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    SENSOR PACKAGE AND METHOD OF FORMING SAME
    12.
    发明申请
    SENSOR PACKAGE AND METHOD OF FORMING SAME 审中-公开
    传感器封装及其形成方法

    公开(公告)号：US20150048462A1

    公开(公告)日：2015-02-19

    申请号：US14527567

    申请日：2014-10-29

    Applicant: FREESCALE SEMICONDUCTOR, INC.

    Inventor： PHILIP H. BOWLES ,  PAIGE M. HOLM ,  STEPHEN R. HOOPER ,  RAYMOND M. ROOP

    IPC: B81B7/00

    CPC classification number: B81B7/0006 ,  B81B7/0077 ,  B81B2201/02 ,  B81C1/0023 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on an opposing side (40). The bonding perimeters (46) of the controller wafer (82) are bonded to corresponding bonding perimeters (36) of the sensor wafer (74) to form a stacked wafer structure (48) in which the control circuitry (42) faces outwardly. The controller wafer (82) is sawn to reveal bond pads (32) on the sensor wafer (74) which are wire bonded to corresponding bond pads (44) formed on the same side (38) of the wafer (82) as the control circuitry (42). The structure (48) is encapsulated in packaging material (62) and is singulated to produce the sensor packages (20).

    Abstract translation: 形成传感器封装（20）的方法（70）需要提供传感器晶片（74），传感器晶片（74）具有形成在位于通过接合周边（36）所描绘的区域（34）内的侧面（26）上的传感器（30），并且提供控制器 具有在一侧（38）处的控制电路（42）和在相对侧（40）上的接合周边（46）的晶片（82）。 控制器晶片（82）的接合周边（46）被接合到传感器晶片（74）的对应的接合周边（36），以形成其中控制电路（42）面向外的堆叠的晶片结构（48）。 锯切控制器晶片（82）以露出传感器晶片（74）上的接合焊盘（32），该接合焊盘被引线连接到形成在晶片（82）的同一侧（38）上的对应接合焊盘（44） 电路（42）。 结构（48）被封装在包装材料（62）中，并被分割以产生传感器封装（20）。

    MICRO ELECTRO-MECHANICAL STRAIN DISPLACEMENT SENSOR AND USAGE MONITORING SYSTEM
    14.
    发明公开
    MICRO ELECTRO-MECHANICAL STRAIN DISPLACEMENT SENSOR AND USAGE MONITORING SYSTEM 审中-公开

    公开(公告)号：US20240077369A1

    公开(公告)日：2024-03-07

    申请号：US18227440

    申请日：2023-07-28

    Applicant: IPR Innovative Products Resources, Inc.

    Inventor： Paul D OKULOV

    IPC: G01L1/00 ,  G01L1/04 ,  G01M5/00

    CPC classification number: G01L1/005 ,  G01L1/04 ,  G01L1/044 ,  G01M5/0033 ,  G01M5/0083 ,  B81B2201/02

    Abstract: A low power consumption multi-contact micro electro-mechanical strain/displacement sensor and miniature autonomous self-contained systems for recording of stress and usage history with direct output suitable for fatigue and load spectrum analysis are provided. In aerospace applications the system can assist in prediction of fatigue of a component subject to mechanical stresses as well as in harmonizing maintenance and overhauls intervals. In alternative applications, i.e. civil structures, general machinery, marine and submarine vessels, etc., the system can autonomously record strain history, strain spectrum or maximum values of the strain over a prolonged period of time using an internal power supply or a power supply combined with an energy harvesting device. The sensor is based on MEMS technology and incorporates a micro array of flexible micro or nano-size cantilevers. The system can have extremely low power consumption while maintaining precision and temperature/humidify independence.

