公开(公告)号：US20150173177A1

公开(公告)日：2015-06-18

申请号：US14629181

申请日：2015-02-23

Applicant: Cisco Technology, Inc.

Inventor： Mohan R. Nagar ,  Kuo-Chuan Liu ,  Mudasir Ahmad ,  Bangalore J. Shanker ,  Jie Xue

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract translation: 一种印刷电路板组件和组装方法，其中将底部填充物放置在芯片和基板之间以支撑芯片。 沟槽形成在印刷电路板的上层中以限制底部填充物的流动，特别是限制底部填充物与相邻部件接触，使得底部填充物不会干扰印刷电路板组件上的相邻部件。