number: H05K3/386 ,  C09J133/08 ,  C09J133/18 ,  C08L33/08 ,  C08L33/18 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10T428/31681 ,  Y10T442/2713 ,  Y10T442/2738

    Abstract: An adhesive composition containing a latex binder, a latex plasticizer and a functional filler. The latex plasticizer includes a copolymer comprising (1) 0-15% by weight, based upon the weight of the copolymer, of acrylonitrile, methacrylonitrile or mixtures thereof, (ii) 80-85% by weight, based upon the weight of the copolymer, of butyl acrylate, ethyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, lauryl methacrylate, octyl acrylate, heptyl acrylate, or mixtures thereof, and (iii) 1-5% by weight, based upon the weight of the copolymer, of methacrylic acid, acrylic acid, itaconic acid, or mixtures thereof, said latex plasticizer having a T.sub.g less than that of the latex binder (a) and a decomposition temperature of at least 288.degree. C. The composition is useful for adhering polyimide films such as in the fabrication of flexible circuits.

    Abstract translation: 一种含有胶乳粘合剂，胶乳增塑剂和功能性填料的粘合剂组合物。 胶乳增塑剂包括共聚物，其包含（1）基于共聚物重量的0-15重量％的丙烯腈，甲基丙烯腈或其混合物，（ii）80-85重量％，基于共聚物的重量 ，丙烯酸丁酯，丙烯酸乙酯，丙烯酸2-乙基己酯，丙烯酸月桂酯，甲基丙烯酸月桂酯，丙烯酸辛酯，丙烯酸庚酯或其混合物，和（iii）基于共聚物的重量，1-5重量％ 酸，丙烯酸，衣康酸或其混合物，所述胶乳增塑剂的Tg小于胶乳粘合剂（a）的Tg，分解温度至少为288℃。该组合物可用于粘合聚酰亚胺膜，例如 柔性电路的制造。

    METHOD OF OBTAINING ELECTRONIC CIRCUITRY FEATURES
    4.
    发明申请
    METHOD OF OBTAINING ELECTRONIC CIRCUITRY FEATURES 审中-公开
    获得电子电路特征的方法

    公开(公告)号：US20100181284A1

    公开(公告)日：2010-07-22

    申请号：US12369798

    申请日：2009-02-12

    Applicant: Yueh-Ling Lee ,  Glenn Oliver ,  Shane Fang

    Inventor： Yueh-Ling Lee ,  Glenn Oliver ,  Shane Fang

    IPC: B44C1/22

    CPC classification number: H05K3/0032 ,  H05K3/048 ,  H05K3/107 ,  H05K2201/0112 ,  H05K2203/1383

    Abstract: The present disclosure relates to a method of obtaining fine circuitry features by positioning a circuit board precursor, the circuit board precursor having a cover layer and an insulating substrate, in proximity to a source of laser radiation. Selectively laser ablating through the cover layer and into the underlying insulating substrate and then treating with water, dilute alkali solution or dilute acid solution to remove the cover layer to reveal one or more circuitry features on the insulating substrate that are smaller than if a cover layer is not used.

    Abstract translation: 本公开涉及通过将电路板前体（具有覆盖层和绝缘基板）的电路板前体定位在激光辐射源附近来获得精细电路特征的方法。 通过选择性激光烧蚀通过覆盖层并进入下面的绝缘基底，然后用水，稀碱溶液或稀酸溶液处理以除去覆盖层，以揭示绝缘基底上的一个或多个电路特征，如果覆盖层 未使用。

    Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
    6.
    发明申请
    Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto 审中-公开
    用于接受选择性金属化的可光活化的聚酰亚胺组合物，以及与其相关的方法和组合物

    公开(公告)号：US20060083939A1

    公开(公告)日：2006-04-20

    申请号：US10969430

    申请日：2004-10-20

    Applicant: Meredith Dunbar ,  Yueh-Ling Lee ,  Carl Wang

    Inventor： Meredith Dunbar ,  Yueh-Ling Lee ,  Carl Wang

    IPC: B32B27/00

    CPC classification number: C08G73/1007 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/107 ,  Y10T428/31721

    Abstract: The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns−1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.

    Abstract translation: 本发明一般涉及分散在聚酰亚胺基体中的聚酰亚胺复合材料，它是有用的尖晶石晶体填料，其中该复合材料具有介于0.05和0.60微米-1之间的可见光到红外光消光系数。 由此形成的复合聚酰亚胺通常用于制造具有与聚酰亚胺基底相邻的精细导电路径的电路。 通常使用无电极金属电镀步骤在基板上形成这些精细的导电通路。 首先，聚酰亚胺复合材料的表面通常通过使用激光束进行光激活，然后将光活化部分电镀以在膜的表面上形成细线或路径。

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