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公开(公告)号：US20220253111A1
公开(公告)日：2022-08-11
申请号：US17660706
申请日：2022-04-26
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA , Hideaki ABE , Kota UOGISHI , Kazuyuki YAMADA
Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
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公开(公告)号：US20220035411A1
公开(公告)日：2022-02-03
申请号：US17451050
申请日：2021-10-15
Applicant: Japan Display Inc.
Inventor： Hideaki ABE , Kazuyuki YAMADA , Keisuke ASADA , Kota UOGISHI
Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.
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公开(公告)号：US20220262665A1
公开(公告)日：2022-08-18
申请号：US17668398
申请日：2022-02-10
Applicant: Japan Display Inc.
Inventor： Hideaki ABE
IPC: H01L21/683 , H01L23/00
Abstract: An element transfer device includes an elastic sheet including a through hole and a pickup portion including a shaft portion, a first head portion at a first end of the shaft portion, and a second head portion at a second end of the shaft portion. The first head portion includes a pickup surface for adhering an element. The shaft portion is inserted into the through hole. The first head portion and the second head portion sandwich the elastic sheet. An outer diameter of the first head portion and an outer diameter of the second head portion are larger than an opening diameter of the through hole.
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公开(公告)号：US20220229324A1
公开(公告)日：2022-07-21
申请号：US17715496
申请日：2022-04-07
Applicant: Japan Display Inc.
Inventor： Hideaki ABE , Yasuhito ARUGA , Hiroyuki ONODERA , Hiroki KATO , Yasushi NAKANO , Hitoshi KAWAGUCHI , Keisuke ASADA
Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.
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公开(公告)号：US20220132667A1
公开(公告)日：2022-04-28
申请号：US17568009
申请日：2022-01-04
Applicant: Japan Display Inc.
Inventor： Youhei IWAI , Hideaki ABE
Abstract: An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.
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Patent Agency Ranking
公开(公告)号：US20180110125A1
公开(公告)日：2018-04-19
申请号：US15846450
申请日：2017-12-19
Applicant: Japan Display Inc.
Inventor： Hideaki ABE , Yasushi NAKANO , Hitoshi KAWAGUCHI , Ryouhei SUZUKI
IPC: H05K1/18 , H01R12/62 , H01R4/04 , H05K1/11 , G02F1/1345 , G02F1/1362
CPC classification number: H05K1/189 , G02F1/1345 , G02F1/136286 , H01R4/04 , H01R12/62 , H01R2107/00 , H05K1/118 , H05K3/323 , H05K3/3442 , H05K3/361 , H05K2201/09663 , H05K2201/09918 , H05K2201/10136
Abstract: Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for a pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions.
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公开(公告)号：US20240419224A1
公开(公告)日：2024-12-19
申请号：US18819025
申请日：2024-08-29
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA , Hideaki ABE , Kota UOGISHI , Kazuyuki YAMADA
Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
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公开(公告)号：US20240284595A1
公开(公告)日：2024-08-22
申请号：US18651739
申请日：2024-05-01
Applicant: Japan Display Inc.
Inventor： Youhei IWAI , Hideaki ABE
IPC: H05K1/14 , G02F1/1345 , H05K1/02 , H10K59/131
CPC classification number: H05K1/14 , H05K1/028 , G02F1/13452 , H05K2201/10128 , H10K59/131
Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
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公开(公告)号：US20230350470A1
公开(公告)日：2023-11-02
申请号：US18347030
申请日：2023-07-05
Applicant: Japan Display Inc.
Inventor： Keisuke ASADA , Hideaki ABE , Kota UOGISHI , Kazuyuki YAMADA
CPC classification number: G06F1/189 , G06F1/1605 , G06F1/1652 , G09F9/301
Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
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公开(公告)号：US20220131061A1
公开(公告)日：2022-04-28
申请号：US17570398
申请日：2022-01-07
Applicant: Japan Display Inc.
Inventor： Hideaki ABE
IPC: H01L33/62 , H01L33/38 , H01L25/075
Abstract: An LED module includes a first protrusion and a second protrusion adjacent to the first protrusion arranged on an insulating surface, a first electrode arranged on the first protrusion, and a second electrode arranged on the second protrusion, and an LED chip arranged on upper sides of the first protrusion and the second protrusion. The LED chip is connected to the first electrode and the second electrode via conductive members, and the first protrusion and the second protrusion are insulative and have a height of 1 μm to 50 μm.
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