公开(公告)号：US20160376143A1

公开(公告)日：2016-12-29

申请号：US14935296

申请日：2015-11-06

Applicant: InvenSense, Inc.

Inventor： Jongwoo SHIN ,  Houri JOHARI-GALLE ,  Martin LIM ,  Joseph SEEGER

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0089 ,  B81B7/0038 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00206 ,  B81C2201/016 ,  B81C2203/035

Abstract: A MEMS device and method for providing a MEMS device are disclosed. In a first aspect, the MEMS device comprises a first substrate and a second substrate coupled to the first substrate forming a sealed enclosure. A moveable structure is located within the sealed enclosure. An outgassing layer is formed on the first or second substrates and within the sealed enclosure. A first conductive layer is disposed between the moveable structure and the outgassing layer, wherein the first conductive layer allows outgassing species to pass therethrough.

Abstract translation: 公开了一种用于提供MEMS器件的MEMS器件和方法。 在第一方面，MEMS装置包括第一基板和耦合到第一基板的第二基板，形成密封外壳。 可移动的结构位于密封的外壳内。 在第一或第二基板上和密封的外壳内形成除气层。 第一导电层设置在可移动结构和除气层之间，其中第一导电层允许除气物质通过其中。

公开(公告)号：US20160214853A1

公开(公告)日：2016-07-28

申请号：US14608038

申请日：2015-01-28

Applicant: InvenSense, Inc.

Inventor： Matthew Julian THOMPSON ,  Joseph SEEGER

IPC: B81B3/00 ,  G01P15/125

CPC classification number: B81B3/0016 ,  B81B3/0037 ,  B81B2201/025 ,  B81B2203/0109 ,  B81B2203/0145 ,  B81B2203/053 ,  G01P15/125 ,  G01P2015/0837 ,  G01P2015/0854 ,  G01P2015/086

Abstract: A system and method for providing a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a substrate, an anchor region coupled to the substrate, at least one support arm coupled to the anchor region, at least two guiding arms coupled to and moving relative to the at least one support arm, a plurality of sensing elements disposed on the at least two guiding arms to measure motion of the at least two guiding arms relative to the substrate, and a proof mass system comprising at least one mass coupled to each of the at least two guiding arms by a set of springs. The proof mass system is disposed outside the anchor region, the at least one support arm, the at least two guiding arms, the set of springs, and the plurality of sensing elements.

Abstract translation: 公开了一种用于提供MEMS传感器的系统和方法。 在第一方面，该系统是MEMS传感器，其包括衬底，耦合到衬底的锚定区域，耦合到锚定区域的至少一个支撑臂，耦合到并相对于至少一个 支撑臂，设置在所述至少两个引导臂上的多个感测元件，以测量所述至少两个引导臂相对于所述基底的运动;以及证明质量系统，其包括耦合到所述至少两个引导件 武器由一套弹簧。 检测质量系统设置在锚定区域外部，至少一个支撑臂，至少两个引导臂，该组弹簧和多个感测元件。

公开(公告)号：US20150226558A1

公开(公告)日：2015-08-13

申请号：US14698451

申请日：2015-04-28

Applicant: InvenSense, Inc.

Inventor： Joseph SEEGER ,  Bruno BOROVIC

IPC: G01C19/5712

CPC classification number: G01C19/5712 ,  G01C19/56 ,  G01C19/5719 ,  G01C19/574

Abstract: An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode.

Abstract translation: 包括驱动器扩展模式的角速度传感器。 一方面，角速度传感器包括基部和基本上设置在平行于基部的平面中的至少三个质量，质量块具有质心。 至少一个致动器以延伸模式驱动质量，使得在延伸模式中，质量在平面中同时移动或同时移向质心。 至少一个换能器感测由质量的运动和围绕传感器的至少一个输入轴的角速度产生的至少一个科里奥利力。 另外的实施例可以包括限制质量以伸展模式移动的连杆。

公开(公告)号：US20150211853A1

公开(公告)日：2015-07-30

申请号：US14678774

申请日：2015-04-03

Applicant: InvenSense, Inc.

