公开(公告)号：US20100176502A1

公开(公告)日：2010-07-15

申请号：US12318876

申请日：2009-01-12

Applicant: Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

Inventor： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

IPC: H01L23/498 ,  H01L21/82

CPC classification number: H01L29/0657 ,  H01L21/6836 ,  H01L23/31 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/0107 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.

Abstract translation: 晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。 第二半导体层与第一半导体层的一个表面连接。 绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。 第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。 第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

公开(公告)号：US07701124B2

公开(公告)日：2010-04-20

申请号：US11711840

申请日：2007-02-28

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Shan Yu

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Shan Yu

IPC: H01J61/02 ,  H01J29/06

CPC classification number: C09K11/7731 ,  C09K11/7734 ,  H01J1/62 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

Abstract: A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.

Abstract translation: 白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。 盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。 荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。

公开(公告)号：US07671374B2

公开(公告)日：2010-03-02

申请号：US11861757

申请日：2007-09-26

Applicant: Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC: H01L29/205 ,  H01L23/495

CPC classification number: H01L25/0753 ,  H01L24/97 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/85 ,  H01L2924/00014

Abstract: An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

Abstract translation: 具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。 绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。 每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。 此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

公开(公告)号：US07655997B2

公开(公告)日：2010-02-02

申请号：US11041952

申请日：2005-01-26

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC: H01L27/14

CPC classification number: H01L23/60 ,  H01L23/544 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer, this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract translation: 一种用于改进传统电光半导体晶粒封装方法的晶片级电光半导体制造机构及其方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接，这可以通过丝网印刷或钢板印刷焊料或银浆在晶片上进行。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶圆级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20090213378A1

公开(公告)日：2009-08-27

申请号：US12285178

申请日：2008-09-30

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: G01B11/00

CPC classification number: G01B11/14

Abstract: A method for calculating out an optimum arrangement pitch between each two LED chip package units, including: providing a backlight module with a predetermined brightness value and a predetermined material information that a customer needs; determining what brightness level and amount of LED chip package units need to be used by a designer according to the brightness value and the material information of the backlight module; and dividedly arranging the LED chip package units determined by the designer on a light-entering area of the backlight module in order to define what the optimum arrangement pitch between each two LED chip package units is.

Abstract translation: 一种用于计算每个两个LED芯片封装单元之间的最佳布置间距的方法，包括：提供具有预定亮度值的背光模块和客户需要的预定材料信息; 根据背光模块的亮度值和材料信息确定设计者需要使用什么亮度级别和数量的LED芯片封装单元; 并且将由设计者确定的LED芯片封装单元分开地布置在背光模块的光进入区域上，以便限定每个两个LED芯片封装单元之间的最佳布置间距。

公开(公告)号：US20090190124A1

公开(公告)日：2009-07-30

申请号：US12285191

申请日：2008-09-30

Applicant: Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang

Inventor： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang

IPC: G01J1/10 ,  G02B27/40

CPC classification number: G01J1/10 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0422 ,  G01J1/08 ,  G01J2001/083 ,  G01M11/0264 ,  G02B19/0028 ,  G02B19/0066 ,  G02B27/0977 ,  G02B27/0994

Abstract: A uniform light generating system for testing an image-sensing device includes a light-generating unit, a light-transmitting unit, a light-diffusing unit, and a lens unit. The light-generating unit has a substrate and a plurality of light-emitting elements electrically disposed on the substrate. The light-transmitting unit has one side communicated with the light-generating unit for receiving and uniformizing light beams projected from the light-emitting elements. The light-diffusing unit has one side disposed on the other side of the light-transmitting unit for receiving and diffusing the light beams that have passed through the light-transmitting unit. The lens unit is disposed on the other side of the light-diffusing unit for transmitting the light beams that have passed through the light-diffusing unit to the image-sensing device.

