公开(公告)号：US20240219534A1

公开(公告)日：2024-07-04

申请号：US18356518

申请日：2023-07-21

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Colin Delaney ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/4911 ,  G01S7/481 ,  G01S7/4912

CPC classification number: G01S7/4911 ,  G01S7/4814 ,  G01S7/4917

Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.

公开(公告)号：US11860308B1

公开(公告)日：2024-01-02

申请号：US18056171

申请日：2022-11-16

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  James Ferrara ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Yongxuan Liang ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/481 ,  G01S17/931 ,  H05K7/20

CPC classification number: G01S7/4814 ,  G01S7/4816 ,  G01S7/4817 ,  G01S17/931 ,  H05K7/20509

Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.

公开(公告)号：US20240159874A1

公开(公告)日：2024-05-16

申请号：US18517431

申请日：2023-11-22

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  James Ferrara ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Yongxuan Liang ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/481 ,  G01S17/931 ,  H05K7/20

CPC classification number: G01S7/4814 ,  G01S7/4816 ,  G01S7/4817 ,  G01S17/931 ,  H05K7/20509

Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.

公开(公告)号：US20250164609A1

公开(公告)日：2025-05-22

申请号：US18933680

申请日：2024-10-31

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  Allen Earman ,  James Ferrara ,  Parth Panchal

IPC: G01S7/481 ,  G01S17/931

Abstract: A Light Detection and Ranging (LIDAR) sensor system for a vehicle includes: a housing defining a cavity, a first mount positioned within the cavity, a second mount positioned within the cavity, and a micro optics assembly. The micro optics assembly includes a first portion provided on the first mount and a second portion provided on the second mount. The first portion includes: a light source to emit a beam, a first optical component to direct the beam, an optical isolator to allow the beam directed by the first optical component to pass through the optical isolator and to prevent light from being reflected back into the light source, and a second optical component to direct the beam after having passed through the optical isolator. The second portion includes an optical chip assembly to receive the beam after having been directed by the second optical component.

公开(公告)号：US12199401B1

公开(公告)日：2025-01-14

申请号：US18511387

申请日：2023-11-16

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Xue Liu ,  Andrew Steil Michaels ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S17/88 ,  G02B6/122 ,  H01S5/00 ,  G02B6/12

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.