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    OPTICAL MODULE
    13.
    发明公开
    OPTICAL MODULE 审中-公开

    公开(公告)号：US20240219524A1

    公开(公告)日：2024-07-04

    申请号：US18092148

    申请日：2022-12-30

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsin-Ying HO

    IPC: G01S7/481 ,  G01S17/08

    CPC classification number: G01S7/4811 ,  G01S17/08

    Abstract: An optical module is disclosed. The optical module includes an emitter, a receiver, and a pre-formed transparent element disposed over the emitter and the receiver. The pre-formed transparent element is configured to provide an optical guiding path within the optical module.

    OPTICAL SYSTEM AND METHOD OF MANUFACTURING THE SAME
    14.
    发明申请
    OPTICAL SYSTEM AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220221332A1

    公开(公告)日：2022-07-14

    申请号：US17707802

    申请日：2022-03-29

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsin-Ying HO ,  Ying-Chung CHEN

    IPC: G01J1/02

    Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

    OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
    15.
    发明申请
    OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20190259741A1

    公开(公告)日：2019-08-22

    申请号：US16404337

    申请日：2019-05-06

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsin-Ying HO

    IPC: H01L25/16 ,  H02S40/44 ,  H01L31/12

    Abstract: An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.

    OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
    18.
    发明申请
    OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    光传感器模块及其制造方法

    公开(公告)号：US20160307881A1

    公开(公告)日：2016-10-20

    申请号：US14691434

    申请日：2015-04-20

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsin-Ying HO

    IPC: H01L25/16 ,  H01L25/00

    Abstract: An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component, a light sensing component, and a lid. The light emitting component is disposed within the first chamber and the light sensing component is disposed within the second chamber. The lid includes a first lens with a non-convex upper surface and a convex lower surface facing the light emitting component. The upper surface of the first lens may be substantially planar. The lid may further include a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed.

    Abstract translation: 光学传感器模块包括限定第一室的盖和与第一室隔离的第二室，发光部件，光感测部件和盖。 发光部件设置在第一室内，光检测部件设置在第二室内。 盖包括具有非凸上表面的第一透镜和面向发光部件的凸下表面。 第一透镜的上表面可以是大致平面的。 盖子还可以包括第二透镜和封盖基底，其中第一腔室的顶部和第二腔室的顶部由封盖衬底划定，并且其中封盖衬底限定第一穿透孔，第一透镜和第二透镜 形成或布置的第二透镜和形成或布置第二透镜的第二穿透孔。

    PACKAGE STRUCTURE
    19.
    发明申请
    PACKAGE STRUCTURE 有权

    公开(公告)号：US20250107298A1

    公开(公告)日：2025-03-27

    申请号：US18373853

    申请日：2023-09-27

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsin-Ying HO

    IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16 ,  H01L33/54

    Abstract: A package structure is provided. The package structure includes a substrate, a first electronic component, an interposer, a conductive wire, and a conductive adhesive. The first electronic component and the interposer are disposed over the substrate. The conductive wire connects the first electronic component to the interposer. The conductive adhesive (connects the interposer to the substrate.

    OPTICAL SYSTEM AND METHOD OF MANUFACTURING THE SAME
    20.
    发明公开
    OPTICAL SYSTEM AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20240175745A1

    公开(公告)日：2024-05-30

    申请号：US18434706

    申请日：2024-02-06

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsin-Ying HO ,  Ying-Chung CHEN

    IPC: G01J1/02

    CPC classification number: G01J1/0209 ,  G01J1/0214

    Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

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