公开(公告)号：US20230395766A1

公开(公告)日：2023-12-07

申请号：US18032212

申请日：2021-10-14

Applicant: TDK CORPORATION

Inventor： Tomohisa MITOSE ,  Kenichi KAWABATA ,  Susumu TANIGUCHI ,  Akiko SEKI

IPC: H01L33/62 ,  H01L23/00 ,  H05K1/18

CPC classification number: H01L33/62 ,  H01L24/16 ,  H01L24/13 ,  H05K1/181 ,  H01L24/73 ,  H01L24/32 ,  H01L2933/0066 ,  H01L2224/73204 ,  H01L2224/32237 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/81815 ,  H01L2224/81192 ,  H05K2201/10106 ,  H05K2201/09472 ,  H01L2924/12041 ,  H05K2201/09827

Abstract: A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 μm to 20 μm. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2—dimension d1) is 10 μm or smaller.

公开(公告)号：US20210027923A1

公开(公告)日：2021-01-28

申请号：US16925633

申请日：2020-07-10

Applicant: TDK CORPORATION

Inventor： Masataka KITAGAMI ,  Kenichi KAWABATA

IPC: H01F1/147 ,  H01F3/08 ,  H01F41/02 ,  B01J2/00

Abstract: Disclosed herein is a composite magnetic powder that includes an iron-containing magnetic powder and an insulating layer comprising a silicon oxide formed on a surface of the iron-containing magnetic powder. The insulating layer contains pores, and an area ratio of the pores in a cross section of the insulating layer is 5% or less.

公开(公告)号：US20190035744A1

公开(公告)日：2019-01-31

申请号：US16140993

申请日：2018-09-25

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA

IPC: H01L23/552 ,  B29C45/14 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56 ,  B29L31/00

Abstract: Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component, a metal film covering the magnetic mold resin, and a magnetic film covering the metal film. The magnetic mold resin includes a resin material, and a magnetic filler blended in the resin material, the magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni.

公开(公告)号：US20180374799A1

公开(公告)日：2018-12-27

申请号：US15805150

申请日：2017-11-07

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA

IPC: H01L23/552 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01F1/147 ,  C08K3/08

CPC classification number: H01L23/552 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2201/001 ,  C08K2201/01 ,  H01F1/14733 ,  H01F1/14758 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/186 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83

Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate, and a composite molding member having conductivity that covers the surface of the substrate so as to embed the electronic component and that is connected to the power supply pattern. The composite molding member includes a resin material and a first filler blended in the resin material and containing 32 to 39 wt. % of a metal material composed mainly of Ni in Fe.

公开(公告)号：US20180033738A1

公开(公告)日：2018-02-01

申请号：US15641568

申请日：2017-07-05

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Toshio Hayakawa ,  Toshiro Okubo

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/3205 ,  H01L25/16 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein, and a laminated film covering an upper surface of the mold resin, the laminated film including a magnetic film and a first metal film. The first metal film is connected to the power supply pattern. The magnetic film is selectively thick on the first region.

公开(公告)号：US20170311448A1

公开(公告)日：2017-10-26

申请号：US15137106

申请日：2016-04-25

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA

IPC: H05K1/18 ,  H05K1/02 ,  H01F1/03

CPC classification number: H05K1/182 ,  H01F1/0306 ,  H01F1/26 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/284 ,  H05K9/003 ,  H05K2201/083 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 1010Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 106Ω.

公开(公告)号：US20170309576A1

公开(公告)日：2017-10-26

申请号：US15464775

申请日：2017-03-21

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Toshio HAYAKAWA ,  Toshiro OKUBO

IPC: H01L23/552 ,  H01L21/78 ,  H01L23/31 ,  H01L21/3205 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05442 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2224/81

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed of a composite magnetic material obtained by dispersing magnetic fillers in a thermosetting resin material, the magnetic film covering upper and side surfaces of the molding resin and an edge portion of the front surface exposed to aside surface of the substrate; and a metal film connected to the power supply pattern and covering the molding resin through the magnetic film.

公开(公告)号：US20170294387A1

公开(公告)日：2017-10-12

申请号：US15381379

申请日：2016-12-16

Applicant: TDK Corporation

Inventor： Kenichi KAWABATA ,  Toshio HAYAKAWA ,  Toshiro OKUBO

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.

公开(公告)号：US20160008930A1

公开(公告)日：2016-01-14

申请号：US14862607

申请日：2015-09-23

Applicant: TDK CORPORATION

Inventor： Tsutomu YASUI ,  Hisayuki ABE ,  Kenichi KAWABATA ,  Tomoko KITAMURA

IPC: B23K35/26 ,  B23K35/30 ,  B23K35/02 ,  C22C13/00 ,  C22C19/03

CPC classification number: H05K3/3463 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3033 ,  C22C13/00 ,  C22C19/03 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K3/3484

Abstract: First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.

Abstract translation: 第一焊料是不含铅（Pb）的无铅焊料。 第一焊料包括至少含有Sn的第一金属; 以及含有至少Ni-Fe合金的第二金属。