公开(公告)号：US09828240B2

公开(公告)日：2017-11-28

申请号：US15047579

申请日：2016-02-18

Applicant: Invensense, Inc.

Inventor： Fang Liu ,  Michael Julian Daneman ,  Brian Kim ,  Anthony Minervini

IPC: B81B3/00 ,  B81C1/00 ,  H01L29/00 ,  H01L21/00 ,  H04R19/04 ,  H01L29/84 ,  H01L27/092 ,  H01L23/00 ,  H04R19/00

CPC classification number: B81C1/00238 ,  B81B3/0018 ,  B81B2201/0257 ,  B81C1/00309 ,  B81C2203/0792 ,  H01L24/05 ,  H01L27/092 ,  H01L2924/01322 ,  H01L2924/12042 ,  H04R19/005 ,  H01L2924/00

Abstract: A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

公开(公告)号：US09299671B2

公开(公告)日：2016-03-29

申请号：US14054495

申请日：2013-10-15

Applicant: Invensense, Inc.

Inventor： Fang Liu ,  Michael Julian Daneman ,  Brian Kim ,  Anthony Minervini

IPC: B81B3/00 ,  B81C1/00 ,  H01L29/00 ,  H01L21/00 ,  H04R19/04 ,  H01L29/84 ,  H01L23/00 ,  H01L27/092 ,  H04R19/00

CPC classification number: B81C1/00238 ,  B81B3/0018 ,  B81B2201/0257 ,  B81C1/00309 ,  B81C2203/0792 ,  H01L24/05 ,  H01L27/092 ,  H01L2924/01322 ,  H01L2924/12042 ,  H04R19/005 ,  H01L2924/00

Abstract: A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

Abstract translation: MEMS器件包括具有可移动元件的MEMS衬底。 还包括具有空腔的CMOS衬底，MEMS衬底设置在CMOS衬底的顶部上。 此外，后腔连接到CMOS衬底，后腔至少部分地由CMOS衬底中的空腔形成，并且可移动元件声耦合到后腔。

公开(公告)号：US10123112B2

公开(公告)日：2018-11-06

申请号：US14959478

申请日：2015-12-04

Applicant: INVENSENSE, INC.

Inventor： Carlo Murgia ,  James Lim ,  Fariborz Assaderaghi ,  Anthony Minervini

IPC: H04R3/00 ,  H04R1/04 ,  H04R19/00 ,  H04R19/04

Abstract: Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first back cavity within the device. The second MEMS sensor is contained in a second back cavity within the device. The digital signal processor generates a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, where the digital signal processor forms at least a portion of the first back cavity and the second back cavity.

公开(公告)号：US20170164107A1

公开(公告)日：2017-06-08

申请号：US14959478

申请日：2015-12-04

Applicant: INVENSENSE, INC.

Inventor： Carlo Murgia ,  James Lim ,  Fariborz Assaderaghi ,  Anthony Minervini

IPC: H04R3/00 ,  H04R31/00 ,  G10L21/0216

CPC classification number: H04R3/005 ,  H01L2224/48137 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2430/20

Abstract: Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first back cavity within the device. The second MEMS sensor is contained in a second back cavity within the device. The digital signal processor generates a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, where the digital signal processor forms at least a portion of the first back cavity and the second back cavity.

公开(公告)号：US20160167956A1

公开(公告)日：2016-06-16

申请号：US15047579

申请日：2016-02-18

Applicant: Invensense, Inc.

Inventor： Fang Liu ,  Michael Julian Daneman ,  Brian Kim ,  Anthony Minervini

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B3/0018 ,  B81B2201/0257 ,  B81C1/00309 ,  B81C2203/0792 ,  H01L24/05 ,  H01L27/092 ,  H01L2924/01322 ,  H01L2924/12042 ,  H04R19/005 ,  H01L2924/00

Abstract: A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

公开(公告)号：US20150102390A1

公开(公告)日：2015-04-16

申请号：US14054495

申请日：2013-10-15

Applicant: Invensense, Inc.

Inventor： Fang Liu ,  Michael Julian Daneman ,  Brian Kim ,  Anthony Minervini

IPC: B81B7/00 ,  H01L23/00 ,  H01L27/092

CPC classification number: B81C1/00238 ,  B81B3/0018 ,  B81B2201/0257 ,  B81C1/00309 ,  B81C2203/0792 ,  H01L24/05 ,  H01L27/092 ,  H01L2924/01322 ,  H01L2924/12042 ,  H04R19/005 ,  H01L2924/00

Abstract: A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.

Abstract translation: MEMS器件包括具有可移动元件的MEMS衬底。 还包括具有空腔的CMOS衬底，MEMS衬底设置在CMOS衬底的顶部上。 此外，后腔连接到CMOS衬底，后腔至少部分地由CMOS衬底中的空腔形成，并且可移动元件声耦合到后腔。