公开(公告)号：US11860308B1

公开(公告)日：2024-01-02

申请号：US18056171

申请日：2022-11-16

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  James Ferrara ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Yongxuan Liang ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/481 ,  G01S17/931 ,  H05K7/20

CPC classification number: G01S7/4814 ,  G01S7/4816 ,  G01S7/4817 ,  G01S17/931 ,  H05K7/20509

Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.

公开(公告)号：US20240159874A1

公开(公告)日：2024-05-16

申请号：US18517431

申请日：2023-11-22

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  James Ferrara ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Yongxuan Liang ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/481 ,  G01S17/931 ,  H05K7/20

CPC classification number: G01S7/4814 ,  G01S7/4816 ,  G01S7/4817 ,  G01S17/931 ,  H05K7/20509

Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.

公开(公告)号：US20240219534A1

公开(公告)日：2024-07-04

申请号：US18356518

申请日：2023-07-21

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Colin Delaney ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/4911 ,  G01S7/481 ,  G01S7/4912

CPC classification number: G01S7/4911 ,  G01S7/4814 ,  G01S7/4917

Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.

公开(公告)号：US11754687B1

公开(公告)日：2023-09-12

申请号：US18148897

申请日：2022-12-30

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Colin Delaney ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Parth Panchai ,  Zhizhong Tang

IPC: G01C3/08 ,  G01S7/4911 ,  G01S7/481 ,  G01S7/4912

CPC classification number: G01S7/4911 ,  G01S7/4814 ,  G01S7/4917

Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.

公开(公告)号：US20250035869A1

公开(公告)日：2025-01-30

申请号：US18359127

申请日：2023-07-26

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Stefan Heinemann ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Zhizhong Tang

IPC: G02B6/42 ,  G01S17/931

Abstract: Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

公开(公告)号：US12199401B1

公开(公告)日：2025-01-14

申请号：US18511387

申请日：2023-11-16

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Xue Liu ,  Andrew Steil Michaels ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S17/88 ,  G02B6/122 ,  H01S5/00 ,  G02B6/12

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.