公开(公告)号：US20170131167A1

公开(公告)日：2017-05-11

申请号：US15295051

申请日：2016-10-17

Applicant: Silicon Microstructures, Inc.

Inventor： Holger Doering ,  Stephen C. Terry ,  Justin Gaynor ,  Omar Abed ,  Fernando Alfaro

IPC: G01L9/00

CPC classification number: G01L9/0044 ,  G01L9/0042 ,  G01L9/0052 ,  G01L9/0057 ,  G01L19/0069

Abstract: Pressure sensors and associated structures that may facilitate the use of automated connection processes and tools. An example may provide structures for aligning interconnect wires to pressure sensor bondpads in order to facilitate the use of automated processes and tools.