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11.发明申请公开(公告)号：US20140264650A1
公开(公告)日：2014-09-18
申请号：US13795861
申请日：2013-03-12
Applicant: Invensense, Inc.
Inventor： Fang Liu , Kuang L. Yang
CPC classification number: B81C1/00523 , B81B3/0078 , B81B2201/0257 , B81C1/00158
Abstract: A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.
Abstract translation: 麦克风系统包括由弹簧悬挂的隔膜，并且包括密封层，该密封层密封通道，如果保持打开状态，则当隔膜响应于该隔膜时，通过允许空气从隔膜的一侧通过而将降低麦克风的频率响应 入射声信号。 在一些实施例中，密封层可以包括均衡孔，以允许压力在隔膜的两侧均衡。
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公开(公告)号：US10578572B2
公开(公告)日：2020-03-03
申请号：US15000729
申请日：2016-01-19
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Jim Salvia , Zhineng Zhu , Michael Perrott
Abstract: A gas sensor device with temperature uniformity is presented herein. In an implementation, a device includes a complementary metal-oxide semiconductor (CMOS) substrate layer, a dielectric layer and a gas sensing layer. The dielectric layer is deposited on the CMOS substrate layer. Furthermore, the dielectric layer includes a temperature sensor and a heating element coupled to a heat transfer layer associated with a set of metal interconnections. The gas sensing layer is deposited on the dielectric layer.
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公开(公告)号：US20160167956A1
公开(公告)日：2016-06-16
申请号：US15047579
申请日：2016-02-18
Applicant: Invensense, Inc.
Inventor： Fang Liu , Michael Julian Daneman , Brian Kim , Anthony Minervini
IPC: B81C1/00
CPC classification number: B81C1/00238 , B81B3/0018 , B81B2201/0257 , B81C1/00309 , B81C2203/0792 , H01L24/05 , H01L27/092 , H01L2924/01322 , H01L2924/12042 , H04R19/005 , H01L2924/00
Abstract: A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.
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14.发明申请INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF PRODUCING THE SAME 有权集成式CMOS反射孔声波传感器及其生产方法公开(公告)号：US20150102390A1
公开(公告)日：2015-04-16
申请号：US14054495
申请日：2013-10-15
Applicant: Invensense, Inc.
Inventor： Fang Liu , Michael Julian Daneman , Brian Kim , Anthony Minervini
IPC: B81B7/00 , H01L23/00 , H01L27/092
CPC classification number: B81C1/00238 , B81B3/0018 , B81B2201/0257 , B81C1/00309 , B81C2203/0792 , H01L24/05 , H01L27/092 , H01L2924/01322 , H01L2924/12042 , H04R19/005 , H01L2924/00
Abstract: A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.
Abstract translation: MEMS器件包括具有可移动元件的MEMS衬底。 还包括具有空腔的CMOS衬底，MEMS衬底设置在CMOS衬底的顶部上。 此外，后腔连接到CMOS衬底，后腔至少部分地由CMOS衬底中的空腔形成，并且可移动元件声耦合到后腔。
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公开(公告)号：US10598621B2
公开(公告)日：2020-03-24
申请号：US15484864
申请日：2017-04-11
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Peter Hartwell , Martin Lim , Yushi Yang
Abstract: The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
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Patent Agency Ranking
公开(公告)号：US10123131B2
公开(公告)日：2018-11-06
申请号：US14733560
申请日：2015-06-08
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Michael Daneman , Thomas Chen
Abstract: Microelectromechanical microphones include structures that permit differential capacitive sensing. In certain structures, a movable plate is disposed between a rigid plate and a substrate. A first capacitor is formed between the movable plate and the substrate and a second capacitor is formed between the movable plate and the rigid plate. Respective bias voltages can be applied to the rigid plate and the substrate, and a differential capacitive signal can be probed in response to displacement of the movable plate caused by a pressure wave. The movable plate and the rigid plate are mechanically coupled to first and second portions of the substrate, respectively. A dielectric member mechanically couples the movable plate and the rigid plate, thus providing mechanical stability.
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公开(公告)号：US20180292338A1
公开(公告)日：2018-10-11
申请号：US15484864
申请日：2017-04-11
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Peter Hartwell , Martin Lim , Yushi Yang
Abstract: The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
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公开(公告)号：US20170052161A1
公开(公告)日：2017-02-23
申请号：US15047344
申请日：2016-02-18
Applicant: INVENSENSE, INC.
Inventor： Fang Liu
IPC: G01N33/00
CPC classification number: G01N33/0027
Abstract: Gas sensing material for a gas sensor device is presented herein. In an implementation, a method includes generating a tin dioxide material by adding metal chloride and metal acetate to a mixture comprising tin dioxide and ammonium hydroxide, generating a precipitate substance by adding an organic solvent to the tin dioxide material, generating a slurry mixture from the precipitate substance by performing a centrifugation process and by adding water to the precipitate substance, generating a dry powder material by heating the slurry mixture via a heat treating process, generating an ink material by suspending the dry powder material in a surfactant substance, and printing the ink material onto a gas sensor.
Abstract translation: 本文介绍了用于气体传感器装置的气体传感材料。 在一个实施方案中，一种方法包括通过向包含二氧化锡和氢氧化铵的混合物中加入金属氯化物和金属乙酸盐来产生二氧化锡材料，通过向二氧化锡材料中加入有机溶剂产生沉淀物质，从 通过进行离心过程并通过向沉淀物质中加入水来产生沉淀物质，通过热处理加热浆料混合物产生干燥粉末材料，通过将干燥粉末材料悬浮在表面活性剂物质中产生油墨材料，并将 墨水材料到气体传感器上。
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公开(公告)号：US20160115016A1
公开(公告)日：2016-04-28
申请号：US14667169
申请日：2015-03-24
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Martin Lim , Jong Il Shin , Jongwoo Shin
IPC: B81C1/00
CPC classification number: B81B3/001 , B81B2201/0235 , B81B2201/0242 , B81C2201/115 , B81C2203/0792
Abstract: Various embodiments provide for a method for roughening a surface of a MEMs device or the surface of a CMOS surface. A first material can be deposited in a thin layer over a surface made of a second material. After heating, the first and second materials, they can partially melt and interdiffuse, forming an alloy. The first material can then be removed and the alloy is removed at the same time. The surface of the second material that is left behind has then been roughened due to the interdiffusion of the first and second materials.
Abstract translation: 各种实施例提供了用于使MEM器件的表面或CMOS表面的表面粗糙化的方法。 第一材料可以沉积在由第二材料制成的表面上的薄层中。 加热后，第一和第二种材料，它们可以部分熔化和相互扩散，形成合金。 然后可以除去第一种材料并同时去除合金。 然后由于第一和第二材料的相互扩散，留下的第二材料的表面被粗糙化。
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公开(公告)号：US20180336390A1
公开(公告)日：2018-11-22
申请号：US15601934
申请日：2017-05-22
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Peter Hartwell , Martin Lim
IPC: G06K9/00
CPC classification number: G06K9/0002 , G06K9/00107 , G06K9/00906 , G06K9/2018 , G06K9/6293
Abstract: Facilitating live fingerprint detection utilizing an integrated ultrasound and infrared (IR) sensor is presented herein. A fingerprint sensor can comprise a first substrate comprising the IR sensor, and a second substrate comprising an ultrasonic transducer. The second substrate is attached to a top portion of the first substrate, and a temperature output of the IR sensor facilitates a determination that a fingerprint output of the ultrasonic transducer corresponds to a finger. The IR sensor can comprise polysilicon comprising a thermopile and an array of photonic crystals thermally coupled to the thermopile.
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