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公开(公告)号：US20230062556A1
公开(公告)日：2023-03-02
申请号：US17412887
申请日：2021-08-26
Applicant: Knowles Electronics, LLC
Inventor： Michael Kuntzman , Ken Deng , Faisal Zaman , Bing Yu , Vahid Naderyan , Peter V. Loeppert
IPC: B81B7/00
Abstract: A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.
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公开(公告)号：US10939214B2
公开(公告)日：2021-03-02
申请号：US16593263
申请日：2019-10-04
Applicant: KNOWLES ELECTRONICS, LLC
Inventor： Michael Kuntzman , Michael Pedersen , Sung Bok Lee , Bing Yu , Vahid Naderyan , Peter Loeppert
Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.
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公开(公告)号：US11206494B2
公开(公告)日：2021-12-21
申请号：US16593381
申请日：2019-10-04
Applicant: KNOWLES ELECTRONICS, LLC
Inventor： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Wade Conklin , Peter Loeppert
Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.
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公开(公告)号：US20240208800A1
公开(公告)日：2024-06-27
申请号：US18087602
申请日：2022-12-22
Applicant: Knowles Electronics, LLC
Inventor： Ken Deng , Bing Yu , Michael Pedersen , Nicholas Palcheck , Jeremy Johnson , Richard Li-Chen Chen
CPC classification number: B81B3/0013 , B81C1/00111 , B81B2201/02 , B81B2203/0361 , B81B2203/0376 , B81C2201/0174
Abstract: A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.
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公开(公告)号：US11617042B2
公开(公告)日：2023-03-28
申请号：US17159983
申请日：2021-01-27
Applicant: KNOWLES ELECTRONICS, LLC
Inventor： Michael Kuntzman , Michael Pedersen , Sung Bok Lee , Bing Yu , Vahid Naderyan , Peter Loeppert
Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals, comprises a first diaphragm having a first corrugation formed therein. A second diaphragm has a second corrugation formed therein, and is spaced apart from the first diaphragm such that a cavity having a pressure lower than atmospheric pressure is formed therebetween. A back plate is disposed between the first diaphragm and the second diaphragm. One or more posts extend from at least one of the first diaphragm or the second diaphragm towards the other through the back plate. The one or more posts prevent each of the first diaphragm and the second diaphragm from contacting the back plate due to movement of the first diaphragm and/or the second diaphragm towards the back plate. Each of the first corrugation and the second corrugation protrude outwardly from the first diaphragm and the second diaphragm, respectively, away from the back plate.
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Patent Agency Ranking
公开(公告)号：US11772961B2
公开(公告)日：2023-10-03
申请号：US17412887
申请日：2021-08-26
Applicant: Knowles Electronics, LLC
Inventor： Michael Kuntzman , Ken Deng , Faisal Zaman , Bing Yu , Vahid Naderyan , Peter V. Loeppert
IPC: B81B7/00
CPC classification number: B81B7/0041 , B81B2201/0257 , B81B2203/0127 , B81B2203/0353 , B81B2207/093
Abstract: A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.
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公开(公告)号：US11787688B2
公开(公告)日：2023-10-17
申请号：US17099442
申请日：2020-11-16
Applicant: KNOWLES ELECTRONICS, LLC
Inventor： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Michael Pedersen
CPC classification number: B81C1/00158 , B81B3/0021 , G01L9/0042 , H04R31/003 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C2201/0132 , B81C2201/0133
Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.
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公开(公告)号：US11671766B2
公开(公告)日：2023-06-06
申请号：US17531229
申请日：2021-11-19
Applicant: KNOWLES ELECTRONICS, LLC
Inventor： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Wade Conklin , Peter Loeppert
IPC: H04R25/00 , H04R19/04 , H04R7/18 , H04R7/06 , B81B3/00 , B81B7/00 , H04R1/04 , H04R3/00 , H04R7/10
CPC classification number: H04R19/04 , B81B3/0072 , B81B7/0025 , H04R1/04 , H04R3/00 , H04R7/06 , H04R7/10 , H04R7/18 , B81B2201/0257 , B81B2203/019 , B81B2203/0127 , B81B2207/012 , H04R2201/003
Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.
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公开(公告)号：US11477555B2
公开(公告)日：2022-10-18
申请号：US17081628
申请日：2020-10-27
Applicant: Knowles Electronics, LLC
Inventor： Michael Kuntzman , Sung B. Lee , Vahid Naderyan , Yunfei Ma , Bing Yu
IPC: H04R1/08
Abstract: An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.
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公开(公告)号：US20210136475A1
公开(公告)日：2021-05-06
申请号：US17081628
申请日：2020-10-27
Applicant: Knowles Electronics, LLC
Inventor： Michael Kuntzman , Sung B. Lee , Vahid Naderyan , Yunfei Ma , Bing Yu
IPC: H04R1/08
Abstract: An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.
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