公开(公告)号：US20180151374A1

公开(公告)日：2018-05-31

申请号：US15681436

申请日：2017-08-21

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Hsin-Hung Chou ,  Ming-Chih Tsai

IPC: H01L21/28 ,  H01L21/3213 ,  H01L29/49 ,  B81C1/00

Abstract: The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.

公开(公告)号：US11309267B2

公开(公告)日：2022-04-19

申请号：US16929109

申请日：2020-07-15

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu

IPC: H01L23/00

Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.

公开(公告)号：US20220020711A1

公开(公告)日：2022-01-20

申请号：US16929109

申请日：2020-07-15

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu

IPC: H01L23/00

Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.

公开(公告)号：US20210183764A1

公开(公告)日：2021-06-17

申请号：US16716521

申请日：2019-12-17

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/528 ,  H01L23/495 ,  H01L21/50

Abstract: A package structure and method of forming the same are provided. The package structure includes a die, a redistribution structure and a conductive pad. The redistribution structure is disposed on and electrically connected to the die. The redistribution structure includes a dielectric film, a conductive line, an adhesive layer and a conductive via. The dielectric film has a first surface and a second surface opposite to each other. The conductive line and the adhesive layer are located between the first surface of the dielectric film and the die. The conductive line is electrically connected to the die, and the adhesive layer laterally surrounds the conductive line. The conductive via penetrates through the dielectric film and the adhesive layer to electrically connect to the conductive line. The conductive pad is electrically connected to the die through the redistribution structure.

公开(公告)号：US20200350268A1

公开(公告)日：2020-11-05

申请号：US16398278

申请日：2019-04-30

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu ,  Chun-Hung Lin ,  Hsin-Hung Chou

IPC: H01L23/00

Abstract: A wire bonding structure and a method of manufacturing the same are provided. The wire bonding structure includes a bonding pad structure, a protection layer and a bonding wire. The bonding pad structure includes a bonding pad and a conductive layer. The bonding pad has an opening. The conductive layer is electrically connected to the bonding pad. At least a portion of the conductive layer is located in the opening of the bonding pad and laterally surrounded by the bonding pad. The protection layer at least covers a portion of a surface of the bonding pad structure. The bonding wire is bonded to the conductive layer of the bonding pad structure.

公开(公告)号：US10697919B2

公开(公告)日：2020-06-30

申请号：US15867724

申请日：2018-01-11

Applicant: Winbond Electronics Corp.

Inventor： Ming-Chih Tsai ,  Yu-Hsuan Ho ,  Yen-Jui Chu ,  Ming-Hung Hsieh

IPC: G01N27/12 ,  B41J2/04

Abstract: A reduction-oxidation sensor device and a manufacturing method thereof are provided. The reduction-oxidation sensor device includes a first electrode, at least one sensing structure and a second electrode. The first electrode is located on a substrate. The at least one sensing structure is located on the first electrode and the substrate. The at least one sensing structure includes a metal nanowire layer and a metal oxide layer. The metal nanowire layer is disposed on the first electrode and the substrate. The metal nanowire layer is wrapped by the metal oxide layer. The second electrode is located on the at least one sensing structure.

公开(公告)号：US10658320B1

公开(公告)日：2020-05-19

申请号：US16546293

申请日：2019-08-20

Applicant: Winbond Electronics Corp.

Inventor： Chun-Hung Lin ,  Yen-Jui Chu ,  Kao-Tsair Tsai

IPC: H01L23/00

Abstract: A semiconductor device is provided and includes a first pad and a second pad, a first conductive connector and a second conductive connector, a first conductive structure and a second conductive structure. The first conductive connector and the second conductive connector are disposed over the first pad and the second pad. The first conductive structure is electrically connected to the first pad and the first conductive connector, and includes a first portion, a second portion and a connecting portion connecting the first and second portions. The first portion and the second portion are not overlapped in a vertical direction, and the first portion, the connecting portion and the second portion are integrally formed. The second conductive structure is electrically connected to the second pad and the second conductive connector, wherein a portion of the second conductive structure is overlapped with the first conductive structure therebeneath in the vertical direction.

公开(公告)号：US11610857B2

公开(公告)日：2023-03-21

申请号：US17469868

申请日：2021-09-08

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng Wu ,  Yen-Jui Chu

IPC: H01L23/00

Abstract: Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.

公开(公告)号：US20220181282A1

公开(公告)日：2022-06-09

申请号：US17679122

申请日：2022-02-24

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu

IPC: H01L23/00

Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.

公开(公告)号：US11322438B2

公开(公告)日：2022-05-03

申请号：US17015012

申请日：2020-09-08

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Hsin-Hung Chou ,  Chun-Hung Lin

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/13 ,  H01L21/56 ,  H01L23/31

Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.