Light Detection and Ranging (LIDAR) Sensor System Including Integrated Chip

    公开(公告)号:US20250035869A1

    公开(公告)日:2025-01-30

    申请号:US18359127

    申请日:2023-07-26

    Abstract: Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

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