公开(公告)号：US09318821B2

公开(公告)日：2016-04-19

申请号：US14401887

申请日：2014-01-15

Applicant: NSK LTD.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H05K1/00 ,  H01R12/52 ,  H01R13/405 ,  H01R43/24 ,  H01R12/58 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/24 ,  H01R107/00

CPC classification number: H01R12/523 ,  H01R12/58 ,  H01R13/405 ,  H01R43/24 ,  H01R2107/00 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/042 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10522

Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.

Abstract translation: 提供多极连接器。 可以防止在垂直于多极连接器的连接方向的方向上排列成一行的多个销状端子的特定销状端子的变形，并且还可以防止特定销状端子的位置偏移 和其他针形端子。 多极连接器（101）包括沿垂直于多极连接器的连接方向（箭头Y方向）的方向（箭头X方向）排成一列的多个销状端子110，该连接方向在连接方向上延伸， 保持构件（120），其构造成在垂直于连接方向的方向上延伸，并以预定的间距保持多个销状端子（110）。

公开(公告)号：US20150270199A1

公开(公告)日：2015-09-24

申请号：US14435690

申请日：2013-10-25

Applicant: NSK LTD.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H01L23/495

CPC classification number: H01L23/49551 ,  B62D5/0406 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40159 ,  H01L2224/40225 ,  H01L2224/4103 ,  H01L2224/41175 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84095 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15724 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

Abstract translation: 提供了一种半导体模块，用于缩短制造节拍时间，降低制造成本并确保结合部的可靠性。 半导体模块包括由金属形成的基板，形成在基板上的绝缘层，形成在绝缘层上的多个布线图案，通过焊料安装在一个布线图案上的裸芯片晶体管和连接电极的铜连接器 通过焊料形成在承载芯片晶体管和其它布线图案上。 铜连接器具有桥接形状，在与电极的接合面附近形成有宽度减小部，并且在与电极接合的接合面上形成有应力减小部。

公开(公告)号：USD916633S1

公开(公告)日：2021-04-20

申请号：US29667835

申请日：2018-10-25

Applicant: NSK LTD.

Designer： Noboru Kaneko ,  Yuri Shimizu

公开(公告)号：US09937582B2

公开(公告)日：2018-04-10

申请号：US15126642

申请日：2015-04-15

Applicant: NSK LTD.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi ,  Ryoichi Suzuki

IPC: B23K11/14 ,  B23K11/25 ,  B23K11/00 ,  B23K11/24 ,  B62D5/04 ,  B23K101/00

CPC classification number: B23K11/14 ,  B23K11/00 ,  B23K11/24 ,  B23K11/25 ,  B23K2101/006 ,  B62D5/0403

Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

公开(公告)号：US09312234B2

公开(公告)日：2016-04-12

申请号：US14127187

申请日：2013-05-27

Applicant: NSK Ltd.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H01L29/76 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L29/78 ,  H01L23/373 ,  H01L23/498

CPC classification number: H01L24/43 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/41175 ,  H01L2224/43848 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/494 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/75272 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/85815 ,  H01L2224/9221 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

Abstract: There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

Abstract translation: 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸芯片晶体管或其他表面安装器件在基板上的布线图案上。 半导体模块包括：形成在绝缘层上的多个布线图案; 通过焊料在多个布线图案中安装在一个布线图案上的裸芯片晶体管; 以及铜连接器，其由用于通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的另一布线图案连接的铜板构成。