公开(公告)号：US20180212297A1

公开(公告)日：2018-07-26

申请号：US15411748

申请日：2017-01-20

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Eric Sweetman ,  Bojana Zivanovic

IPC: H01P5/18

CPC classification number: H01P3/12 ,  H01P3/16 ,  H01P5/107 ,  H01Q13/02 ,  H01Q13/06 ,  H04B5/00 ,  H04B5/0031

Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.

公开(公告)号：US10720689B2

公开(公告)日：2020-07-21

申请号：US15818237

申请日：2017-11-20

Applicant: Keyssa Systems, Inc.

Inventor： James Gill Shook ,  Stephan Lang ,  Alan Besel ,  Dennis F. Rosenauer ,  Giriraj Mantrawadi ,  Eric Sweetman ,  Bojana Zivanovic ,  Srikanth Gondi

IPC: H01P5/107 ,  H01P5/02 ,  H03H7/38 ,  H01P3/20 ,  H04B5/00

Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.

公开(公告)号：US20200044493A1

公开(公告)日：2020-02-06

申请号：US16587864

申请日：2019-09-30

Applicant: Keyssa Systems, Inc.

Inventor： Roger D. Isaac ,  Alan Besel

IPC: H02J50/90 ,  H01R13/62 ,  H01R13/66 ,  B60L53/12 ,  B60L53/16 ,  B60L53/65 ,  B60L53/14 ,  B60L53/60 ,  B60L53/30 ,  H02J50/80 ,  H02J50/10 ,  H01F38/14 ,  H02J7/00 ,  H02J7/02 ,  H02J7/04 ,  H04B5/00

Abstract: Embodiments discussed herein refer to electric vehicle charging ports having integrated contactless communication units (CCUs). The electric vehicle charging ports include male and female connector assemblies that can be coupled together in a manner that enables consistent and reliable operation of contactless communications and power transfer. The connector integrates power and alignment such that when two connector assemblies are coupled together, power connections are made in combination with establishing contactless communications links between counterpart CCUs in both connector assemblies. The fixed alignment of the connector assemblies ensures that contactless communication channels, spanning between the connector assemblies, are aligned to enable consistent and reliable operation of contactless communications. The CCUs, which conduct contactless communications, may be integrated in the connector assemblies at fixed positions that enable CCUs of one connector assembly to be aligned with CCUs of another connector assembly when they are coupled together.

公开(公告)号：US20190157738A1

公开(公告)日：2019-05-23

申请号：US15818237

申请日：2017-11-20

Applicant: Keyssa Systems, Inc.

Inventor： James Gill Shook ,  Stephan Lang ,  Alan Besel ,  Dennis F. Rosenauer ,  Giriraj Mantrawadi ,  Eric Sweetman ,  Bojana Zivanovic ,  Srikanth Gondi

IPC: H01P5/02 ,  H01P3/20 ,  H03H7/38

Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.

公开(公告)号：US20180062454A1

公开(公告)日：2018-03-01

申请号：US15685356

申请日：2017-08-24

Applicant: Keyssa Systems, Inc.

Inventor： Alan Besel ,  Stephan Lang

IPC: H02J50/90 ,  H01F38/14 ,  H02J7/00 ,  H02J50/10 ,  H02J50/80

CPC classification number: H02J50/90 ,  B60L53/12 ,  B60L53/14 ,  B60L53/16 ,  B60L53/30 ,  B60L53/305 ,  B60L53/60 ,  B60L53/65 ,  B60L2270/38 ,  B60L2270/40 ,  H01F27/36 ,  H01F38/14 ,  H01F2038/143 ,  H01F2038/146 ,  H01R13/6205 ,  H01R13/6608 ,  H02J7/0004 ,  H02J7/0027 ,  H02J7/0042 ,  H02J7/025 ,  H02J7/04 ,  H02J50/10 ,  H02J50/80 ,  H04B5/0031 ,  Y02T10/7005 ,  Y02T10/7088 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/16 ,  Y02T90/163 ,  Y02T90/169 ,  Y04S30/14

Abstract: Embodiments discussed herein refer to connectors that enable two structures or devices to be coupled together in a manner that enables consistent and reliable operation of contactless communications and power transfer. The connector integrates power and alignment such that when two connectors are coupled together the power connections are also responsible for connector alignment. The connector alignment ensures that contactless communication channels, spanning between the connectors, are aligned to enable consistent and reliable operation of contactless communications.

公开(公告)号：US09887169B2

公开(公告)日：2018-02-06

申请号：US15068417

申请日：2016-03-11

Applicant: Keyssa Systems, Inc.

Inventor： Mostafa Naguib Abdulla ,  Mohamed Sameh Mahmoud ,  Alan Besel ,  Eric Sweetman ,  Bojana Zivanoic ,  Giriraj Mantrawadi

IPC: H01Q19/00 ,  H01B5/00 ,  H01L23/64 ,  H05K1/18 ,  H04B15/00

CPC classification number: H01L23/64 ,  H01L2224/48091 ,  H01L2924/181 ,  H04B15/00 ,  H05K1/0216 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.