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    Method Of Making An Acoustic Assembly For A Transducer
    11.
    发明申请
    Method Of Making An Acoustic Assembly For A Transducer 失效
    制造传感器声学组件的方法

    公开(公告)号：US20060218763A1

    公开(公告)日：2006-10-05

    申请号：US11277697

    申请日：2006-03-28

    Applicant: Mekell Jiles ,  David Schafer ,  Anthony Minervini ,  Hanny Sunarto ,  Thomas Miller ,  Daniel Warren

    Inventor： Mekell Jiles ,  David Schafer ,  Anthony Minervini ,  Hanny Sunarto ,  Thomas Miller ,  Daniel Warren

    IPC: H04R17/00

    CPC classification number: H04R7/125 ,  H04R7/10 ,  H04R7/20 ,  H04R9/00 ,  H04R11/00 ,  H04R11/02 ,  H04R25/00 ,  H04R31/003 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T156/1052

    Abstract: A method of making an acoustic assembly for use in a transducer includes forming a multi-layer structure. The multi-layer structure includes a first layer member that includes a first center portion, a first edge portion and a first aperture separating the first center portion and the first edge portion. A second layer member includes a second center portion, a second edge portion and a second aperture separating the second center portion and the second edge portion such that the second center portion is free to move relative to the second edge portion. The first and second layers are formed into an assembly wherein the first center portion and the second center portion are coupled, the first edge portion and the second edge portion are coupled, and the first aperture and the second aperture are substantially aligned to define a passageway. The assembly has an assembly stiffness that is greater than the stiffness of either the first or second layer members. A hinge joins the assembled first and second center portions and the first and second edge portions such that the assembled first and second center portions is free to at least partially rotate relative to the assembled first and second edge portions about an axis. A flexible layer member is coupled to the assembly and provides airtight sealing of the passageway.

    Abstract translation: 制造用于换能器的声学组件的方法包括形成多层结构。 多层结构包括第一层构件，其包括第一中心部分，第一边缘部分和分隔第一中心部分和第一边缘部分的第一孔。 第二层构件包括第二中心部分，第二边缘部分和将第二中心部分和第二边缘部分分开的第二孔，使得第二中心部分相对于第二边缘部分自由移动。 第一和第二层被形成为组合件，其中第一中心部分和第二中心部分联接，第一边缘部分和第二边缘部分被联接，并且第一孔和第二孔基本上对准以限定通道 。 组件具有大于第一或第二层构件的刚度的组件刚度。 铰链将组装的第一和第二中心部分以及第一和第二边缘部分接合，使得组装的第一和第二中心部分相对于组装的第一和第二边缘部分围绕轴线自由地至少部分地旋转。 柔性层构件联接到组件并且提供通道的气密密封。

    Microelectromechanical system package with strain relief bridge
    12.
    发明授权
    Microelectromechanical system package with strain relief bridge 有权
    具有应变消除桥的微机电系统封装

    公开(公告)号：US08450817B2

    公开(公告)日：2013-05-28

    申请号：US12191857

    申请日：2008-08-14

    Applicant: Anthony Minervini

    Inventor： Anthony Minervini

    IPC: H01L29/84

    CPC classification number: B81B7/0048 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0109 ,  H01L2924/0002 ,  H04R1/04 ,  H04R2201/003 ,  H01L2924/00

    Abstract: A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

    Abstract translation: 用于MEMS封装的应变吸收桥包括被配置为可附接到电路板的第一衬底。 第一可弹性变形的元件被耦合到第一基板，并且第一可弹性变形元件构造成可附接到MEMS装置。 或者，MEMS器件可以附接到第一衬底。 可弹性变形的元件至少部分地吸收并消散在机械应变到达MEMS装置之前从电路板传递的机械应变。

    MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF
    13.
    发明申请
    MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF 审中-公开
    具有至少一个端口的MEMS封装及其制造方法

    公开(公告)号：US20080217709A1

    公开(公告)日：2008-09-11

    申请号：US12034764

    申请日：2008-02-21

    Applicant: Anthony Minervini ,  Gwendolyn P. Massingill

    Inventor： Anthony Minervini ,  Gwendolyn P. Massingill

    IPC: H01L23/053 ,  H01L21/52

    CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81C1/00873 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A plurality of individual MEMS packages are formed as a contiguous unit and each of the plurality of individual MEMS packages include at least one acoustic port. One or more separation boundaries from where to separate adjacent ones of the plurality of individual MEMS packages are determined. Each of the plurality of individual MEMS packages are subsequently separated from the others according to the one or more separation boundaries to provide separate and distinct individual MEMS packages. Each acoustic port disposed within each separate and distinct individual MEMS package is exposed due to the separating so as to allow sound energy to enter each separate and distinct individual MEMS package.

