公开(公告)号：US20090056987A1

公开(公告)日：2009-03-05

申请号：US12267705

申请日：2008-11-10

Applicant: Masato NOMIYA ,  Norio SAKAI ,  Mitsuyoshi NISHIDE

Inventor： Masato NOMIYA ,  Norio SAKAI ,  Mitsuyoshi NISHIDE

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/305 ,  H05K3/4626 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: In a method for manufacturing a multilayer ceramic electronic device, a resin introduction portion located outside a vertically projected region of a surface mount electronic device is disposed on a seat portion which includes a non-metallic inorganic powder as a primary component and on which the surface mount electronic device, e.g., a semiconductor element, is mounted, and a resin is supplied to the resin introduction portion so as to fill the resin into the seat portion and a gap between the seat portion and a multilayer ceramic element assembly. Unsintered ceramic base material layers and shrinkage restriction layers arranged to restrict shrinkage of the unsintered ceramic base material layers in a direction substantially perpendicular to a thickness direction of the unsintered ceramic base material layers are laminated and, thereby, an unfired multilayer ceramic element assembly is formed, which does not shrink in a direction substantially perpendicular to a lamination direction in a firing step.

Abstract translation: 在多层陶瓷电子器件的制造方法中，位于表面安装电子器件的垂直投影区域外的树脂引入部设置在包含非金属无机粉末作为主要成分的座部上， 安装电子装置，例如半导体元件，并且将树脂供应到树脂引入部分，以便将树脂填充到座部分中，以及座部和多层陶瓷元件组件之间的间隙。 未烧结的陶瓷基材层和收缩限制层被布置成限制未烧结的陶瓷基材层在基本上垂直于未烧结的陶瓷基材层的厚度方向的方向上的收缩，从而形成未烧结的多层陶瓷元件组件 ，其在烧制步骤中在基本上垂直于层压方向的方向上不收缩。

公开(公告)号：US20190306368A1

公开(公告)日：2019-10-03

申请号：US16292445

申请日：2019-03-05

Applicant: Tasuku NAGAI ,  Norio SAKAI

Inventor： Tasuku NAGAI ,  Norio SAKAI

IPC: H04N1/32 ,  H04N1/00

Abstract: An information output system includes a main memory, a first processing circuit, a second processing circuit, an output device, and notifying circuitry. The main memory is configured to store information. The first processing circuit is configured to read the information from the main memory. The second processing circuit is configured to transfer the information read. The output device is configured to output the information transferred. The notifying circuitry is configured to notify the second processing circuit of an activation timing of the first processing circuit. The second processing circuit is configured to start to transfer the information after being notified of the activation timing of the first processing circuit or request the first processing circuit to cancel reading of the information, according to a time by which the activation timing notified is delayed from an activation timing of the second processing circuit.

公开(公告)号：US20090320986A1

公开(公告)日：2009-12-31

申请号：US12559589

申请日：2009-09-15

Applicant: Kazuhiro ISEBO ,  Norio SAKAI ,  Kenji KAWAKAMI ,  Nobuaki OGAWA

Inventor： Kazuhiro ISEBO ,  Norio SAKAI ,  Kenji KAWAKAMI ,  Nobuaki OGAWA

IPC: B32B37/02 ,  G03G13/16 ,  G03G13/20

CPC classification number: H05K3/4061 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K1/0306 ,  H05K3/1266 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T156/10 ,  Y10T156/109

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract translation: 通孔形成方法和多层板制造方法通过减少所需的工艺来提高制造成品率。 通孔形成方法包括：第一步骤，通过将包含导电材料并具有突出部分的调色剂颗粒附着到第一感光构件的表面上以使得突出部分被引导到外部来形成调色剂图像; 以及将第一感光构件的表面相对于包含绝缘材料的生片的一个主表面并将调色剂图像转印到生片的一个主表面的第二步骤，使得调色剂颗粒的突出部分突出到 生片从而到达生片的另一个主表面和调色剂颗粒被埋在生片中。 通孔使用电子照相印刷法形成。

公开(公告)号：US20090305635A1

公开(公告)日：2009-12-10

申请号：US12536669

申请日：2009-08-06

Applicant: Makoto OSAMURA ,  Norio SAKAI ,  Noboru KATO

Inventor： Makoto OSAMURA ,  Norio SAKAI ,  Noboru KATO

IPC: H04B7/00

CPC classification number: H01Q1/2208 ,  B65D2203/10 ,  H01Q1/2216 ,  H01Q1/2225

Abstract: A packaging material with an electromagnetic coupling module for a RFID system, is constructed such that a radio IC chip is protected from external shock and environmental change without adversely affecting the planarity of the packaging material, the assembly of a radiator and an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module and a radiator that are electromagnetically coupled to each other are arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The radiator electromagnetically couples with the electromagnetic coupling module to transmit/receive high frequency signals.