    MEMS packaging structure and manufacturing method therefor
    16.
    发明授权
    MEMS packaging structure and manufacturing method therefor 有权

    公开(公告)号：US11667518B2

    公开(公告)日：2023-06-06

    申请号：US17419191

    申请日：2019-11-05

    Applicant: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)

    Inventor： Xiaoshan Qin

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0032 ,  B81C1/0023 ,  B81B2201/02 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/092 ,  B81C2203/0118 ,  B81C2203/0792

    Abstract: A micro-electro-mechanical system (MEMS) package structure and a method for fabricating the MEMS package structure. The MEMS package structure includes a MEMS die (200) and a device wafer (100). A control unit and an interconnection structure (300) are formed in the device wafer (100), and a first contact pad (410) and an input-output connecting member (420) are formed on a first bonding surface (100a) of the device wafer (100). The MEMS die (200) is coupled to the first bonding surface (100a) through a bonding layer (500). The MEMS die (200) includes a closed micro-cavity (220) and a second contact pad (220). The first contact pad (410) is electrically connected to a corresponding second contact pad (220). An opening (510) that exposes the input-output connecting member (420) is formed in the bonding layer (500). The MEMS package structure allows electrical interconnection between the MEMS die (200) and the device wafer (100) with a reduced package size, compared to those produced by existing integration techniques. In addition, function integration ability of the package structure is improved by integrating a plurality of MEMS dies of the same or different structures and functions on the same device wafer.

    Sensor
    17.
    发明授权
    Sensor 有权

    公开(公告)号：US11656110B2

    公开(公告)日：2023-05-23

    申请号：US17445933

    申请日：2021-08-25

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Hiroaki Yamazaki

    IPC: G01F1/684 ,  G01N27/22 ,  G01N27/04

    CPC classification number: G01F1/684 ,  G01F1/6845 ,  G01N27/045 ,  G01N27/221 ,  G01N27/226 ,  B81B2201/02 ,  B81B2203/04 ,  B81B2203/053 ,  B81B2203/058

    Abstract: According to one embodiment, a sensor includes a first member including a first member surface, and a first element part. The first element part includes a first fixed electrode fixed to the first member surface, and a first movable electrode facing the first fixed electrode. The first fixed electrode is along the first member surface. A gap is located between the first movable electrode and the first fixed electrode. The first movable electrode includes a first surface and a second surface. The first surface is between the first fixed electrode and the second surface. At least one of the first surface or the second surface is non-parallel to the first member surface.

    MEMS Device Mechanical Amplitude Control
    20.
    发明申请
    MEMS Device Mechanical Amplitude Control 有权
    MEMS器件机械振幅控制

    公开(公告)号：US20160349056A1

    公开(公告)日：2016-12-01

    申请号：US14723676

    申请日：2015-05-28

    Applicant: InvenSense, Inc.

    Inventor： Matthew J. Thompson ,  Ilya Gurin

    IPC: G01C19/5762

    CPC classification number: G01C19/5755 ,  B81B3/0018 ,  B81B2201/02

    Abstract: A system and/or method for utilizing mechanical motion limiters to control proof mass amplitude in MEMS devices (e.g., MEMS devices having resonant MEMS structures, for example various implementations of gyroscopes, magnetometers, accelerometers, etc.). As a non-limiting example, amplitude control for a MEMS gyroscope proof mass may be accomplished during normal (e.g., steady state) gyroscope operation utilizing impact stops (e.g., bump stops) of various designs. As another non-limiting example, amplitude control for a MEMS gyroscope proof mass may be accomplished utilizing non-impact limiters (e.g., springs) of various designs, for example springs exhibiting non-linear stiffness characteristics through at least a portion of their normal range of operation.

    Abstract translation: 用于利用机械运动限制器来控制MEMS装置（例如，具有共振MEMS结构的MEMS装置，例如陀螺仪，磁力计，加速度计等的各种实现方式）中的质量幅度的系统和/或方法。 作为非限制性示例，可以在利用各种设计的冲击停止（例如，止动停止）的正常（例如，稳态）陀螺仪操作期间完成用于MEMS陀螺仪检测质量块的幅度控制。 作为另一个非限制性示例，可以使用各种设计的非冲击限制器（例如，弹簧）来实现用于MEMS陀螺仪检测质量块的幅度控制，例如通过其正常范围的至少一部分呈现非线性刚度特性的弹簧 的操作。

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