Inventor： Ozan ANAC ,  Joseph SEEGER

IPC: G01C19/5705

CPC classification number: G01C19/5712

Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements.

Abstract translation: 在第一方面，角速度传感器包括基底和锚定到基底的旋转结构。 角速率传感器还包括锚定到基板的驱动块和连接驱动块和旋转结构的元件。 角速度传感器还包括致动器，用于将驱动质量块沿着平面中的第一轴线驱动到衬底并用于将旋转结构驱动为围绕垂直于衬底的第二轴线的旋转振荡; 响应于感测模式中的科里奥利力，感测旋转结构的运动的第一换能器; 以及用于在驱动模式期间感测传感器的运动的第二换能器。 在第二方面，角速率传感器包括基板和两个平行于基板的剪切质量，并通过柔性元件锚定到基板上。

公开(公告)号：US20140047921A1

公开(公告)日：2014-02-20

申请号：US13966026

申请日：2013-08-13

Applicant: InvenSense, Inc.

Inventor： Joseph SEEGER ,  Bruno BOROVIC

IPC: G01C19/56

CPC classification number: G01C19/5712 ,  G01C19/56 ,  G01C19/5719 ,  G01C19/574

Abstract: An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode.

Abstract translation: 包括驱动器扩展模式的角速度传感器。 一方面，角速度传感器包括基部和基本上设置在平行于基部的平面中的至少三个质量，质量块具有质心。 至少一个致动器以延伸模式驱动质量，使得在延伸模式中，质量在平面中同时移动或同时移向质心。 至少一个换能器感测由质量的运动和围绕传感器的至少一个输入轴的角速度产生的至少一个科里奥利力。 另外的实施例可以包括限制质量以伸展模式移动的连杆。

公开(公告)号：US20190035905A1

公开(公告)日：2019-01-31

申请号：US16044233

申请日：2018-07-24

Applicant: InvenSense, Inc.

Inventor： Bongsang KIM ,  Jongwoo SHIN ,  Joseph SEEGER ,  Logeeswaran Veerayah JAYARAMAN ,  Houri JOHARI-GALLE

IPC: H01L29/49 ,  G01P15/097 ,  H01L23/532

Abstract: A method includes depositing a silicon layer over a first oxide layer that overlays a first silicon substrate. The method further includes depositing a second oxide layer over the silicon layer to form a composite substrate. The composite substrate is bonded to a second silicon substrate to form a micro-electro-mechanical system (MEMS) substrate. Holes within the second silicon substrate are formed by reaching the second oxide layer of the composite substrate. The method further includes removing a portion of the second oxide layer through the holes to release MEMS features. The MEMS substrate may be bonded to a CMOS substrate.

公开(公告)号：US20170001861A1

公开(公告)日：2017-01-05

申请号：US15265668

申请日：2016-09-14

Applicant: InvenSense, Inc.

Inventor： Cerina ZHANG ,  Martin LIM ,  Jongwoo SHIN ,  Joseph SEEGER

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00301 ,  B81B7/007 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/0023 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00269 ,  B81C2201/0104 ,  B81C2201/0132 ,  B81C2203/0145 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/0792

Abstract: Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer. The processes further include patterning the second and first passivation layers to expose portions of the patterned top-level metal layer and bonding a second substrate and the first substrate to each other. The bonding occurs within a temperature range in which at least the exposed portion of the first passivation layer undergoes outgassing.

Abstract translation: 半导体制造工艺包括提供第一衬底，其具有设置在图案化顶层金属层上方的第一钝化层，并且还具有设置在第一钝化层上的第二钝化层; 第二钝化层具有顶表面。 所述方法还包括在第二钝化层的第一部分中形成开口，并且开口暴露第一钝化层的表面的一部分。 所述方法还包括图案化第二钝化层和第一钝化层以暴露图案化顶层金属层的部分并将第二基板和第一基板彼此接合。 接合发生在至少第一钝化层的暴露部分经历脱气的温度范围内。

公开(公告)号：US20150316379A1

公开(公告)日：2015-11-05

申请号：US14800612

申请日：2015-07-15

Applicant: InvenSense, Inc.

