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    Discrete optical unit on a substrate of an integrated photonics chip
    12.
    发明授权
    Discrete optical unit on a substrate of an integrated photonics chip 有权

    公开(公告)号：US11644618B2

    公开(公告)日：2023-05-09

    申请号：US17254810

    申请日：2019-06-21

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Lexie Nicole Schachne ,  Jason Pelc

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/42

    CPC classification number: G02B6/12004 ,  G02B6/122 ,  G02B6/4244 ,  G02B2006/12104 ,  G02B2006/12138

    Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

    Photonics assembly with a photonics die stack
    13.
    发明授权
    Photonics assembly with a photonics die stack 有权

    公开(公告)号：US11881678B1

    公开(公告)日：2024-01-23

    申请号：US17015766

    申请日：2020-09-09

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Kwan-Yu Lai ,  Alex Goldis ,  Alfredo Bismuto ,  Jeffrey Thomas Hill

    IPC: H01S5/00 ,  H01S5/40 ,  G02B3/06 ,  G02B26/08 ,  G02B26/10 ,  G02B6/12

    CPC classification number: H01S5/0071 ,  G02B3/06 ,  G02B6/12 ,  G02B26/0833 ,  G02B26/105 ,  H01S5/4043 ,  H01S5/4087

    Abstract: Configurations for a photonics assembly and the operation thereof are disclosed. The photonics assembly may include multiple photonics dies which may be arranged in an offset vertical stack. The photonics dies may emit light, and in some examples, an optical element may be a detector for monitoring properties such as the wavelength of the light. The photonics dies may be arranged in a stack as a package and the packages may be stacked or arranged side by side or both for space savings. The PIC may include combining and/or collimating optics to receive light from the photonics dies, a mirror to redirect the light, and an aperture structure. The aperture structure may include a region which is at least partially transparent such that light transmits through the transparent region of the aperture structure. The aperture structure may include an at least partially opaque region which may be used for directing and/or controlling the light launch position.

    Integrated Photonics Device Having Integrated Edge Outcouplers
    14.
    发明申请
    Integrated Photonics Device Having Integrated Edge Outcouplers 有权

    公开(公告)号：US20220236503A1

    公开(公告)日：2022-07-28

    申请号：US17575326

    申请日：2022-01-13

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Jason S. Pelc ,  Mario J. Costello

    IPC: G02B6/42 ,  G01N21/47 ,  G01N21/49

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

    Laser Integration Techniques
    15.
    发明申请
    Laser Integration Techniques 有权

    公开(公告)号：US20220131340A1

    公开(公告)日：2022-04-28

    申请号：US17519355

    申请日：2021-11-04

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Jason Pelc ,  Vijay M. Iyer ,  Alex Goldis

    IPC: H01S5/02355 ,  G02B6/13 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/02251 ,  H01S5/02345

    Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

    Systems and methods for forming thin bulk junction thermoelectric devices in package
    16.
    发明授权
    Systems and methods for forming thin bulk junction thermoelectric devices in package 有权

    公开(公告)号：US10964873B1

    公开(公告)日：2021-03-30

    申请号：US15873767

    申请日：2018-01-17

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Gregory L. Tice ,  Mario J. Costello ,  Reid A. Black ,  Vijay M. Iyer

    IPC: H01L35/32 ,  H01L35/16 ,  G05D23/19 ,  H01L35/34 ,  H01L35/18

    Abstract: This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.

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