公开(公告)号：US10720370B2

公开(公告)日：2020-07-21

申请号：US16172966

申请日：2018-10-29

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Jian-Ru Chen ,  Jo-Wei Yang ,  Chung-Hsien Hsin ,  Hsiu-Wen Tu

IPC: H01L23/31 ,  H01L27/146

Abstract: A sensor package structure includes a substrate, an electronic chip fixed on the substrate by flip-chip bonding, a sealant disposed on the substrate and embedding the electronic chip therein, a sensor chip with a size larger than that of the electronic chip, a light-permeable sheet, a plurality of metal wires electrically connected to the substrate and the sensor chip, and a package body. A bottom surface of the sensor chip is disposed on the sealant to be spaced apart from the electronic chip. A lateral surface of the sensor chip is horizontally spaced apart from that of the sealant by a distance less than or equal to 3 mm. The package body is disposed on the substrate and covers the metal wires as well as the lateral sides of the sealant and the sensor chip. The light-permeable sheet is fixed above the sensor chip through the package body.

公开(公告)号：US10340250B2

公开(公告)日：2019-07-02

申请号：US15911574

申请日：2018-03-05

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Jian-Ru Chen ,  Jo-Wei Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu

IPC: B81B7/00 ,  B81C3/00 ,  H04N5/225 ,  B81B7/02 ,  H01L23/00 ,  H01L27/146

Abstract: A stack type sensor package structure includes a substrate, a semiconductor chip disposed on the substrate, a frame disposed on the substrate and aside the semiconductor chip, a sensor chip disposed on the frame, a plurality of wires electrically connecting the sensor chip and the substrate, a transparent layer being of its position corresponding to the sensor chip, a support maintaining the relative position between the sensor chip and the transparent layer, and a package compound disposed on the substrate and partially covering the frame, the support, and the transparent layer. Thus, through disposing a frame within the stack type sensor package structure, the structural strength of the overall sensor package structure is reinforced, and the stability of the wiring of the sensor chip is effectively increased.

公开(公告)号：US20150011038A1

公开(公告)日：2015-01-08

申请号：US14053743

申请日：2013-10-15

Applicant: Kingpak Technology Inc.

Inventor： Chun-Lung HUANG ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

IPC: H01L31/0203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract translation: 公开了一种图像传感器的两级封装方法。 包装方法包括以下步骤：提供基板，将图像传感器芯片固定在基板上，将透明基板固定在图像传感器芯片上，电连接图像传感器芯片和基板，形成第一密封材料，形成 第二密封剂层。 两级包装方法防止在图像传感器封装过程中通过形成密封剂层而产生过大的压力。 如果产生这种过大的压力，则可能导致图像传感器芯片的位置偏移或接合线的损坏。 两级包装方法可以提高图像传感器封装过程的产量以及图像传感器的灵敏度，从而提高图像传感器封装的质量和生产，同时降低制造成本。

公开(公告)号：US08703519B1

公开(公告)日：2014-04-22

申请号：US13796622

申请日：2013-03-12

Applicant: Kingpak Technology Inc.

Inventor： Chun-Lung Huang ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

IPC: H01L21/00

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2224/16 ,  Y10T29/49117

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Abstract translation: 本发明公开了一种用于高分辨率相机模块的结构和制造方法，其中该方法包括以下步骤：提供包括多个图像传感器芯片的图像传感器晶片; 执行检查和定义每个图像传感器芯片是否是一个好的芯片; 将光学盖放置在作为好芯片的图像传感器芯片上，其中光学盖面向感测区域并且不覆盖导电触点; 切割图像传感器晶片以获得覆盖有光学盖的分立图像传感器芯片; 以及将分割图像传感器芯片的第一表面设置在陶瓷基板的底面上。 本发明可以在制造过程的早期阶段密封高分辨率相机模块，以提高相机模块的成品率，并且有效地缩小相机模块的尺寸。