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    Polyimide short fibers and heat-resistant paper comprising same
    12.
    发明授权
    Polyimide short fibers and heat-resistant paper comprising same 失效
    聚酰亚胺短纤维和包含该聚酰亚胺短纤维的耐热纸

    公开(公告)号：US08709205B2

    公开(公告)日：2014-04-29

    申请号：US13514016

    申请日：2010-12-16

    Applicant: Hideki Ozawa ,  Fumio Aoki

    Inventor： Hideki Ozawa ,  Fumio Aoki

    IPC: D21H13/00 ,  C08G73/10 ,  C08J9/00

    CPC classification number: D21H13/26 ,  D01D5/00 ,  D01F6/74 ,  D21H15/04 ,  D21H17/56

    Abstract: Disclosed are polyimide short fibers having an extremely high heat resistance, suitable for non-woven fabrics and paper, and having many branches. Specifically, disclosed are polyimide short fibers having many branches, which are produced by beating and loosening a specific foamed polyimide material. The foamed material preferably comprises a polyimide produced using 2,3,3′,4′-biphenyltetracarboxylic acid as an aromatic tetracarboxylic acid component, preferably has a glass transition temperature of 300° C. or higher, and preferably has an expansion ratio of 20 times or more.

    Abstract translation: 公开了具有极高耐热性的聚酰亚胺短纤维，适用于无纺布和纸张，并具有许多分支。 具体地，公开了具有许多分支的聚酰亚胺短纤维，其通过打浆和松动特定的泡沫聚酰亚胺材料而制备。 发泡体优选包含使用2,3,3'，4'-联苯四羧酸作为芳香族四羧酸成分制造的聚酰亚胺，优选玻璃化转变温度为300℃以上，优选为20倍 次以上。

    Module structure
    13.
    发明授权
    Module structure 有权
    模块结构

    公开(公告)号：US08179681B2

    公开(公告)日：2012-05-15

    申请号：US12607306

    申请日：2009-10-28

    Applicant: Fumio Aoki

    Inventor： Fumio Aoki

    IPC: H05K1/14

    CPC classification number: H01R12/7005 ,  H01R12/57 ,  H01R13/6315 ,  H05K1/141 ,  H05K3/301 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T29/49963

    Abstract: An apparatus includes a case including a surface, a bottom face and a first hole arranged on the bottom face; a first connector on the bottom face of the case; and a guide pin arranged in the first hole and being capable of moving in the first hole.

    Abstract translation: 一种装置包括：壳体，包括设置在底面上的表面，底面和第一孔; 在壳体的底面上的第一连接器; 以及布置在所述第一孔中并且能够在所述第一孔中移动的引导销。

    Housing removal tool
    15.
    发明授权
    Housing removal tool 失效
    拆除工具

    公开(公告)号：US07017259B2

    公开(公告)日：2006-03-28

    申请号：US10739779

    申请日：2003-12-18

    Applicant: Fumio Aoki

    Inventor： Fumio Aoki

    IPC: H01R43/00

    CPC classification number: H01R12/585 ,  H01R43/205 ,  Y10T29/49153 ,  Y10T29/49222 ,  Y10T29/53174 ,  Y10T29/53209 ,  Y10T29/53257

    Abstract: A housing-remover tool for a press-fit connector. The tool including shoulder part pressers for pressing the shoulder parts of pin-shaped terminals, each shoulder part presser having a hollow part for receiving a pin part of the pin-shaped terminal and a cut-away part at a leading end for engaging with the shoulder part; a first sub-assembly for insertion inside a housing of the connector and provided with through-holes for receiving the shoulder part pressers; and a second sub-assembly having a pair of engagement members having engaging protrusions which can engage with stepped parts of the housing and a lifting portion for lifting the engagement members along the side surfaces of the first sub-assembly.

    Abstract translation: 用于压配合连接器的外壳拆卸工具。 该工具包括用于按压销状端子的肩部的肩部压件，每个肩部压件具有用于接收销状端子的销部分的中空部分和在前端处的切口部分， 肩部; 第一子组件，用于插入连接器的壳体内并设置有用于接收肩部压件的通孔; 以及第二子组件，其具有一对接合构件，所述一对接合构件具有可与所述壳体的台阶部分接合的接合突起，以及用于沿着所述第一子组件的侧表面提升所述接合构件的提升部分。

    Process for production of polyimide powder, polyimide powder, polyimide powder molded bodies and process for their production
    18.
    发明授权
    Process for production of polyimide powder, polyimide powder, polyimide powder molded bodies and process for their production 有权
    聚酰亚胺粉末，聚酰亚胺粉末，聚酰亚胺粉末成型体的制造方法及其制造方法

    公开(公告)号：US06538097B2

    公开(公告)日：2003-03-25

    申请号：US09984238

    申请日：2001-10-29

    Applicant: Hiroaki Yamaguchi ,  Fumio Aoki

    Inventor： Hiroaki Yamaguchi ,  Fumio Aoki

    IPC: C08G7310

    CPC classification number: C08G73/1028 ,  C08G73/1032 ,  Y10T428/21 ,  Y10T428/24 ,  Y10T428/2982 ,  Y10T428/31504 ,  Y10T428/31721

    Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxylic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.