Inventor： Joseph SEEGER ,  Ozan ANAC

IPC: G01C19/5755

CPC classification number: G01C19/5755 ,  G01C19/5733

Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction

Abstract translation: 根据实施例的系统和方法降低了陀螺仪的横轴灵敏度。 这是通过使用机械换能器构建陀螺仪来实现的，所述机械换能器包括弹簧系统，该弹簧系统对制造缺陷敏感度较低，并且被优化以最小化除了预期输入旋转轴线以外的旋转的响​​应。 第一和第二柔性元件的纵向轴线彼此平行并平行于第一方向

公开(公告)号：US20140366631A1

公开(公告)日：2014-12-18

申请号：US14472143

申请日：2014-08-28

Applicant: InvenSense, Inc.

Inventor： Joseph SEEGER ,  Ozan ANAC

IPC: G01C19/5733

CPC classification number: G01C19/5733 ,  G01C19/5712 ,  G01C19/574 ,  G01C19/5755

Abstract: A gyroscope is disclosed. The gyroscope comprises a substrate; and a guided mass system. The guided mass system comprises proof-mass and guiding arm. The proof-mass and the guiding arm are disposed in a plane parallel to the substrate. The proof-mass is coupled to the guiding arm. The guiding arm is also coupled to the substrate through a spring. The guiding arm allows motion of the proof-mass to a first direction in the plane. The guiding arm and the proof-mass rotate about a first sense axis. The first sense axis is in the plane and parallel to the first direction. The gyroscope includes an actuator for vibrating the proof-mass in the first direction. The gyroscope also includes a transducer for sensing motion of the proof-mass-normal to the plane in response to angular velocity about a first input axis that is in the plane and orthogonal to the first direction.

Abstract translation: 公开了一种陀螺仪。 陀螺仪包括基板; 和引导质量体系。 引导质量系统包括检验质量和引导臂。 证明物质和引导臂设置在平行于基底的平面中。 证明物质联接到引导臂。 引导臂也通过弹簧与基板相连。 引导臂允许证明物质在平面中的第一方向的运动。 引导臂和证明质量围绕第一感测轴线旋转。 第一感测轴在平面内并且平行于第一方向。 陀螺仪包括用于在第一方向上振动证明物质的致动器。 陀螺仪还包括用于响应于围绕在平面中并与第一方向正交的第一输入轴的角速度来感测与平面相反的质量法向运动的换能器。

公开(公告)号：US20140349434A1

公开(公告)日：2014-11-27

申请号：US14456973

申请日：2014-08-11

Applicant: InvenSense, Inc.

Inventor： Kegang HUANG ,  Jongwoo SHIN ,  Martin LIM ,  Michael Julian DANEMAN ,  Joseph SEEGER

IPC: B81C1/00

CPC classification number: B81C1/00301 ,  B81B7/0064 ,  B81B2207/098 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031

Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.

Abstract translation: 公开了一种在集成MEMS器件中制造电连接的方法。 该方法包括形成MEMS晶片。 形成MEMS晶片包括在第一半导体层中形成一个空腔，将第一半导体层与设置在第一半导体层和第二半导体层之间的电介质层结合到第二半导体层，并且通过第二半导体蚀刻至少一个通孔 层和介电层，并在第二半导体层上沉积导电材料并填充至少一个通孔。 形成MEMS晶片还包括图案化和蚀刻导电材料以形成一个间隔并在导电材料上沉积锗层，图案化和蚀刻锗层，以及图案化和蚀刻第二半导体层以限定一个MEMS结构。 该方法还包括将MEMS晶片接合到基底基板。