Abstract translation: 具有用于RFID系统的电磁耦合模块的包装材料被构造成使得无线电IC芯片被保护免受外部冲击和环境变化，而不会不利地影响包装材料的平面性，散热器和电磁耦合模块的组装是 促进，辐射特性令人满意。 包装材料包括衬垫和波形芯材料，其中电磁耦合模块和彼此电磁耦合的散热器布置在包装材料的内部。 电磁耦合模块包括无线电IC芯片和馈电电路板，其上安装有无线电IC芯片，馈电电路板包括包括电感元件的谐振电路。 散热器与电磁耦合模块电磁耦合以发送/接收高频信号。

公开(公告)号：US20090201117A1

公开(公告)日：2009-08-13

申请号：US12426369

申请日：2009-04-20

Applicant: Noboru KATO ,  Norio SAKAI

Inventor： Noboru KATO ,  Norio SAKAI

IPC: H01F5/00

CPC classification number: B65D25/20 ,  B65D2203/10 ,  G06K7/10178 ,  H01L2224/16 ,  H01Q1/2283 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q11/08

Abstract: A container includes an electromagnetic coupling module on an inner surface of a container main body and a radiator made of a metal material on an outer surface of the container main body. The electromagnetic coupling module includes a feeder circuit board, on which a radio IC chip is mounted and in which a feeder circuit including a resonant circuit that has a predetermined resonant frequency and includes an inductance element is provided. The electromagnetic coupling module and the radiator preferably transmit and receive high-frequency signals through electromagnetic coupling. The container thus has an electromagnetic coupling module that includes a radio IC chip that is resistant to a shock applied from the outside and an environmental change, realizes an easy arrangement of a radiator and the electromagnetic coupling module, provides a preferable radiation characteristic, and is suitably used in an RFID system.

Abstract translation: 容器包括在容器主体的内表面上的电磁耦合模块和在容器主体的外表面上由金属材料制成的散热器。 电磁耦合模块包括馈电电路板，其上安装有无线电IC芯片，并且其中提供包括具有预定谐振频率并包括电感元件的谐振电路的馈电电路。 电磁耦合模块和散热器优选通过电磁耦合传输和接收高频信号。 因此，容器具有电磁耦合模块，其包括耐受来自外部施加的冲击和环境变化的无线IC芯片，实现散热器和电磁耦合模块的容易布置，提供优选的辐射特性，并且是 适用于RFID系统。

公开(公告)号：US20080289853A1

公开(公告)日：2008-11-27

申请号：US12186546

申请日：2008-08-06

Applicant: Norio SAKAI ,  Mitsuyoshi NISHIDE

Inventor： Norio SAKAI ,  Mitsuyoshi NISHIDE

IPC: H01R43/00 ,  H01B5/00

CPC classification number: H05K1/141 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/1572 ,  Y10T29/49121 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a composite body, a frame body to be connected to a first major surface of a substrate body includes a frame member made of an insulating material and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole at the approximate center thereof and extends along a peripheral portion of the first major surface of the substrate body so as to define a frame shape. Each of the plurality of connection members has a first strip and a second strip continuously connected to opposed ends of a middle strip. The connection members are disposed in the frame member so as to face each other with the through-hole therebetween. Each of the first strip and the second strip of the connection member is exposed on a corresponding one of the two major surfaces extending around the through-hole of the frame member. The first strip and the second strip extend in a direction in which the connection members face each other with the through-hole therebetween, and the opposed ends of the middle strip are continuously connected to an end of the first strip and an end of the second strip on the side adjacent to the through-hole. The middle strip extends through the inside of the frame member.

Abstract translation: 在复合体中，要连接到基体的第一主表面的框体包括由绝缘材料制成的框架构件和通过弯曲薄金属板形成的多个连接构件。 框架构件在其大致中心处包括通孔，并且沿着基板主体的第一主表面的周边部分延伸以限定框架形状。 多个连接构件中的每一个具有连续地连接到中间带的相对端部的第一条带和第二条带。 连接构件通过其间的通孔设置在框架构件中以彼此面对。 连接构件的第一条带和第二条带中的每一个暴露在围绕框架构件的通孔延伸的两个主表面中的对应的一个表面上。 第一条带和第二条带沿着连接部件彼此面对的方向延伸，并且中间条带的相对端部连续地连接到第一条带的端部，并且第二条带的端部 在与通孔相邻的一侧的条带。 中间条延伸穿过框架构件的内部。