    Abstract translation: 形成多个单独的MEMS封装作为连续单元，并且多个单个MEMS封装中的每一个包括至少一个声学端口。 确定与多个单独的MEMS封装中的相邻单个MEMS封装的分离位置的一个或多个分离边界。 多个单独的MEMS封装中的每一个随后根据一个或多个分离边界与其他单独的MEMS封装分离，以提供单独且独特的各个MEMS封装。 设置在每个单独和独立的单个MEMS封装内的每个声学端口由于分离而被暴露，以便允许声能进入每个单独和不同的单个MEMS封装。

    Electrical apparatus for overcurrent protection of electrical circuits
    15.
    发明授权
    Electrical apparatus for overcurrent protection of electrical circuits 失效
    电路过流保护用电气设备

    公开(公告)号：US5939968A

    公开(公告)日：1999-08-17

    申请号：US153688

    申请日：1998-09-15

    Applicant: Thinh Nguyen ,  Anthony Minervini

    Inventor： Thinh Nguyen ,  Anthony Minervini

    IPC: H01C1/14 ,  H01C7/02 ,  H02H5/04 ,  H02H9/00

    CPC classification number: H01C1/1406 ,  H01C7/027

    Abstract: An electrical apparatus comprising first and second PTC elements composed of a polymer composition with conductive particles dispersed therein, an insulating body, and first and second conductive terminals. Flexible conductive members having a first end that can be electrically connected to a source of electrical power and a second end that is adapted to receive and make electrical contact with the apparatus are provided. The PTC element and the insulating body are positioned between the first and second conductive terminals so that when the apparatus is inserted between the flexible conductive members, the members exert a pressure on the insulating body.

    Abstract translation: 一种电气设备，包括由分散有导电颗粒的聚合物组合物构成的第一和第二PTC元件，绝缘体以及第一和第二导电端子。 提供具有可以电连接到电源的柔性导电构件和适于接收和与设备进行电接触的第二端。 PTC元件和绝缘体位于第一和第二导电端子之间，使得当设备插入在柔性导电构件之间时，构件对绝缘体施加压力。

    Miniature Silicon Condenser Microphone
    18.
    发明申请
    Miniature Silicon Condenser Microphone 有权
    微型硅冷凝器麦克风

    公开(公告)号：US20070082421A1

    公开(公告)日：2007-04-12

    申请号：US11538056

    申请日：2006-10-03

    Applicant: Anthony Minervini

    Inventor： Anthony Minervini

    IPC: H01L21/00

    CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  H01L2924/0002 ,  H04R19/016 ,  H04R31/006 ,  Y10T29/49005 ,  Y10T29/4908 ,  H01L2924/00

    Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.

    Abstract translation: 硅电容麦克风封装包括换能器单元，基板和盖。 基板包括上表面传感器单元，其附接到基板的上表面并与凹部的至少一部分重叠，其中换能器单元的后部体积形成在换能器单元和基板之间。 将盖放置在换能器单元上方，并且盖或基板包括孔。

    Miniature Silicon Condenser Microphone and Method for Producing the Same
    19.
    发明申请
    Miniature Silicon Condenser Microphone and Method for Producing the Same 失效
    微型硅冷凝器麦克风及其制造方法

    公开(公告)号：US20060157841A1

    公开(公告)日：2006-07-20

    申请号：US11276025

    申请日：2006-02-10

    Applicant: Anthony Minervini

    Inventor： Anthony Minervini

    IPC: H01L23/02

    CPC classification number: H04R19/04 ,  H01L2924/0002 ,  Y10T29/49005 ,  Y10T29/4908 ,  H01L2924/00

    Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.

    Abstract translation: 硅电容麦克风封装包括换能器单元，基板和盖。 基板包括上表面传感器单元，其附接到基板的上表面并与凹部的至少一部分重叠，其中换能器单元的后部体积形成在换能器单元和基板之间。 将盖放置在换能器单元上方，并且盖或基板包括孔。

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