    Abstract translation: 一种制备聚酰亚胺粉末的方法，其包括在任选含有水溶性酮的酰胺系溶剂中，在咪唑存在下，以相对于羧酸含量为1〜100当量的比例使联苯四羧酸二酐与芳香族二胺反应 的聚酰亚胺前体，从含有3-30重量％酰胺类溶剂的水溶性酮溶剂中分离收集生成的聚酰亚胺前体粉末，将聚酰亚胺前体粉末加热至90％以上的酰亚胺化率，作为 以及由此获得的聚酰亚胺粉末，聚酰亚胺粉末的成型体和成型体的制造方法。

    Polyimide powder and process for producing powder molded body
    19.
    发明授权
    Polyimide powder and process for producing powder molded body 失效
    聚酰亚胺粉末及其制造方法

    公开(公告)号：US5898048A

    公开(公告)日：1999-04-27

    申请号：US831971

    申请日：1997-04-02

    Applicant: Hiroaki Yamaguchi ,  Fumio Aoki ,  Akinori Shiotani

    Inventor： Hiroaki Yamaguchi ,  Fumio Aoki ,  Akinori Shiotani

    IPC: C08J5/00 ,  C09D179/08 ,  C08G69/26 ,  B32B27/28

    CPC classification number: C08J5/00 ,  C09D179/08 ,  C08J2379/08 ,  Y10T428/2998

    Abstract: Aromatic polyimide powder wherein a solid portion consisting of a highly heat resistant crystalline aromatic polyimide is covered with a coating layer of an amorphous polyimide, and a process for producing polyimide powder molded bodies by compression molding of the powder. The polyimide powder has satisfactory secondary molding workability, and molding thereof gives molded bodies which retain heat resistance and dimensional stability while having high mechanical strength and elongation.

    Abstract translation: 芳香族聚酰亚胺粉末，其中由耐高温结晶性芳香族聚酰亚胺构成的固体部分被无定形聚酰亚胺的涂层覆盖，以及通过压缩成型粉末制造聚酰亚胺粉末成型体的方法。 聚酰亚胺粉末具有令人满意的二次成型加工性，其成型赋予保持耐热性和尺寸稳定性的成型体，同时具有高的机械强度和伸长率。

    Aromatic polyimide film and its precursor composition
    20.
    发明授权
    Aromatic polyimide film and its precursor composition 失效
    芳族聚酰亚胺薄膜及其前体组成

    公开(公告)号：US5891986A

    公开(公告)日：1999-04-06

    申请号：US960385

    申请日：1997-10-29

    Applicant: Hiroaki Yamaguchi ,  Fumio Aoki

    Inventor： Hiroaki Yamaguchi ,  Fumio Aoki

    IPC: C08K13/02 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08

    CPC classification number: C08G73/1042 ,  C08G73/1007 ,  C08L79/08 ,  Y10T428/31721

    Abstract: An aromatic polyimide precursor composition advantageously employable for the production of an amorphous aromatic polyimide film having Tg of 300.degree. C. or higher is composed of an aromatic tetracarboxylic acid component and an aromatic diamine component which are dissolved in an organic solvent, in which at least 60 mol. % of the aromatic tetracarboxylic acid component is 2,3,3',4'-bi-phenyltetracarboxylic acid, its monoester or diester of a primary alcohol, or their mixture, and at least 55 mol. % of the aromatic diamine component is 4,4'-diaminodiphenyl ether.

    Abstract translation: 有利地用于生产Tg为300℃或更高的无定形芳族聚酰亚胺膜的芳族聚酰亚胺前体组合物由溶解在有机溶剂中的芳族四羧酸组分和芳族二胺组分组成，其中至少 60摩尔。 ％的芳香族四羧酸成分为2,3,3'，4'-二苯基四羧酸，其单醇或单酯的单酯或其混合物，至少55mol。 ％的芳族二胺组分是4,4'-二氨基二苯醚。

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