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公开(公告)号:US11933901B1
公开(公告)日:2024-03-19
申请号:US17944849
申请日:2022-09-14
Applicant: Aurora Operations, Inc.
Inventor: Zeb Barber , Stefan Heinemann , Randy Reibel
IPC: G01C3/08 , G01S7/481 , G01S7/499 , G01S17/931 , G02B6/12
CPC classification number: G01S17/931 , G01S7/4812 , G01S7/4817 , G01S7/499 , G02B6/12004
Abstract: A light detection and ranging (lidar) system for a vehicle may include a receiver layer, a transmitter layer coupled to the receiver layer through an adhesive layer in a first direction, and one or more optics. The transmitter layer may receive, at a first side of the transmitter layer, a transmit signal from a laser source, and transmit the transmit signal through the one or more optics. The receiver layer may receive, through the one or more optics, a return signal reflected by an object in an environment of the vehicle, and output the return signal at a first side of the receiver layer. The first side of the transmitter layer and the first side of the receiver layer may be apart from and parallel to each other in a second direction crossing the first direction.
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公开(公告)号:US20240219534A1
公开(公告)日:2024-07-04
申请号:US18356518
申请日:2023-07-21
Applicant: Aurora Operations, Inc.
Inventor: Ashish Bhardwaj , Colin Delaney , Stefan Heinemann , Amir Hosseini , Pruthvi Jujjavarapu , Parth Panchal , Zhizhong Tang
IPC: G01S7/4911 , G01S7/481 , G01S7/4912
CPC classification number: G01S7/4911 , G01S7/4814 , G01S7/4917
Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.
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公开(公告)号:US11754687B1
公开(公告)日:2023-09-12
申请号:US18148897
申请日:2022-12-30
Applicant: Aurora Operations, Inc.
Inventor: Ashish Bhardwaj , Colin Delaney , Stefan Heinemann , Amir Hosseini , Pruthvi Jujjavarapu , Parth Panchai , Zhizhong Tang
IPC: G01C3/08 , G01S7/4911 , G01S7/481 , G01S7/4912
CPC classification number: G01S7/4911 , G01S7/4814 , G01S7/4917
Abstract: A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.
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公开(公告)号:US20250035869A1
公开(公告)日:2025-01-30
申请号:US18359127
申请日:2023-07-26
Applicant: Aurora Operations, Inc.
Inventor: James Ferrara , Stefan Heinemann , Pruthvi Jujjavarapu , Sen Lin , Zhizhong Tang
IPC: G02B6/42 , G01S17/931
Abstract: Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.
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公开(公告)号:US11860308B1
公开(公告)日:2024-01-02
申请号:US18056171
申请日:2022-11-16
Applicant: Aurora Operations, Inc.
Inventor: Colin Delaney , James Ferrara , Stefan Heinemann , Amir Hosseini , Pruthvi Jujjavarapu , Yongxuan Liang , Parth Panchal , Zhizhong Tang
IPC: G01S7/481 , G01S17/931 , H05K7/20
CPC classification number: G01S7/4814 , G01S7/4816 , G01S7/4817 , G01S17/931 , H05K7/20509
Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.
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公开(公告)号:US20240230913A1
公开(公告)日:2024-07-11
申请号:US18584631
申请日:2024-02-22
Applicant: Aurora Operations, Inc.
Inventor: Stefan Heinemann , Zeb Barber , Randy Reibel
IPC: G01S17/931 , G01S7/481 , G01S7/499 , G02B6/12
CPC classification number: G01S17/931 , G01S7/4812 , G01S7/4817 , G01S7/499 , G02B6/12004
Abstract: A light detection and ranging (lidar) system for a vehicle may include a receiver layer, a transmitter layer coupled to the receiver layer through an adhesive layer in a first direction, and one or more optics. The transmitter layer may receive, at a first side of the transmitter layer, a transmit signal from a laser source, and transmit the transmit signal through the one or more optics. The receiver layer may receive, through the one or more optics, a return signal reflected by an object in an environment of the vehicle, and output the return signal at a first side of the receiver layer. The first side of the transmitter layer and the first side of the receiver layer may be apart from and parallel to each other in a second direction crossing the first direction.
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公开(公告)号:US20240159874A1
公开(公告)日:2024-05-16
申请号:US18517431
申请日:2023-11-22
Applicant: Aurora Operations, Inc.
Inventor: Colin Delaney , James Ferrara , Stefan Heinemann , Amir Hosseini , Pruthvi Jujjavarapu , Yongxuan Liang , Parth Panchal , Zhizhong Tang
IPC: G01S7/481 , G01S17/931 , H05K7/20
CPC classification number: G01S7/4814 , G01S7/4816 , G01S7/4817 , G01S17/931 , H05K7/20509
Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.
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公开(公告)号:US20240085562A1
公开(公告)日:2024-03-14
申请号:US17944849
申请日:2022-09-14
Applicant: Aurora Operations, Inc.
Inventor: Zeb Barber , Stefan Heinemann , Randy Reibel
IPC: G01S17/931 , G01S7/481 , G01S7/499 , G02B6/12
CPC classification number: G01S17/931 , G01S7/4812 , G01S7/4817 , G01S7/499 , G02B6/12004
Abstract: A light detection and ranging (lidar) system for a vehicle may include a receiver layer, a transmitter layer coupled to the receiver layer through an adhesive layer in a first direction, and one or more optics. The transmitter layer may receive, at a first side of the transmitter layer, a transmit signal from a laser source, and transmit the transmit signal through the one or more optics. The receiver layer may receive, through the one or more optics, a return signal reflected by an object in an environment of the vehicle, and output the return signal at a first side of the receiver layer. The first side of the transmitter layer and the first side of the receiver layer may be apart from and parallel to each other in a second direction crossing the first direction.
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