公开(公告)号：US20210078027A1

公开(公告)日：2021-03-18

申请号：US17107060

申请日：2020-11-30

Applicant: Infineon Technologies AG

Inventor： Christian Illemann ,  Karl Pilch ,  Herbert Priess

IPC: B05B12/08 ,  H01H35/18 ,  G01F25/00 ,  B05B12/00

Abstract: A liquid-dispensing system includes at least one nozzle configured to dispense a liquid. The liquid-dispensing system includes at least one sensor module, configured to provide a sensor signal comprising information related to whether liquid is dispensed by the at least one nozzle. At least a part of the at least one sensor is located in proximity of the nozzle.

公开(公告)号：US20180036755A1

公开(公告)日：2018-02-08

申请号：US15666928

申请日：2017-08-02

Applicant: Infineon Technologies AG

Inventor： Christian Illemann ,  Karl Pilch ,  Herbert Priess

IPC: B05B12/08 ,  B05B12/00

CPC classification number: B05B12/085 ,  B05B12/008 ,  B05B12/082 ,  G01F1/58 ,  G01F1/66 ,  G01F1/661 ,  G01F25/0092

Abstract: A liquid-dispensing system includes at least one nozzle configured to dispense a liquid. The liquid-dispensing system includes at least one sensor module, configured to provide a sensor signal comprising information related to whether liquid is dispensed by the at least one nozzle. At least a part of the at least one sensor is located in proximity of the nozzle.

公开(公告)号：US09248466B2

公开(公告)日：2016-02-02

申请号：US13891644

申请日：2013-05-10

Applicant: Infineon Technologies AG

Inventor： Karl Pilch ,  Hans Leitner ,  Michael Kalin

IPC: H01L21/00 ,  B05C11/02 ,  B05D1/00 ,  B05D3/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: B05B12/02 ,  B05B13/02 ,  B05C11/02 ,  B05D1/002 ,  B05D3/007 ,  H01L21/02282 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/6835 ,  H01L2221/68327 ,  Y10T156/10

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract translation: 各种实施例涉及将流体施加到基底。 例如，将流体局部加热以获得所需的厚度分布。

公开(公告)号：US20150348852A1

公开(公告)日：2015-12-03

申请号：US14820344

申请日：2015-08-06

Applicant: Infineon Technologies AG

Inventor： Karl Pilch

IPC: H01L21/66 ,  H01L21/306

CPC classification number: C03C15/00 ,  H01J2237/2001 ,  H01L21/02019 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/67248 ,  H01L22/12 ,  H01L22/26

Abstract: An etchant is supplied to a workpiece. Furthermore, the workpiece is irradiated with spatially modulated light to adjust a temperature profile of the workpiece while etchant is supplied.

Abstract translation: 向工件提供蚀刻剂。 此外，用空间调制光照射工件，以在蚀刻剂供应时调节工件的温度分布。