Optical wall and process sensor with plasma facing sensor

    公开(公告)号:US11499869B2

    公开(公告)日:2022-11-15

    申请号:US16682616

    申请日:2019-11-13

    Abstract: Embodiments disclosed herein include an optical sensor system for use in plasma processing tools. In an embodiment, the optical sensor system, comprises an optically clear body with a first surface and a second surface facing away from the first surface. In an embodiment, the optically clear body further comprises a third surface that is recessed from the second surface. In an embodiment, the optical sensor system further comprises a target over the third surface and a first reflector to optically couple the first surface to the target.

    MICRO RESONATOR ARRAY SENSOR FOR DETECTING WAFER PROCESSING PARAMETERS

    公开(公告)号:US20190265286A1

    公开(公告)日:2019-08-29

    申请号:US16283364

    申请日:2019-02-22

    Abstract: Embodiments include systems and methods for determining a processing parameter of a processing operation. Embodiments include a diagnostic substrate for determining processing parameters of a processing operation. In an embodiment, the diagnostic substrate comprises a substrate, a circuit layer over the substrate, and a capping layer over the circuit layer. In an embodiment, a micro resonator sensor is in the circuit layer and the capping layer. In an embodiment, the micro resonator sensor comprises, a resonating body and one or more electrodes for inducing resonance in the resonating body.

    Surface acoustic wave sensor assembly

    公开(公告)号:US11920994B2

    公开(公告)日:2024-03-05

    申请号:US17068733

    申请日:2020-10-12

    Inventor: Chuang-Chia Lin

    CPC classification number: G01L11/04 G01K1/024 G01K11/265 G01L19/086

    Abstract: A sensor assembly that includes a surface acoustic wave (SAW) sensor. The SAW sensor is adapted to measure a first environmental condition in response to receiving an RF signal. The SAW sensor includes a substrate having a layer of piezoelectric material. The SAW sensor further includes a interdigitated transducer (IDT) formed on the piezoelectric material. The IDT includes two comb-shaped electrodes having interlocking conducting digits in a first arrangement. The interlocking conducting digits in the first arrangement generates a first signal modulation of an RF signal received by the first IDT. The first signal modulation identifies the first SAW sensor.

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