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    Devices with a single metal layer
    11.
    发明授权
    Devices with a single metal layer 有权

    公开(公告)号：US11127812B2

    公开(公告)日：2021-09-21

    申请号：US16579386

    申请日：2019-09-23

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  Carl Prevatte ,  Ronald S. Cok

    IPC: H01L27/32 ,  H01L27/146 ,  H01L27/15 ,  H01L25/075 ,  H01L33/62

    Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

    Devices with a single metal layer
    13.
    发明授权
    Devices with a single metal layer 有权

    公开(公告)号：US11374086B2

    公开(公告)日：2022-06-28

    申请号：US17405323

    申请日：2021-08-18

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  Carl Prevatte ,  Ronald S. Cok

    IPC: H01L27/32 ,  H01L27/15 ,  H01L27/146 ,  H01L25/075 ,  H01L33/62

    Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

    Chiplets with connection posts
    14.
    发明授权
    Chiplets with connection posts 有权

    公开(公告)号：US11276657B2

    公开(公告)日：2022-03-15

    申请号：US16543015

    申请日：2019-08-16

    Applicant: X Display Company Technology Limited

    Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

    IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

    Micro-transfer-printable flip-chip structures and methods
    16.
    发明授权
    Micro-transfer-printable flip-chip structures and methods 有权

    公开(公告)号：US10964583B2

    公开(公告)日：2021-03-30

    申请号：US16544737

    申请日：2019-08-19

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

    IPC: H01L21/683 ,  H01L23/00 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62

    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

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