Abstract translation: 用于测试图像感测装置的均匀光产生系统包括发光单元，光发射单元，光漫射单元和透镜单元。 光产生单元具有基板和电气设置在基板上的多个发光元件。 光发射单元具有与发光单元连通的用于接收并均匀化从发光元件投射的光束的一侧。 光漫射单元的一侧设置在透光单元的另一侧，用于接收并扩散已经通过光发射单元的光束。 透镜单元设置在光漫射单元的另一侧，用于将已经通过光漫射单元的光束传输到图像感测装置。

公开(公告)号：US20080246397A1

公开(公告)日：2008-10-09

申请号：US11696220

申请日：2007-04-04

Applicant: Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

Inventor： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

IPC: H01J99/00 ,  H01J9/26

CPC classification number: H01L33/505 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed. When blue light chip is excited to generate blue light, which will further excite the fluorescent layer to emit yellow light, then both blue light and yellow light will be dispersed through the photic zone to generate a uniform light source, which may output light longitudinally and collectively, making the output power promoted notably and the lightness enhanced significantly.

Abstract translation: 白光LED的制造方法及其结构首先在准备形成为连续保持器的基板上，在其上涂布非导电荧光胶的第一电极上形成荧光层，蓝色 光芯片固定; 第二，将两根导线焊接在芯片上，分别与保持器的第一电极和第二电极两者电连接，最后将胶体封装在保持器，荧光层，芯片和两根导线上，形成 一个框架主体围绕着它; 此外，窗框形成在框架体上并被设置用于使光区暴露。 当蓝光芯片被激发以产生蓝光，这将进一步激发荧光层发出黄光，则蓝光和黄光将通过光区分散以产生均匀的光源，其可以纵向输出光， 共同推动输出功率显着提升，亮度明显增强。

公开(公告)号：US20080099778A1

公开(公告)日：2008-05-01

申请号：US11588399

申请日：2006-10-27

Applicant: Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

IPC: H01L33/00 ,  G09F9/33

CPC classification number: H01L33/56 ,  H01L25/167 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.

Abstract translation: 用于提高发光效率的LED封装结构包括：基板单元和多个荧光胶体单元，LED单元，导电单元和不透明单元。 基板单元具有主体和穿过主体的多个通孔。 每个荧光胶体单元被接收在相应的通孔中并具有安装表面。 每个LED单元具有设置在相应的荧光胶体单元上并面对相应的荧光胶体单元的安装表面的发光表面。 每个导电单元电连接在具有相同极点并且分别布置在每个LED单元和主体上的每个两个电极区域之间。 每个不透明单元设置在主体的两个对应的侧面上，用于覆盖相应的荧光胶体单元的安装表面，相应的LED单元和相应的导电单元。

公开(公告)号：US20080000120A1

公开(公告)日：2008-01-03

申请号：US11476165

申请日：2006-06-28

Applicant: Bily Wang ,  Hui-Chung Lin

Inventor： Bily Wang ,  Hui-Chung Lin

IPC: G09F13/00

CPC classification number: G09F13/22

Abstract: The present invention is related to a color-mixture display unit and an image display apparatus using the same, wherein the image display apparatus includes at least one color-mixture pixel which is pre-disposed at plates of a light box so that a pattern is formed. Each of the color-mixture pixels is equipped with a red filter, a green filter and a blue filter, or equipped with a black filter or equipped with a transparent filter. At least one color-mixture LED is disposed within the light box and provides a backlight for the color-mixture pixel. In this regard, the color-mixture LEDs are controlled by an image controller and provide various color light beams with the color-mixture pixels. In addition, arrangement of each color filter within the color-mixture pixel is utilized so that color-mixture effect of dynamic image is shown.

Abstract translation: 本发明涉及一种彩色混合显示单元和使用该彩色混合显示单元的图像显示装置，其中该图像显示装置包括至少一个颜色混合像素，其预先设置在灯箱的板上，使得图案是 形成。 每个混色像素配备有红色滤光器，绿色滤光片和蓝色滤光片，或配备有黑色滤光片或配有透明滤光片。 至少一个颜色混合LED设置在灯箱内，并提供用于混色像素的背光。 在这方面，混色LED由图像控制器控制并且提供具有颜色混合像素的各种彩色光束。 此外，利用颜色混合像素内的每个滤色器的布置，以显示动态图像的混色效果。

公开(公告)号：US07303984B2

公开(公告)日：2007-12-04

申请号：US11081527

申请日：2005-03-17

Applicant: Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC: H01L21/4763

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/0052 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

Abstract: A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.

Abstract translation: 半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。 此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。 因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。