公开(公告)号：US11908542B2

公开(公告)日：2024-02-20

申请号：US16725747

申请日：2019-12-23

Applicant: Intel Corporation

Inventor： Charles Augustine ,  Somnath Paul ,  Turbo Majumder ,  Iqbal Rajwani ,  Andrew Lines ,  Altug Koker ,  Lakshminarayanan Striramassarma ,  Muhammad Khellah

IPC: G11C7/10 ,  G11C7/12 ,  G11C7/22

CPC classification number: G11C7/1048 ,  G11C7/1006 ,  G11C7/12 ,  G11C7/22

Abstract: Prior knowledge of access pattern is leveraged to improve energy dissipation for general matrix operations. This improves memory access energy for a multitude of applications such as image processing, deep neural networks, and scientific computing workloads, for example. In some embodiments, prior knowledge of access pattern allows for burst read and/or write operations. As such, burst mode solution can provide energy savings in both READ (RD) and WRITE (WR) operations. For machine learning or inference, the weight values are known ahead in time (e.g., inference operation), and so the unused bytes in the cache line are exploited to store a sparsity map that is used for disabling read from either upper or lower half of the cache line, thus saving dynamic capacitance.

公开(公告)号：US20230123514A1

公开(公告)日：2023-04-20

申请号：US17504252

申请日：2021-10-18

Applicant: Intel Corporation

Inventor： Gururaj K. Shamanna ,  Naveen Kumar M. ,  Jagadeesh Chandra Salaka ,  Pascal A. Meinerzhagen ,  Sravan K. Puchakayala ,  Iqbal Rajwani

IPC: G11C11/419 ,  H03K3/037 ,  G11C11/412

Abstract: Embodiments herein relate to optimizing the duration of a sense amp enable signal in a memory device such as SRAM. A control circuit asserts the sense amp enable signal in response to a clock signal from a replica column of the SRAM. A feedback path extends from the sense amps back to the control circuit. In one approach, a change in a feedback signal on the feedback path indicates the sense amps have all received the sense amp enable signal. In another approach, a change in a feedback signal on the feedback path indicates the sense amps have all completed their sensing operations. In some cases, a selection can be made among multiple feedback paths.

公开(公告)号：US20220180468A1

公开(公告)日：2022-06-09

申请号：US17674781

申请日：2022-02-17

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US20210133913A1

公开(公告)日：2021-05-06

申请号：US17069188

申请日：2020-10-13

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US10747286B2

公开(公告)日：2020-08-18

申请号：US16004647

申请日：2018-06-11

Applicant: Intel Corporation

Inventor： Nikos Kaburlasos ,  Iqbal Rajwani ,  Bhushan Borole ,  Kamal Sinha ,  Sanjeev Jahagirdar

IPC: G06F1/00 ,  G06F11/30 ,  G06F1/28

Abstract: Dynamic power budget allocation in a multi-processor system is described. In an example, an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.

公开(公告)号：US20190377395A1

公开(公告)日：2019-12-12

申请号：US16004647

申请日：2018-06-11

Applicant: Intel Corporation

Inventor： Nikos Kaburlasos ,  Iqbal Rajwani ,  Bhushan Borole ,  Kamal Sinha ,  Sanjeev Jahagirdar

IPC: G06F1/28

Abstract: Embodiments are generally directed to dynamic power budget allocation in a multi-processor system. An embodiment of an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.

公开(公告)号：US10333379B2

公开(公告)日：2019-06-25

申请号：US15382076

申请日：2016-12-16

Applicant: Intel Corporation

Inventor： Suphachai Chai Sutanthavibul ,  Iqbal Rajwani ,  Anupama A Thaploo ,  Surya Sasi Kiran Tallapragada ,  Daivik H Bhatt ,  Lei Jiang ,  Stephen Kim ,  Pascal A. Meinerzhagen ,  Muhammad M. Khellah

IPC: H02M1/08 ,  H03K17/0812 ,  H03K17/687 ,  H02M3/158 ,  H02M1/088 ,  H03K19/00 ,  H02M1/00 ,  H03K17/08

Abstract: Some embodiments include apparatuses and methods using the apparatuses. One of the apparatuses includes a first power supply node, a second power supply node, transistors coupled in parallel between the first and second power supply nodes, and a controller to provide a first voltage, a second voltage, and a third voltage to gates of the transistors based on digital information. The first, second, and third voltages have different values based on values of the digital information.

公开(公告)号：US20240013338A1

公开(公告)日：2024-01-11

申请号：US18470652

申请日：2023-09-20

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

CPC classification number: G06T1/20 ,  G06F13/4027

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US11756150B2

公开(公告)日：2023-09-12

申请号：US17674781

申请日：2022-02-17

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

CPC classification number: G06T1/20 ,  G06F13/4027

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US20230030396A1

公开(公告)日：2023-02-02

申请号：US17966151

申请日：2022-10-14

Applicant: Intel Corporation

Inventor： Nikos Kaburlasos ,  Iqbal Rajwani ,  Bhushan Borole ,  Kamal Sinha ,  Sanjeev Jahagirdar

IPC: G06F1/28

Abstract: Dynamic power budget allocation in a multi-processor system is described. In an example, an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.