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公开(公告)号：US20220093724A1
公开(公告)日：2022-03-24
申请号：US17487900
申请日：2021-09-28
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Alexander Meitl , Erich Radauscher , Ronald S. Cok
Abstract: A tiled display structure comprises a screen support having a screen emitter side and an opposing screen back side. A black matrix comprises a patterned layer of black-matrix material disposed on the screen back side, the pattern defining pixel openings that are substantially devoid of black-matrix material. An array of tiles comprises tiles each having a tile substrate and a plurality of pixels disposed in or on the tile substrate. Each pixel comprises one or more light emitters. The one or more light emitters are each disposed to emit light through a pixel opening in the black matrix. A substantially transparent adhesive layer adheres the array of tiles to the black-matrix material.
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公开(公告)号：US11164934B2
公开(公告)日：2021-11-02
申请号：US16808348
申请日：2020-03-03
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Alexander Meitl , Erich Radauscher , Ronald S. Cok
Abstract: A tiled display structure comprises a screen support having a screen emitter side and an opposing screen back side. A black matrix comprises a patterned layer of black-matrix material disposed on the screen back side, the pattern defining pixel openings that are substantially devoid of black-matrix material. An array of tiles comprises tiles each having a tile substrate and a plurality of pixels disposed in or on the tile substrate. Each pixel comprises one or more light emitters. The one or more light emitters are each disposed to emit light through a pixel opening in the black matrix. A substantially transparent adhesive layer adheres the array of tiles to the black-matrix material.
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公开(公告)号：US11088121B2
公开(公告)日：2021-08-10
申请号：US16806613
申请日：2020-03-02
Applicant: X Display Company Technology Limited
Inventor： Andrew Tyler Pearson , Erich Radauscher , Christopher Michael Verreen , Matthew Alexander Meitl , Christopher Andrew Bower , Ronald S. Cok
IPC: H01L25/075 , H01L33/62 , H01L23/538
Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.
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公开(公告)号：US11024608B2
公开(公告)日：2021-06-01
申请号：US16039191
申请日：2018-07-18
Applicant: X Display Company Technology Limited
Inventor： Matthew Meitl , Brook Raymond , Ronald S. Cok , Christopher Andrew Bower , Salvatore Bonafede , Erich Radauscher , Carl Ray Prevatte, Jr. , António José Marques Trindade , Tanya Yvette Moore
IPC: H01L25/075 , H01L33/00 , H01L33/62 , H01L21/683 , H01L25/00 , H01L25/04 , H01L25/07
Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.
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Patent Agency Ranking
公开(公告)号：US20200335380A1
公开(公告)日：2020-10-22
申请号：US16919072
申请日：2020-07-01
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Christopher Andrew Bower , Matthew Alexander Meitl , James O. Thostenson
IPC: H01L21/683 , H01L21/78 , H01L21/56 , H01L21/306 , H01L23/31 , H01L23/00 , H01L25/00 , H01L25/075 , G03F7/00 , H05K1/11 , B29C59/02
Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.
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公开(公告)号：US20240014129A1
公开(公告)日：2024-01-11
申请号：US18372977
申请日：2023-09-26
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Matthew Alexander Meitl , Christopher Andrew Bower , Christopher Michael Verreen , Erik Paul Vick
IPC: H01L23/525 , H01L23/544 , H01L23/528
CPC classification number: H01L23/5258 , H01L23/544 , H01L23/528 , H01L27/124
Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
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公开(公告)号：US11387153B2
公开(公告)日：2022-07-12
申请号：US17011796
申请日：2020-09-03
Applicant: X Display Company Technology Limited
Inventor： Ronald S. Cok , Erich Radauscher , Salvatore Bonafede , Christopher Andrew Bower , Matthew Alexander Meitl , Carl Ray Prevatte, Jr. , Brook Raymond
Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.
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公开(公告)号：US11189605B2
公开(公告)日：2021-11-30
申请号：US15908336
申请日：2018-02-28
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Meitl , Brook Raymond , Erich Radauscher
IPC: H01L25/16 , G02B27/01 , H01L25/075 , H01L33/62
Abstract: A transparent display comprises a display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. The display substrate is at least partially transparent. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area. The display wires are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. A bezel transparency in the bezel area is greater than or equal to a display transparency in the display area.
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公开(公告)号：US20200295120A1
公开(公告)日：2020-09-17
申请号：US16808348
申请日：2020-03-03
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Alexander Meitl , Erich Radauscher , Ronald S. Cok
Abstract: A tiled display structure comprises a screen support having a screen emitter side and an opposing screen back side. A black matrix comprises a patterned layer of black-matrix material disposed on the screen back side, the pattern defining pixel openings that are substantially devoid of black-matrix material. An array of tiles comprises tiles each having a tile substrate and a plurality of pixels disposed in or on the tile substrate. Each pixel comprises one or more light emitters. The one or more light emitters are each disposed to emit light through a pixel opening in the black matrix. A substantially transparent adhesive layer adheres the array of tiles to the black-matrix material.
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