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公开(公告)号：US10793419B2
公开(公告)日：2020-10-06
申请号：US16270315
申请日：2019-02-07
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Niccolo De Milleri , Bernd Goller , Ulrich Krumbein , Gerhard Lohninger , Giordano Tosolini , Andreas Wiesbauer
Abstract: A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.
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公开(公告)号：US10737935B2
公开(公告)日：2020-08-11
申请号：US16050795
申请日：2018-07-31
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Marc Fueldner , Andreas Wiesbauer
IPC: B81B7/02 , B81B3/00 , H04R3/06 , H04R19/00 , H04R19/04 , G01L9/00 , G01L19/06 , G01L19/02 , G01L9/12
Abstract: In accordance with an embodiment, a MEMS sensor includes a MEMS arrangement having a movable electrode and a stator electrode arranged opposite the movable electrode. The MEMS sensor includes a first bias voltage source, which is connected to the stator electrode and which is configured to apply a first bias voltage to the stator electrode. The MEMS sensor further includes a common-mode read-out circuit connected to the stator electrode by a capacitive coupling and comprising a second bias voltage source, which is configured to apply a second bias voltage to a side of the capacitive coupling that faces away from the stator electrode.
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公开(公告)号：US20200216309A1
公开(公告)日：2020-07-09
申请号：US16821145
申请日：2020-03-17
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Stefan Barzen , Alfons Dehe , Gunar Lorenz
Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.
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公开(公告)号：US10567886B2
公开(公告)日：2020-02-18
申请号：US15839546
申请日：2017-12-12
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stefan Barzen , Marc Fueldner
Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.
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公开(公告)号：US09503823B2
公开(公告)日：2016-11-22
申请号：US14582223
申请日：2014-12-24
Applicant: Infineon Technologies AG
Inventor： Stefan Barzen , Andre Brockmeier , Marc Fueldner , Stephan Pindl , Wolfgang Friza
CPC classification number: H04R19/016
Abstract: A capacitive microphone may include a housing, a membrane, and a first backplate, wherein a first insulating layer may be disposed on a first side of the first backplate facing the membrane and a second insulating layer may be disposed on a second side of the first backplate opposite to the first side of the first backplate. A further insulating layer may be disposed on a side wall of at least one of a plurality of perforation holes in the first backplate. Each conductive surface of the first backplate may be covered with insulating material.
Abstract translation: 电容麦克风可以包括壳体，膜和第一背板，其中第一绝缘层可以设置在第一背板的面向膜的第一侧上，并且第二绝缘层可以设置在第一绝缘层的第二侧上 背板与第一背板的第一侧相对。 另外的绝缘层可以设置在第一背板中的多个穿孔中的至少一个的侧壁上。 第一背板的每个导电表面可以用绝缘材料覆盖。
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Patent Agency Ranking
公开(公告)号：US09179221B2
公开(公告)日：2015-11-03
申请号：US14255703
申请日：2014-04-17
Applicant: Infineon Technologies AG
Inventor： Stefan Barzen , Andreas Wiesbauer , Christian Jenkner , Marc Fueldner
CPC classification number: H04R1/08 , B81B3/0086 , B81B2201/0257 , B81B2203/0127 , G01R27/2605 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003 , H04R2410/03
Abstract: A micro-electro-mechanical system (MEMS) device includes a first plate, a second plate disposed over the first plate, and a first moveable plate disposed between the first plate and the second plate. The MEMS device further includes a second moveable plate disposed between the first moveable plate and the second plate.
Abstract translation: 微电子机械系统（MEMS）装置包括第一板，设置在第一板上的第二板和设置在第一板和第二板之间的第一可移动板。 MEMS器件还包括设置在第一可移动板和第二板之间的第二可移动板。
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公开(公告)号：US20150023529A1
公开(公告)日：2015-01-22
申请号：US14255703
申请日：2014-04-17
Applicant: Infineon Technologies AG
Inventor： Stefan Barzen , Andreas Wiesbauer , Christian Jenkner , Marc Fueldner
CPC classification number: H04R1/08 , B81B3/0086 , B81B2201/0257 , B81B2203/0127 , G01R27/2605 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003 , H04R2410/03
Abstract: In accordance with an embodiment of the present invention, a micro-electro-mechanical system (MEMS) device includes a first plate, a second plate disposed over the first plate, and a first moveable plate disposed between the first plate and the second plate. The MEMS device further includes a second moveable plate disposed between the first moveable plate and the second plate.
Abstract translation: 根据本发明的实施例，微机电系统（MEMS）装置包括第一板，设置在第一板上的第二板和设置在第一板和第二板之间的第一可移动板。 MEMS器件还包括设置在第一可移动板和第二板之间的第二可移动板。
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公开(公告)号：US20140091408A1
公开(公告)日：2014-04-03
申请号：US14100148
申请日：2013-12-09
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Alfons Dehe
CPC classification number: B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81C1/00158 , B81C1/0023 , H01L2224/48091 , H01L2224/48195 , H01L2224/48471 , H01L2224/73265 , H01L2924/10253 , H01L2924/3025 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier and the second recess forms a second cavity with the carrier. The first cavity is in fluid connection with the second cavity.
Abstract translation: 传感器模块和半导体芯片。 一个实施例提供一种载体。 半导体芯片包括半导体芯片的第一凹部和第二凹部以及主表面。 半导体芯片被安装到载体上，使得第一凹槽形成第一空腔，载体和第二凹槽与载体形成第二腔。 第一腔体与第二腔体流体连通。
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公开(公告)号：US20250024203A1
公开(公告)日：2025-01-16
申请号：US18897958
申请日：2024-09-26
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Andreas Wiesbauer , Athanasios Kollias
Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber.
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公开(公告)号：US11905167B2
公开(公告)日：2024-02-20
申请号：US17932409
申请日：2022-09-15
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geissler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
CPC classification number: B81C1/00158 , B81B3/0021 , B81B7/02 , B81C1/00103 , H04R1/08 , H04R7/02 , H04R7/08 , H04R31/003 , B81B2201/0257 , B81B2203/0127 , B81B2203/0384 , B81C2201/013 , H04R2201/003
Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.
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