公开(公告)号：US10828702B2

公开(公告)日：2020-11-10

申请号：US15768065

申请日：2016-10-26

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Atsushi Ebara ,  Kenichi Inoue ,  Yoshiyuki Michiaki ,  Takahiro Yamada ,  Masahiro Yoshida

IPC: H01B1/02 ,  B22F9/08 ,  C22C5/06 ,  H01B1/22 ,  B22F1/00 ,  C09D7/40 ,  C09D5/24 ,  C08K3/08

Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).

公开(公告)号：US10062473B2

公开(公告)日：2018-08-28

申请号：US14372789

申请日：2013-01-15

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Kenichi Inoue ,  Kozo Ogi ,  Atsushi Ebara ,  Yuto Hiyama ,  Takahiro Yamada ,  Toshihiko Ueyama

IPC: H01B1/22 ,  B22F1/02 ,  C22C9/00 ,  C22C9/04 ,  C22C9/06 ,  H01B1/02 ,  B22F1/00 ,  C22C1/04 ,  C22C5/06 ,  B22F9/08

CPC classification number: H01B1/22 ,  B22F1/0011 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/082 ,  C22C1/0425 ,  C22C5/06 ,  C22C9/04 ,  C22C9/06 ,  H01B1/026 ,  Y10T428/2991

Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 μm), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.

公开(公告)号：US20210078081A1

公开(公告)日：2021-03-18

申请号：US17086552

申请日：2020-11-02

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Atsushi Ebara ,  Kenichi Inoue ,  Yoshiyuki Michiaki ,  Takahiro Yamada ,  Masahiro Yoshida

IPC: B22F9/08 ,  C22C5/06 ,  H01B1/22 ,  H01B1/02 ,  B22F1/00 ,  C09D7/40 ,  C09D5/24

Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).

公开(公告)号：US20180326497A1

公开(公告)日：2018-11-15

申请号：US15768065

申请日：2016-10-26

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Atsushi Ebara ,  Kenichi Inoue ,  Yoshiyuki Michiaki ,  Takahiro Yamada ,  Masahiro Yoshida

IPC: B22F9/08 ,  B22F1/00 ,  C09D5/24 ,  C09D7/40 ,  H01B1/22

CPC classification number: B22F9/082 ,  B22F1/0003 ,  B22F1/0011 ,  B22F2009/0828 ,  B22F2301/255 ,  B22F2304/10 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006 ,  C09D5/24 ,  C09D7/69 ,  C22C5/06 ,  H01B1/02 ,  H01B1/22

Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).