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公开(公告)号：US20230182261A1
公开(公告)日：2023-06-15
申请号：US18167007
申请日：2023-02-09
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC: B24B37/32
CPC classification number: B24B37/32 , Y10T29/49815
Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
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公开(公告)号：US11577361B2
公开(公告)日：2023-02-14
申请号：US17590764
申请日：2022-02-01
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
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公开(公告)号：US10076817B2
公开(公告)日：2018-09-18
申请号：US14334608
申请日：2014-07-17
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Paul D. Butterfield , Jay Gurusamy , Jason Garcheung Fung , Shou-Sung Chang , Jimin Zhang , Eric Lau
CPC classification number: B24B37/10
Abstract: A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.
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公开(公告)号：US09662762B2
公开(公告)日：2017-05-30
申请号：US14334948
申请日：2014-07-18
Applicant: Applied Materials, Inc.
Inventor： Jay Gurusamy , Hung Chih Chen
IPC: B24B7/22 , B24B37/34 , B24B37/04 , H01L21/306
CPC classification number: B24B37/042 , B24B37/34 , H01L21/30625
Abstract: A polishing system include a support to hold a substrate having a substrate surface to be polished, a carrier to hold a polishing pad in contact with the substrate surface, and a pressure applicator to apply pressure at a selected region of a back surface of the polishing pad. The back surface is opposite to the polishing surface. The pressure applicator includes an actuator and a body configured to be moved by the actuator into and out of contact with the selected region of the back surface of the polishing pad.
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公开(公告)号：US09492905B2
公开(公告)日：2016-11-15
申请号：US14679817
申请日：2015-04-06
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Samuel Chu-Chiang Hsu , Gautam Shashank Dandavate
Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.
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Patent Agency Ranking
公开(公告)号：US09358658B2
公开(公告)日：2016-06-07
申请号：US14213842
申请日：2014-03-14
Applicant: Applied Materials, Inc.
Inventor： Shou-Sung Chang , Takashi Fujikawa , Hung Chih Chen , Paul D. Butterfield
CPC classification number: B24B37/005 , B24B37/042 , B24B37/10 , B24B37/16 , B24B37/32 , B24B49/16
Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
Abstract translation: 抛光装置包括具有支撑抛光垫的第一表面和第二表面的压板，用于将衬底保持在抛光垫上的载体头，限定在压板中的多个通孔和相邻的衬垫压力控制组件 在压板的与承载头相对的一侧。
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公开(公告)号：US20140273767A1
公开(公告)日：2014-09-18
申请号：US13797468
申请日：2013-03-12
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Shou-Sung Chang , Jason Garcheung Fung
IPC: B24B53/017
CPC classification number: B24B53/017
Abstract: A polishing system includes a polishing pad having a polishing surface and a conditioner apparatus. The conditioner apparatus includes a conditioner head constructed to receive a conditioning disk for conditioning a surface of the polishing pad, an arm that supports the conditioner head, a base that supports the arm, the arm pivotally connected to the base such that the arm is pivotable about a pivot point to change an angle of inclination of the arm, wherein the pivot point is positioned below the polishing surface of the polishing pad.
Abstract translation: 抛光系统包括具有抛光表面的抛光垫和调节装置。 调节装置包括：调节头，其构造成接收用于调节抛光垫的表面的调节盘，支撑调节头的臂，支撑臂的基座，枢转地连接到基座的臂，使得臂可枢转 围绕枢转点来改变所述臂的倾斜角，其中所述枢转点位于所述抛光垫的抛光表面下方。
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公开(公告)号：US20140273765A1
公开(公告)日：2014-09-18
申请号：US14213842
申请日：2014-03-14
Applicant: Applied Materials, Inc.
Inventor： Shou-Sung Chang , Takashi Fujikawa , Hung Chih Chen , Paul D. Butterfield
IPC: B24B37/005 , B24B37/10
CPC classification number: B24B37/005 , B24B37/042 , B24B37/10 , B24B37/16 , B24B37/32 , B24B49/16
Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
Abstract translation: 抛光装置包括具有支撑抛光垫的第一表面和第二表面的压板，用于将衬底保持在抛光垫上的载体头，限定在压板中的多个通孔和相邻的衬垫压力控制组件 在压板的与承载头相对的一侧。
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公开(公告)号：US09937601B2
公开(公告)日：2018-04-10
申请号：US14927193
申请日：2015-10-29
Applicant: Applied Materials, Inc.
Inventor： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC: B24B37/32
CPC classification number: B24B37/32 , Y10T29/49815
Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
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公开(公告)号：US20160279756A1
公开(公告)日：2016-09-29
申请号：US15173491
申请日：2016-06-03
Applicant: Applied Materials, Inc.
Inventor： Shou-Sung Chang , Takashi Fujikawa , Hung Chih Chen , Paul D. Butterfield
IPC: B24B37/005 , B24B37/10
CPC classification number: B24B37/005 , B24B37/042 , B24B37/10 , B24B37/16 , B24B37/32 , B24B49/16
Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.
Abstract translation: 抛光装置包括具有支撑抛光垫的第一表面和第二表面的压板，用于将衬底保持在抛光垫上的载体头，限定在压板中的多个通孔和相邻的衬垫压力控制组件 在压板的与承载头相对的一侧。
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