-
11.发明授权公开(公告)号：US12210099B2
公开(公告)日：2025-01-28
申请号：US17054250
申请日：2019-05-10
Applicant: Aurora Operations, Inc.
Inventor： Phillip Sandborn , Sen Lin , James Ferrara
Abstract: A FMCW LIDAR system for simultaneous beam scanning of the target environment. The system can include a photonics assembly couplable to a beam steering module. The photonics assembly is configured to receive a frequency modulated laser beam and can include an optical splitter and a coherent receiver. The optical splitter can be configured to optically split the frequency modulated laser beam into a local laser beam and a target laser beam, deliver the target laser beam to the beam steering module, and receive the target laser beam reflected by a target from the beam steering module. The coherent receiver can be configured to mix the local laser beam and the target laser beam to produce an output signal.
-
公开(公告)号：US20230161105A1
公开(公告)日：2023-05-25
申请号：US18051337
申请日：2022-10-31
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin , Andrew Steil Michaels
CPC classification number: G02B6/136 , G01S7/4816 , G02B2006/12107
Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.
-
公开(公告)号：US20230161006A1
公开(公告)日：2023-05-25
申请号：US17853674
申请日：2022-06-29
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin , Andrew Steil Michaels
IPC: G01S7/481 , G01S17/931
CPC classification number: G01S7/4813 , G01S17/931
Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.
-
公开(公告)号：US20250130321A1
公开(公告)日：2025-04-24
申请号：US18990658
申请日：2024-12-20
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin
IPC: G01S7/497 , G01S7/481 , G01S7/4913 , G01S7/4915
Abstract: A light detection and ranging system. The system includes a solid-state optical antenna array, a phase monitor array, a phase controller, a plurality of phase shifters and a global phase shifter. The phase monitor array is configured to output a first mixed signal associated with one of the optical antenna subarrays, and a second mixed signal associated with two of the optical antenna subarrays. The phase controller is configured to output a first phase coefficient based on the first mixed signal and a second phase coefficient based on the second mixed signal. One of the phase shifters is configured to apply the first phase coefficient to compensate for temperature variation within one of the optical antenna subarrays. The global phase shifter is configured to apply the second phase coefficient to compensate for temperature variation between two of the optical antenna subarrays.
-
公开(公告)号：US12222451B2
公开(公告)日：2025-02-11
申请号：US18184260
申请日：2023-03-15
Applicant: Aurora Operations, Inc.
Abstract: A light detection and ranging (LIDAR) device includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. The waveguide runs through the cladding layer. The ohmic element runs through the cladding layer. The ohmic element is arranged to impart heat to the waveguide when an electrical current is driven through the ohmic element.
-
Patent Agency Ranking
公开(公告)号：US12222448B1
公开(公告)日：2025-02-11
申请号：US18516671
申请日：2023-11-21
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Sen Lin , Dong Liu , Xue Liu , Andrew Steil Michaels
IPC: G01S7/481 , G01S17/931 , H01L31/0352
Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die including a substrate having two or more semiconductor stacks respectively associated with two or more semiconductor devices formed on the substrate, the two or more semiconductor devices respectively configured to receive the beam from the light source and modify one or more features of the beam; a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object.
-
公开(公告)号：US20250035869A1
公开(公告)日：2025-01-30
申请号：US18359127
申请日：2023-07-26
Applicant: Aurora Operations, Inc.
Inventor： James Ferrara , Stefan Heinemann , Pruthvi Jujjavarapu , Sen Lin , Zhizhong Tang
IPC: G02B6/42 , G01S17/931
Abstract: Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.
-
公开(公告)号：US12199411B2
公开(公告)日：2025-01-14
申请号：US18486208
申请日：2023-10-13
Applicant: Aurora Operations, Inc.
Inventor： Andrew Steil Michaels , Lei Wang , Sen Lin
IPC: H01S5/40 , B60R16/02 , G01S7/481 , G01S17/08 , G01S17/32 , G02B6/12 , G02B6/42 , H01S3/08 , H01S5/026
Abstract: A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.
-
公开(公告)号：US12199401B1
公开(公告)日：2025-01-14
申请号：US18511387
申请日：2023-11-16
Applicant: Aurora Operations, Inc.
Inventor： James Ferrara , Pruthvi Jujjavarapu , Sen Lin , Xue Liu , Andrew Steil Michaels , Parth Panchal , Zhizhong Tang
Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.
-
公开(公告)号：US12181606B2
公开(公告)日：2024-12-31
申请号：US17870493
申请日：2022-07-21
Applicant: Aurora Operations, Inc.
Inventor： Andrew Steil Michaels , Sen Lin
IPC: G01S7/481 , B60W60/00 , G01S7/4911 , G01S17/931 , G02F1/01
Abstract: A light detection and ranging (LIDAR) pixel includes a splitter, a grating coupler, and a phase shifter. The grating coupler is configured to emit a transmit beam that is based on a combination of a first portion of light and a second portion of light received from a laser. One or more first interconnects and one or more second interconnects couple the splitter to the grating coupler. The phase shifter is coupled to the one or more first interconnects and configured to vary a phase of the first portion of the light relative to a phase of the second portion of the light.
-
-
-
-
-
-
-
-
-
Search Results
38
records
(took 0.015 seconds)
